Patents by Inventor Sheng-feng Chung
Sheng-feng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11672108Abstract: A method for manufacturing an electromagnetic shielding film of reduced thickness and a simplified manufacturing process includes forming a conductive ink layer by inkjet printing, on a component to be shielded, forming an insulative ink layer on the conductive ink layer by inkjet printing, and sintering the conductive ink layer and the insulative ink layer to form an electromagnetic shielding layer and an insulative layer, thereby obtaining the electromagnetic shielding film.Type: GrantFiled: August 18, 2020Date of Patent: June 6, 2023Assignee: Zhen Ding Technology Co., Ltd.Inventors: Sheng-Feng Chung, Chi-Fei Huang, Chen-Feng Yen
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Publication number: 20230159749Abstract: A stretchable electroconductive material includes 100 parts by weight of PEDOT-PSS, 200 parts to 1000 parts by weight of a repair linking agent, 15 parts to 300 parts by weight of an ionic liquid plasticizer, and 15 parts to 200 parts by weight of carbon material particles. The repair linking agent is selected from a group consisting of polyethylene glycol and polyethylene oxide, and any combination thereof. The repair linking agent, the ionic liquid plasticizer, and the carbon material particles are doped in the PEDOT-PSS. A method for manufacturing the stretchable electroconductive material and a device using the stretchable electroconductive material are also provided.Type: ApplicationFiled: November 29, 2021Publication date: May 25, 2023Inventors: SHENG-FENG CHUNG, CHI-FEI HUANG
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Publication number: 20230116312Abstract: The present invention provides a multi-die package including main die, a memory die, a first set of pins and a second set of pins. The main die includes a memory controller, a first set of pads, a second set of pads and a third set of pads. The memory die is coupled to the first set of pads and the second set of pads of the main die. The first set of pins is coupled to the third set of pads of the main die. The second set of pins is coupled to the second set of pads of the main die. The memory controller accesses the memory die through the first set of pads and the second set of pads, and the memory controller accesses a memory chip external to the multi-die package through the second set of pads and the third set of pads.Type: ApplicationFiled: September 28, 2022Publication date: April 13, 2023Applicant: Realtek Semiconductor Corp.Inventor: Sheng-Feng Chung
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Patent number: 11602921Abstract: A composite fabric which is elastic and conductive and thus able to detect a user's limb and body movements includes a fabric layer and an elastic conductive layer of elastomer and conductive filler formed on the fabric layer. A resistance value and a strain increments of the fabric satisfy a relationship of RT=R+n? or RT=R+m en?, wherein ? denotes the strain increment, R denotes the resistance value when the strain increment is 0, and RT denotes the resistance value when deformed through the increments. The m and n are coefficients, being a whole number or a fraction. A user can immediately detect and know the movements of his limbs according to the resistance value of the elastic conductive composite fabric.Type: GrantFiled: July 15, 2019Date of Patent: March 14, 2023Assignee: Zhen Ding Technology Co., Ltd.Inventors: Chi-Fei Huang, Sheng-Feng Chung, Shou-Jui Hsiang
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Patent number: 11424206Abstract: A chip package module is provided. The chip package module includes a package substrate, a chip, and a conductive connector assembly. The chip having a first surface and a second surface opposite thereto is disposed on the package substrate. The first surface is divided into a first region, a second region, and a third region, and the second region is located between the first and third regions. The chip includes a flip-chip pad group disposed in the first region, a wire-bonding pad group disposed in the third region, and a signal pad group disposed in the second region. The conductive connector assembly is electrically connected between the chip and the package substrate. One of the flip-chip pad group and the wire-bonding pad group is electrically and physically connected to the conductive connector assembly, and the other one is not physically connected to the conductive connector assembly.Type: GrantFiled: May 18, 2020Date of Patent: August 23, 2022Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Sheng-Feng Chung, Cheng-Lun Chu
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Publication number: 20220039303Abstract: A method for manufacturing an electromagnetic shielding film of reduced thickness and a simplified manufacturing process includes forming a conductive ink layer by inkjet printing, on a component to be shielded, forming an insulative ink layer on the conductive ink layer by inkjet printing, and sintering the conductive ink layer and the insulative ink layer to form an electromagnetic shielding layer and an insulative layer, thereby obtaining the electromagnetic shielding film.Type: ApplicationFiled: August 18, 2020Publication date: February 3, 2022Inventors: SHENG-FENG CHUNG, CHI-FEI HUANG, CHEN-FENG YEN
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Publication number: 20210348012Abstract: A conductive ink able to be stretched without significant increase of the resistance includes a flexible resin, a plurality of plastic particles, and a conductive agent. The plastic particles and the conductive agent are mixed in the flexible resin. The conductive agent includes at least one conductive carbon material selected from a group consisting of conductive carbon black and carbon nanotube, and a mass ratio of the conductive carbon material in the conductive ink is in a range from 20% to 40%.Type: ApplicationFiled: July 24, 2020Publication date: November 11, 2021Inventors: LING-LUNG SU, SHENG-FENG CHUNG
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Publication number: 20210104480Abstract: A chip package module is provided. The chip package module includes a package substrate, a chip, and a conductive connector assembly. The chip having a first surface and a second surface opposite thereto is disposed on the package substrate. The first surface is divided into a first region, a second region, and a third region, and the second region is located between the first and third regions. The chip includes a flip-chip pad group disposed in the first region, a wire-bonding pad group disposed in the third region, and a signal pad group disposed in the second region. The conductive connector assembly is electrically connected between the chip and the package substrate. One of the flip-chip pad group and the wire-bonding pad group is electrically and physically connected to the conductive connector assembly, and the other one is not physically connected to the conductive connector assembly.Type: ApplicationFiled: May 18, 2020Publication date: April 8, 2021Inventors: SHENG-FENG CHUNG, CHENG-LUN CHU
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Publication number: 20210092840Abstract: A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.Type: ApplicationFiled: November 14, 2019Publication date: March 25, 2021Inventors: SHENG-FENG CHUNG, CHEN-FENG YEN, BO-HONG ZHOU
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Publication number: 20200338868Abstract: A composite fabric which is elastic and conductive and thus able to detect a user's limb and body movements includes a fabric layer and an elastic conductive layer of elastomer and conductive filler formed on the fabric layer. A resistance value and a strain increments of the fabric satisfy a relationship of RT=R+n? or RT=R+m en?, wherein ? denotes the strain increment, R denotes the resistance value when the strain increment is 0, and RT denotes the resistance value when deformed through the increments. The m and n are coefficients, being a whole number or a fraction. A user can immediately detect and know the movements of his limbs according to the resistance value of the elastic conductive composite fabric.Type: ApplicationFiled: July 15, 2019Publication date: October 29, 2020Inventors: CHI-FEI HUANG, SHENG-FENG CHUNG, SHOU-JUI HSIANG
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Patent number: 10001889Abstract: A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.Type: GrantFiled: October 30, 2015Date of Patent: June 19, 2018Assignee: Industrial Technology Research InstituteInventors: Heng-Tien Lin, Chun-Ting Liu, Shu-Yi Chang, Su-Tsai Lu, Kuo-Hua Tseng, Sheng-Feng Chung, Chen-Kun Chen
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Patent number: 9921699Abstract: In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.Type: GrantFiled: November 11, 2015Date of Patent: March 20, 2018Assignee: Industrial Technology Research InstituteInventors: Sheng-Feng Chung, Chun-Ting Liu, Su-Tsai Lu
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Patent number: 9811222Abstract: A sensing structure includes a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.Type: GrantFiled: July 17, 2015Date of Patent: November 7, 2017Assignee: Industrial Technology Research InstituteInventors: Bao-Shun Yau, Sheng-Feng Chung, Su-Tsai Lu, Yu-Ling Hsieh, Cheng-Yi Shih, Shu-Yi Chang, Kuo-Hua Tseng, Heng-Tien Lin
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Patent number: 9579878Abstract: A gravure printing system is provided. The gravure printing system includes a plate cylinder, an ink source, a cover blade, and a doctor blade. The plate cylinder has a circumferential surface with at least one groove. The ink source is adapted to provider an ink onto the circumferential surface of the plate cylinder. The cover blade is adapted to form an anti-drying layer on the plate cylinder from the ink. The doctor blade is adapted to contact the plate cylinder and fill the at least one groove with the ink. A point on the circumferential surface sequentially passes by the ink source, the cover blade, and the doctor blade as the plate cylinder rotates. A Young's modulus of a material of the cover blade is less than a Young's modulus of a material of the doctor blade. A method of using the gravure printing system is also provided.Type: GrantFiled: October 30, 2015Date of Patent: February 28, 2017Assignee: Industrial Technology Research InstituteInventors: Sheng-Feng Chung, Cheng-Yi Shih, Shu-Yi Chang, Yu-Jie Wei, Shih-Ming Lin, Su-Tsai Lu
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Patent number: 9448672Abstract: A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.Type: GrantFiled: December 20, 2013Date of Patent: September 20, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Feng Chung, Cheng-Yi Shih, Shu-Yi Chang, Su-Tsai Lu
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Patent number: 9395072Abstract: An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.Type: GrantFiled: August 5, 2015Date of Patent: July 19, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Su-Tsai Lu, Wen-Yung Yeh, Sheng-Feng Chung, Bao-Shun Yau, Chen-Kun Chen, Yi-Ming Chang
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Publication number: 20160139709Abstract: In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.Type: ApplicationFiled: November 11, 2015Publication date: May 19, 2016Inventors: Sheng-Feng Chung, Chun-Ting Liu, Su-Tsai Lu
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Publication number: 20160132153Abstract: A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.Type: ApplicationFiled: October 30, 2015Publication date: May 12, 2016Inventors: Heng-Tien Lin, Chun-Ting Liu, Shu-Yi Chang, Su-Tsai Lu, Kuo-Hua Tseng, Sheng-Feng Chung, Chen-Kun Chen
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Publication number: 20160018348Abstract: Disclosed is a sensing structure including a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.Type: ApplicationFiled: July 17, 2015Publication date: January 21, 2016Inventors: Bao-Shun Yau, Sheng-Feng Chung, Su-Tsai Lu, Yu-Ling Hsieh, Cheng-Yi Shih, Shu-Yi Chang, Kuo-Hua Tseng, Heng-Tien Lin
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Publication number: 20150338078Abstract: An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.Type: ApplicationFiled: August 5, 2015Publication date: November 26, 2015Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Su-Tsai LU, Wen-Yung YEH, Sheng-Feng CHUNG, Bao-Shun YAU, Chen-Kun CHEN, Yi-Ming CHANG