Patents by Inventor Sheng HUI

Sheng HUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240168935
    Abstract: Access usage of one or more shards of a set of shards of a database is determined. The set of shards includes a plurality of shards including a primary shard and one or more replica shards of the primary shard. A shard of the plurality of shards is selected based on the access usage, and a set of indexes is built for the shard that is selected. The set of indexes built for the shard that is selected is used for at least multiple shards of the plurality of shards.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 23, 2024
    Inventors: Peng Hui JIANG, Sheng Yan SUN, Xiao Xiao CHEN, Ying ZHANG, Xiao Yi TIAN
  • Publication number: 20240167185
    Abstract: A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 23, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chiu-Yen Chiu, Li-Ju Chen, Sheng-Hui Wu, Chia-Chen Fang
  • Patent number: 11983090
    Abstract: A method of analyzing source code includes receiving, by a processor, an updated version of a computer program, the updated version including a source code. The method also includes preprocessing, by a compiler, the source code for a target computing platform. Preprocessing the source code by the compiler includes identifying a macro condition associated with one or more computer instructions enclosed by a macro, determining object code corresponding to the one or more computer instructions based on a current value of the macro condition, and generating object code and macro information for output to a debugger, the macro information including one or more breakpoint conditions in the macro.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 14, 2024
    Assignee: International Business Machines Corporation
    Inventors: Xiao Ling Chen, Wen Ji Huang, Heng Wang, Sheng Shuang Li, Wen Bin Han, Peng Hui Jiang
  • Publication number: 20240134853
    Abstract: A computer-implemented method dynamically switches access plans for a query during concurrent query execution. The method includes receiving a first query configured to be processed by a database system. The method also includes generating, for the first query, an access plan for each of identified resource sets. The method includes determining a first set of available resources that represent an available capacity for the database system. The method further includes selecting a first resource set of the one or more resource sets, where the selecting is based on the first set of available resources being closest to the first resource set. The method also includes selecting, based on the first set of available resources, a first access plan of the one or more access plans. The method includes executing the first query and returning results of the first query to a source of the first query.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Inventors: Xiao Xiao Chen, Sheng Yan Sun, Peng Hui Jiang, YING ZHANG
  • Patent number: 11947561
    Abstract: An embodiment for analyzing and tracking data flow to determine proper schemas for unstructured data. The embodiment may automatically use a sidecar to collect schema discovery rules during conversion of raw data to unstructured data. The embodiment may automatically generate multiple schemas for different tenants using the collected schema discovery rules. The embodiment may automatically use ETL to export unstructured data to SQL databases with the generated multiple schemas for the different tenants. The embodiment may automatically monitor usage data of the SQL databases and collect the usage data. The embodiment may automatically optimize schema discovery using the collected usage data. The embodiment may automatically discover schemas with hot usage and apply the discovered schemas with hot usage to other tenants for consumption and further monitoring.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: April 2, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Peng Hui Jiang, Jun Su, Sheng Yan Sun, Hong Mei Zhang, Meng Wan
  • Publication number: 20240103896
    Abstract: A computer-implemented method, system and computer program product for scaling a resource of a Database as a Service (DBaaS) cluster in a cloud platform. User service requests from a service cluster to be processed by the DBaaS cluster are received. A first set of tracing data is generated by a service mesh, which facilitates service-to-service communication between the service cluster and the DBaaS cluster, from the user service requests. A second set of tracing data is generated by the DBaaS cluster from handling the user service requests. A dependency tree is then generated to discover application relationships to identify potential bottlenecks in nodes of the DBaaS cluster based on these sets of tracing data. The pod(s) of a DBaaS node are then scaled based on the dependency tree, which is used in part, to predict the utilization of the resources of the DBaaS node identified as being a potential bottleneck.
    Type: Application
    Filed: September 24, 2022
    Publication date: March 28, 2024
    Inventors: Peng Hui Jiang, Yue Wang, Jun Su, Su Liu, Sheng Yan Sun
  • Patent number: 11940975
    Abstract: A computer-implemented method that includes receiving an ingestion request to ingest data to a database comprising physical shards and detecting that the ingestion request is directed to a first hotspot shard. The first hotspot shard has a contention level over a threshold value. The method also detects context characteristics within the data and generates a first virtual shard based on a first virtual shard key selected from the detected context characteristics. The first virtual shard virtually duplicates at least a portion of the first hotspot shard. The method also includes ingesting the data to the first virtual shard.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 26, 2024
    Assignee: International Business Machines Corporation
    Inventors: Shuo Li, Peng Hui Jiang, Xiaobo Wang, Sheng Yan Sun
  • Patent number: 11934359
    Abstract: A method, computer system, and a computer program product is provided for computer log management. In one embodiment, in response to receiving a log request from a user, an input content is analyzed and adjusted according to input contents and user's previous activities. A similarity analysis and a fairness analysis is performed to determine similarities between the input content, as adjusted, and a plurality of log records in an object library. The similarity analysis includes analyzing any patterns and attributes. The attributes have a dimension, and each dimension has a predefined weight (W). The fairness analysis ensures that one type of log is not favored over others. A best possible match is then determined, and one or more logs are presented to the user providing the best possible match.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: March 19, 2024
    Assignee: International Business Machines Corporation
    Inventors: Sheng Yan Sun, Peng Hui Jiang, Meng Wan, Hong Mei Zhang
  • Publication number: 20240086306
    Abstract: One or more computer processors generate a debug chain from one or more similar resource bound breakpoints, wherein the debug chain provides dynamic code flow. The one or more computer processors distribute the generated debug chain to one or more tenants.
    Type: Application
    Filed: September 13, 2022
    Publication date: March 14, 2024
    Inventors: Peng Hui Jiang, Jun Su, Sheng Yan Sun, Hong Mei Zhang, Meng Wan
  • Publication number: 20240079268
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Inventors: Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li
  • Publication number: 20240070911
    Abstract: A tracking device includes a camera and a processor is disclosed. The camera is configured to capture several first pictures with a first setting group and several second pictures with a second setting group in turn. The processor is coupled to the camera. The processor is configured to select a current time point picture from several first pictures or several second pictures according to a current time point speed of the tracking device of the current time point, and to determine a current pose of the tracking device of the current time point according to the current time point picture.
    Type: Application
    Filed: July 3, 2023
    Publication date: February 29, 2024
    Inventors: Chun-Kai HUANG, Sheng-Hui TAO
  • Patent number: 11914594
    Abstract: A disclosed database system and enhanced methods implement enhanced mini-plans and dynamically changing a query mini-plan with trustworthy Artificial Intelligence (AI) to improve query execution performance in a database system. An AI cost model evaluates candidate mini-plans for executing a query. AI truth monitors evaluate the execution of the mini-plans, such as predicted input factors and adjusted mini-plans of one or more AI running data models. The AI truth monitors provide feedback to adjust the AI cost model based on evaluating the execution of the mini-plans. The AI truth monitors validate adjusted mini-plans, provide feedback to the AI cost model with improved overall prediction accuracy, and enhanced mini-plans to gain query performance.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: February 27, 2024
    Assignee: International Business Machines Corporation
    Inventors: Hong Mei Zhang, Meng Wan, Sheng Yan Sun, Peng Hui Jiang
  • Patent number: 11914586
    Abstract: An embodiment includes generating a partition schema for a distributed database based on historical usage data indicative of usage of the distributed database, where the generating of the partition schema comprises determining a partition range of a partition of the partition schema. The embodiment also includes generating a node identifier for the partition using a hash function and a first weight value assigned to the partition. The embodiment also includes monitoring performance data indicative of a performance of the distributed database, the monitoring comprising detecting a failure of the performance to satisfy a performance threshold. The embodiment also includes initiating, responsive to detecting the failure, a redistribution procedure by changing the node identifier of the partition by replacing the first weight value with a second weight value.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: February 27, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hong Mei Zhang, Sheng Yan Sun, Meng Wan, Peng Hui Jiang
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Publication number: 20240005553
    Abstract: The embodiments of the disclosure provide a method for pose correction and a host. The method includes: obtaining a first image; in response to determining that a first reference object of at least one reference object exists in the first image, determining a first relative position between the host and the first reference object; obtaining a first reference pose based on the first relative position; and correcting a pose of the host based on the first reference pose.
    Type: Application
    Filed: May 26, 2022
    Publication date: January 4, 2024
    Applicant: HTC Corporation
    Inventors: Yun-Ting Wang, Sheng-Hui Tao
  • Publication number: 20230402292
    Abstract: A method of manufacturing an electronic device includes providing a substrate, providing an intermediate layer on the substrate, and providing an isolation layer on the intermediate layer. The substrate includes an active region and a peripheral region. The peripheral region is adjacent to the active region, and the ratio of the area of the active region to the area of the substrate surface is between 75% and 92%. The isolation layer includes a first surface and at least one slope. The first surface of the isolation layer is correspondingly disposed in the active region. The at least one slope of the isolation layer is correspondingly disposed in the peripheral region and at a first angle with respect to the substrate surface.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 14, 2023
    Applicant: InnoLux Corporation
    Inventors: Chuan-Ming YEH, Heng-Shen YEH, Sheng-Hui CHIU, Kuo-Jung FAN
  • Patent number: 11832441
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a fin positioned on the substrate, a gate structure positioned on the fin, a pair of source/drain regions positioned on two sides of the fin, a dielectric layer positioned above the drain region and adjacent to the gate structure, and a storage conductive layer positioned on the dielectric layer. The drain region, the dielectric layer and the storage conductive layer form a storage structure.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: November 28, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Sheng-Hui Yang
  • Publication number: 20230352433
    Abstract: A semiconductor device structure includes a silicon layer disposed over a first semiconductor die, and a first mask layer disposed over the silicon layer. The semiconductor device structure also includes a second semiconductor die disposed over the first mask layer, and a through silicon via penetrating through the silicon layer and the first mask layer. A bottom surface of the through silicon via is greater than a top surface of the through silicon via, and the top surface of the through silicon via is greater than a cross-section of the through silicon via between and parallel to the top surface and the bottom surface of the through silicon via.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventor: SHENG-HUI YANG
  • Publication number: 20230352434
    Abstract: A semiconductor device structure includes a silicon layer disposed over a first semiconductor die, and a first mask layer disposed over the silicon layer. The semiconductor device structure also includes a second semiconductor die disposed over the first mask layer, and a through silicon via penetrating through the silicon layer and the first mask layer. A bottom surface of the through silicon via is greater than a top surface of the through silicon via, and the top surface of the through silicon via is greater than a cross-section of the through silicon via between and parallel to the top surface and the bottom surface of the through silicon via.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Inventor: SHENG-HUI YANG
  • Publication number: 20230261082
    Abstract: A contact structure and a manufacturing method are provided. The contact structure includes a recessed structure, a conductive feature, a first functional layer, a second functional layer and an interfacial layer. The conductive feature is filled in a recess of the recessed structure. The first functional layer extends between the conductive feature and the recessed structure. The second functional layer extends between the first functional layer and the conductive feature. The interfacial extends along an interface between the first and second functional layers, and includes a first element from the first functional layer and a second element from the second functional layer.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventor: SHENG-HUI YANG