Abstract: A sound localization system includes a multi-mic sound collector and a computing device. The multi-mic sound collector includes a carrier and a plurality of sound receivers removably attached to the sound receivers. The computing device includes a data communicator, a synchronizer, and a processor. The data communicator receives preprocessed audio data from the multi-mic sound collector. The synchronizer synchronizes the preprocessed audio data. The processor analyzes the synchronized audio data to identify and localize a target audio feature. A sound localization method of the sound localization system is also provided. The present invention facilitates monitoring of the functioning or physiological signs of a monitored subject and allows early detection and diagnosis of abnormalities or diseases.

Abstract: A sound localization system includes a multi-mic sound collector and a computing device. The multi-mic sound collector includes a carrier and a plurality of sound receivers removably attached to the sound receivers. The computing device includes a data communicator, a synchronizer, and a processor. The data communicator receives preprocessed audio data from the multi-mic sound collector. The synchronizer synchronizes the preprocessed audio data. The processor analyzes the synchronized audio data to identify and localize a target audio feature. A sound localization method of the sound localization system is also provided. The present invention facilitates monitoring of the functioning or physiological signs of a monitored subject and allows early detection and diagnosis of abnormalities or diseases.

Abstract: A solid state lighting source illumination device comprising a bracket and at least one solid state lighting source module. The solid state lighting source module comprises a substrate and at least one solid state lighting source. The substrate is set up with circuit and the solid state lighting source is set up on the substrate, and the electrode of the solid state lighting source is electrically connecting with the circuit on the substrate. The substrate and the bracket further comprise a heat dissipation structure which is a space between the substrate and a base of the bracket and through holes in the substrate near the solid state lighting source.

Abstract: An LED displaying device includes a first transparent substrate, LEDs and a second transparent substrate. The first transparent substrate includes a circuit structure formed thereon. The LEDs are mounted on the first transparent substrate and electrically connected to the circuit structure. The second transparent substrate is covered on the LEDs.

Abstract: A discharge circuit includes an OC (Optical Coupler), a capacitor, an NPN-type transistor, and a discharge unit. The discharge circuit is parallel connected to a PFC (power factor corrector) circuit which includes a filter capacitor. The discharge unit has a MOSFET and a discharge resistor. A drain of the MOSFET is connected to a first terminal of the PFC circuit via the discharge resistor, a gate thereof is connected the anode of the capacitor, and a source thereof is connected to ground.

Abstract: A light emitting diode lamp includes a lamp rack and a light emitting module mounted on the lamp rack. The ling emitting module includes a printed circuit board and a plurality of LEDs attached to the printed circuit board. The LEDs are arranged in an array. Each of the LEDs has a width W. Each of the LEDs spaces from an adjoining LED with a distance D. The width W and the distance D are in the condition that 0.5>W/D>0.15.

Abstract: A light emitting diode lamp includes a lamp rack and a light emitting module mounted on the lamp rack. The ling emitting module includes a printed circuit board and a plurality of LEDs attached to the printed circuit board. The LEDs are arranged in an array. Each of the LEDs has a width W. Each of the LEDs spaces from an adjoining LED with a distance D. The width W and the distance D are in the condition that 0.5>W/D>0.15.

Abstract: An alternating current LED illumination apparatus includes a heat dissipation plate, a plurality of LED chips arranged on the heat dissipation plate, a circuit layer, an encapsulation, two electrodes located on the heat dissipation plate and exposed out of the encapsulation, and a driving element. The LED chips are thermally connected with the heat dissipation plate, and at least two of the LED chips are connected in anti-parallel. The encapsulation covers the LED chips and at least part of the circuit layer. The driving element comprises a transformer and a switch. The transformer has an input terminal and an output terminal, the input terminal is configured to connect to an alternating current (AC) power source, and the output terminal is electrically connected with the electrodes by the switch.

Abstract: An alternating current light emitting diode (LED) illumination apparatus includes a heat dissipation plate, a plurality of LED chips, a circuit layer, an encapsulation, at least one electrode located on the heat dissipation plate, and a driving element. The LED chips are categorized into at least two LED chip groups connected in series, and each LED chip group comprises at least two LED chips connected in anti-parallel. The driving element comprises a transformer and a bilateral switch. One end of a first switch of the bilateral switch selectively connects to an output terminal of the transformer to output a selected driving voltage to the LED chips. One end of a second switch of the bilateral switch connects to the first switch and the other end of the second switch selectively connects to a LED chip group or all of the LED chips.

Abstract: A solid state lighting source illumination device comprising a bracket and at least one solid state lighting source module. The solid state lighting source module comprises a substrate and at least one solid state lighting source. The substrate is set up with circuit and the solid state lighting source is set up on the substrate, and the electrode of the solid state lighting source is electrically connecting with the circuit on the substrate. The substrate and the bracket further comprise a heat dissipation structure which is a space between the substrate and a base of the bracket and through holes in the substrate near the solid state lighting source.

Abstract: A discharge circuit includes an OC (Optical Coupler), a capacitor, an NPN-type transistor, and a discharge unit. The discharge circuit is parallel connected to a PFC (power factor corrector) circuit which includes a filter capacitor. The discharge unit has a MOSFET and a discharge resistor. A drain of the MOSFET is connected to a first terminal of the PFC circuit via the discharge resistor, a gate thereof is connected the anode of the capacitor, and a source thereof is connected to ground.