Patents by Inventor Sheng-An KUO

Sheng-An KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170339
    Abstract: In a method of manufacturing a semiconductor device, an n-type source/drain epitaxial layer and a p-type source/drain epitaxial layer respectively formed, a dielectric layer is formed over the n-type source/drain epitaxial layer and the p-type source/drain epitaxial layer, a first opening is formed in the dielectric layer to expose a part of the n-type source/drain epitaxial layer and a second opening is formed in the dielectric layer to expose a part of the p-type source/drain epitaxial layer, and the n-type source/drain epitaxial layer and the p-type source/drain epitaxial layer respectively recessed. A recessing amount of the n-type source/drain epitaxial layer is different from a recessing amount of the p-type source/drain epitaxial layer.
    Type: Application
    Filed: March 2, 2023
    Publication date: May 23, 2024
    Inventors: Te-Chih Hsiung, Yun-Hua Chen, Yang-Cheng Wu, Sheng-Hsun Fu, Wen-Kuo Hsieh, Chih-Yuan Ting, Huan-Just Lin, Bing-Sian Wu, Yi-Hsuan Chiu
  • Publication number: 20240164569
    Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a layered drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container, so as to automatically form a layered drink/gradient drink having at least two color layers within the beverage container.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 23, 2024
    Applicant: Botrista Technology, Inc.
    Inventors: Yung-Hsiang CHANG, Wu-Chou KUO, Kuan-Chang PAN, Kai-Chung HSU, Jhih-Sheng JHANG
  • Publication number: 20240166486
    Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a sparkling drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container in order, so as to automatically form a sparkling drink/aerated drink with a predetermined flavor within the beverage container.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 23, 2024
    Applicant: Botrista Technology, Inc.
    Inventors: Yung-Hsiang CHANG, Wu-Chou KUO, Kuan-Chang PAN, Kai-Chung HSU, Jhih-Sheng JHANG
  • Patent number: 11989424
    Abstract: The invention discloses a digital signature system. The digital signature system comprises an electronic device and a data storage device. The electronic device generates a specific data by executing a specific operation, and calculates the specific data via a hash algorithm to generate a hash data. The data storage device comprises a controller, a plurality of flash memories, and a data transmission interface. The electronic device transmits the hash data to the data storage device via the transmission interface. The controller comprises a firmware. The firmware reads an unclonable function, and generates a private key according to the unclonable function, and encrypts the hash data by the private key to obtain a digital signature. The data storage device transmits the digital signature to the electronic device via the transmission interface.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: May 21, 2024
    Assignee: INNODISK CORPORATION
    Inventors: Ming-Sheng Chen, Chin-Chung Kuo
  • Patent number: 11976018
    Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 7, 2024
    Assignee: DAXIN MATERIALS CORP.
    Inventors: Kai-Sheng Jeng, Yuan-Li Liao, You-Ming Chen, Yu-Ying Kuo, Shao-Chi Cheng
  • Publication number: 20240145498
    Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.
    Type: Application
    Filed: January 4, 2023
    Publication date: May 2, 2024
    Inventors: Hao-Lin Yang, Fu-Sheng Kuo, Ching-Chun Wang, Hsiao-Hui Tseng, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung
  • Publication number: 20240133716
    Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.
    Type: Application
    Filed: January 13, 2023
    Publication date: April 25, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lu-Pu LIAO, Yu-Sheng LIN, Liang-Ying LIU, Chin-Fu KUO
  • Publication number: 20240119283
    Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jui-Yang Hsu, Cheng-Sheng Chan, Jen-Chieh Tsai, Huai-Ting Li, Bo-Yu Kuo, Yen-Hao Chen, Kai-Ling Huang, Ping-Yuan Tseng, Tao Tu, Sheng-Je Hung
  • Patent number: 11945885
    Abstract: A vinyl-containing copolymer is copolymerized from (a) first compound, (b) second compound, and (c) third compound. (a) First compound is an aromatic compound having a single vinyl group. (b) Second compound is polybutadiene or polybutadiene-styrene having side vinyl groups. (c) Third compound is an acrylate compound. The vinyl-containing copolymer includes 0.003 mol/g to 0.010 mol/g of benzene ring, 0.0005 mol/g to 0.008 mol/g of vinyl group, and 1.2*10?5 mol/g to 2.4*10?4 mol/g of ester group.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: April 2, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Po Kuo, Shin-Liang Kuo, Shu-Chuan Huang, Yan-Ting Jiang, Jian-Yi Hang, Wen-Sheng Chang
  • Publication number: 20240105550
    Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 28, 2024
    Inventors: Tung-Liang Shao, Yu-Sheng Huang, Hung-Yi Kuo, Chen-Hua Yu
  • Patent number: 11937152
    Abstract: A tracking device is described. The tracking device receives, from a management server, pressure measurement thresholds. The tracking device monitors pressure measurements of the asset. Based on the pressure measurements, the tracking device enters an active mode of operation. When operating in the active mode of operation, the tracking device transmits sensor measurements of the asset to the management server. The tracking device determines new pressure measurements of the asset. Based on the new pressure measurements, the tracking device enters a passive mode of operation. When operating in the passive mode of operation, no data is transmitted or received from/to the tracking device to/from the management server.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 19, 2024
    Assignee: Samsara Inc.
    Inventors: Hadi Hajimiri, Rishabh Gupta, Ye-Sheng Kuo, Kenneth Lee, Siri Amrit Ramos, Justin Tingao Xiao, Pete Nicholas Chulick, Gautam Ravi Ramaswamy
  • Patent number: 11931392
    Abstract: A use of Magnolia figo extract in the manufacture of a compound for inhibiting growth of lung cancer cells.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: March 19, 2024
    Inventor: Chun-Sheng Kuo
  • Patent number: 11936418
    Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 19, 2024
    Assignee: KAIKUTEK INC.
    Inventors: Mike Chun-Hung Wang, Chun-Hsuan Kuo, Mohammad Athar Khalil, Wen-Sheng Cheng, Chen-Lun Lin, Chin-Wei Kuo, Ming Wei Kung, Khoi Duc Le
  • Publication number: 20240083981
    Abstract: The present invention relates to the treatment of herpes simplex virus (HSV) infection using an anti-HSV antibody. In particular, the anti-HSV antibody specifically binds to the glycoprotein D (gD) of herpes simplex virus-1 (HSV-1) and herpes simplex virus-2 (HSV-2). The treatment of the present invention is effective against drug-resistant and/or recurrent HSV infection.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 14, 2024
    Applicant: United BioPharma, Inc.
    Inventors: Be-Sheng KUO, Chao-Hung LI, Hsiao-Yun SHAO, Yaw-Jen LIU, Shugene LYNN, Chang Yi WANG
  • Publication number: 20240084040
    Abstract: The present invention provides antibody or the antigen-binding portion thereof bind to carbohydrate antigen, such as Globo series antigens (e.g. Globo H, SSEA-4 or SSEA-3). Also disclosed herein are pharmaceutical compositions and methods for the inhibition of cancer cells in a subject in need thereof. The pharmaceutical compositions comprise an antibody or an antigen-binding portion thereof and at least one pharmaceutically acceptable carrier.
    Type: Application
    Filed: February 9, 2022
    Publication date: March 14, 2024
    Inventors: Jiann-Shiun LAI, Hui-Wen CHANG, Yin-Chieh KUO, Chi-Sheng HSIA, Woan Eng CHAN, Ming-Tain LAI
  • Patent number: 11929273
    Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Guan-Wei Huang, Ping-Yung Yen, Hsuan Lee, Jiun-Rong Pai
  • Publication number: 20240079270
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Publication number: 20240071722
    Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Sheng-Liang Pan, Bing-Hung Chen, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang, Jack Kuo-Ping Kuo
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Patent number: 11851224
    Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin, Shine Chen