Abstract: A camera module of an electronic device includes a lens body and a bracket. The lens body includes a base mount. The bracket includes a main body and a conductive member. The main body is made of electrically non-conductive material and is configured to fixedly mount the lens body. The conductive member is received within the main body and is configured to electrically couple the base mount to a housing of the electronic device to discharge electric charge accumulated on the base mount.

Abstract: A lens module with improved structural grounding and adhesion on and to a carrier includes a voice coil motor, a carrier, and a colloid attaching the voice coil motor to the carrier. A wall of the carrier defines at least one hole, and the hole is filled with the colloid to enhance and reinforce a bonding strength between the voice coil motor and the carrier. An electronic device applying such a lens module is also provided.

Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.

Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.

Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.

Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.

Abstract: A three-dimensional image-capturing device includes a first camera, a second camera, a driving member and a sensing member. The second camera is at one side of the first camera and is capable of being moved laterally by the driving member. After depth-sensing and establishing orientations in an image, the driving member is able to drive the second camera to move relative to the first camera, to change a distance between the first camera and the second camera. Such relative movement allows a greater range of three dimensionality for face recognition and other purposes.

Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.

Abstract: A camera module includes a base, a circuit board bearing the base, and a metal plate bearing the circuit board and the base. The base includes a receiving portion and a bearing portion. The bearing portion surrounds the receiving portion. The bearing portion defines a cutout to receive an electronic component of the circuit board.

Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: A camera for mounting on a vehicle includes a holder, a lens, and a polarizing film. The lens includes an optical lens body and an annular body. A part of the optical lens body is received in the holder and the other part of the optical lens body extends out of the holder. The annular body is disposed around an outer circumference of a portion of the optical lens body extending out of the holder. The polarizing film in the annular body faces the lens and weakens the effects of strong lights on images captured by the camera.

Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.

Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.

Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.

Abstract: A depth-perceiving lens module with enhanced heat-dissipating properties comprises a circuit board, an infrared emitter, and an infrared receiver. The circuit board is provided with at least one positioning hole. The infrared emitter is detachably disposed on a side of the circuit board and electrically connected to the circuit board, the infrared emitter comprises a mounting body and an emitting body. The mounting body wraps at least part of the emitting body, at least part of the mounting body is disposed in the positioning hole and fixed to the circuit board. The infrared receiver is detachably disposed on one side of the circuit board and electrically connected to the circuit board, to receive the reflection of the infrared light from the light emitter.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.

Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.

Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.