Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A p-GaN high-electron-mobility transistor (HEMT) includes a buffer layer stacked on a substrate, a channel layer stacked on the buffer layer, a supply layer stacked on the channel layer, a doped layer stacked on the supply layer, and a hydrogen barrier layer covering the supply layer and the doped layer. A source and a drain are electrically connected to the channel layer and the supply layer, respectively. A gate is located on the doped layer. The hydrogen barrier layer is doped with fluorine.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a memory cell overlying a substrate and comprising a top electrode. A sidewall spacer structure is disposed along sidewalls of the memory cell. The sidewall spacer structure comprises a first spacer layer on the memory cell, a second spacer layer around the first spacer layer, and a third spacer layer around the second spacer layer. The second spacer layer comprises a lateral segment adjacent to a vertical segment. The lateral segment abuts the top electrode and has a top surface aligned with or disposed below a top surface of the top electrode. A first conductive structure overlies the memory cell and contacts the lateral segment and the top electrode.

Abstract: An electronic device includes a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. A wirebonding method includes bonding the first end of the conductive bond wire to the first conductive plate includes forming a ball bond to join the first end of the conductive bond wire to a planar side of the first conductive plate by a ball bond, and bonding the second end of the conductive bond wire to the conductive stud bump includes forming a stitch bond to join the second end of the conductive bond wire to the conductive stud bump.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.

Abstract: A manufacturing method of an embossment structure formed in a mold in the present invention is applicable to plastic or metallic in-mold shaping products, such as computers, communication products, consumer electronic products, electrical appliances, parts of machines and instruments or common household products. A base layer provided with embossment structure or tri-dimensional ornament and a separable layer is stably fixed in a shaping mold by making use of absorption mode of the shaping mold. After shaped completely, the base layer on the surface of the in-mold shaping product is torn off to present delicate tri-dimensional embossed streaks on the surface of the in-mold shaping product, which is designed according to personalization or individuation, able to lower cost and increase external beauty of the in-mold shaping product and conform to economic gain.

Abstract: A self adhesive type radio frequency anti-counterfeiting and anti-reclamation label includes a self-adhesive label provided with characters or patterns and has its inner surface formed with a gluing layer. A radio frequency identification system is installed at the outer side of the gluing layer and provided with a foundation plate mounted with a radio frequency chip and an antenna serving as a passive source signals sent out by the identification chip. A tearing region is formed between the label and the radio frequency identification system for receiving therein the radio frequency identification system, the antenna or the identification chip. The label can be torn up, or the tearing region can be torn off manually to separate the label from the radio frequency identification system, or separate the identification chip from the antenna, letting the original label impossible to be recycled for attaining an objective of anti-counterfeiting.

Abstract: A positioning structure of an object to be coated and its manufacturing method in the present invention is first to have a supporting-positioning member with projections provided at the outer surface of the object to be coated, a restricting-positioning ring mounted at the boundary of a coating range and an induction-identification device installed within the coating range. Then, the object to be coated is positioned in the male mold of a shaping mold and an in-mold shaping label is in advance set in the female mold of the shaping mold and lastly, the male mold and the female mold are combined together and fluid thermal plastic is poured into the shaping mold. Thus, the object to be coated and the outer surface of the induction-identification device can be completely coated with a plastic layer and simultaneously, the plastic layer will be integrally formed with the in-mold shaping label.

Abstract: Anti-counterfeit and anti-theft buttons include at least a body embedded with a RFID system containing one or plural RFID chips. Each RFID chip may be of a single or double or multiple frequencies. If the single frequency is used, it may be a high frequency (HF) or an ultrahigh frequency (UHF). If the double frequencies are used, they may be any composition of HF and UHF. If the multiple frequencies are used, they may be a single HF and plural UHF, or plural HF and single UHF. The RFID chip is jointed with an antenna that may be of a single or multiple circuits and should have an extended antenna. All antennas can enhance effects of receiving signals. When two of these buttons fitted together are illegally separated, a system host may operate to give out warning signals or sound, achieving counterfeit and theft prevention.

Abstract: A manufacturing method and structure of having a porcelain or glass product formed integrally with a label in a mold includes a male mold, a first female mold and a second female mold. After the first female mold is combined with the male mold, plastics is injected to form a soft mold sleeve on the male mold and then a porcelain or glass product is fitted on the soft mold sleeve. After the second female mold is combined with the male mold, plastics is injected to form a plastic layer on the outer surface of the product and then, a radio frequency identification chip is provided between the product and the plastic layer or a label is positioned in the mold cavity of the second female mold, which is combined with the male mold. Then plastic is injected to form a plastic layer covered on the surface of the product and combined with the label integrally.

Abstract: An in-mold shaping structure for radio frequency identification includes a substratum formed in advance. The substratum can be the same as or different from a plastic product in material and is a membrane, a sheet, a foam sheet or a composite plate, having its circumferential edge provided with positioning lugs for accurately combining the substratum with a plastic product. A radio frequency identification label is composed of a radio frequency identification chipset, an antenna and a gluey surface to be stuck to one side of the substratum for making a RFID label containing the substratum and the radio frequency identification label. A plastic product can be combined with the RFID label when shaped, letting the RFID label sheathed by the plastic product to avoid being destroyed. Thus, the RFID label can be attached to plastic products for enhancing the value of the plastic products.

Abstract: A container cap having identification function and its manufacturing method includes a cap and a radio frequency identification label provided with a radio frequency identification system and an antenna with extension antennas. The cap has a top wall formed with an extending-down circumferential surface having its under side disposed with a positioning circumference. A method for manufacturing such a container cap is to have the label combined with a male mold of a cap-shaping mold in advance to let the main body of the label combined with the inner side of the top wall of the cap, and the extension portion of the label combined with the circumferential surface and extended to the positioning circumference of the cap. When the container cap is turned open, parts of the extension antennas will be broken off for blocking or sending forth radio frequency identification signals, thus producing efficacies of anti-counterfeiting and anti-theft.

Abstract: Simple multifunctional identification labels and their manufacturing method includes a basic plate formed with an outer surface and an inner surface, and plural radio frequency identification systems are respectively provided with circuits and radio frequency identification chips. The radio frequency identification systems are installed on the outer surface of the basic plate to make up plural identification labels, which are then cut and shaped into many individual simple multifunctional identification labels, quick in manufacturing. The simple multifunctional identification labels of this invention can be directly used as articles and needless to be additionally combined with other articles, able to elevate the practicability of the identification labels.

Abstract: An IC layers separator includes a bed; two sets of two opposite seats secured onto the bed; two guide bars each interconnecting the two opposite seats of either set; a carrier assembly secured onto the bed and including a lower vacuum device and an upper vacuum device including a ramp at one end; an IC layer assembly including an upper layer and a lower layer; and a blade assembly moveably mounted on the guide bars and including a pressing roller pressing the IC layer assembly on the ramp, a spring biased blade for separating the upper layer from the lower layer, and two opposite rolls for conveying the separated upper layer and the lower layer.

Abstract: A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

Abstract: A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

Abstract: A contact probe assembly, for placement within a probe receptacle for performing tests on an electrical device, includes the following elements. The hollow barrel has two openings at two opposite ends thereof, wherein the hollow barrel is adapted to be axially disposed within the probe receptacle. The first plunger is slidably disposed within one of the two openings at one end of the hollow barrel. The second plunger is slidably disposed within the other of the two openings at the opposite end of the hollow barrel. The resilient member is disposed within the hollow barrel and interconnected between the first plunger and second plunger, wherein the first plunger, the resilient member and the second plunger are formed as single one unitary member and made of the same electrically-conductive material.

Abstract: A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

Abstract: A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

Abstract: A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.