Abstract: A structure and a method of forming are provided. The structure includes a first dielectric layer overlying a first substrate. A first connection pad is disposed in a top surface of the first dielectric layer and contacts a first redistribution line. A first dummy pad is disposed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution line. A second dielectric layer overlies a second substrate. A second connection pad and a second dummy pad are disposed in the top surface of the second dielectric layer, the second connection pad bonded to the first connection pad, and the first dummy pad positioned in a manner that is offset from the second dummy pad so that the first dummy pad and the second dummy pad do not contact each other.

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a conditioning roller, in addition to the rubbing roller, to rejuvenate the rubbing roller in real time so as to lengthen the roller lifetime in the rubbing process and increase the rubbing rate. By employing the conditioning roller along with the rubbing roller, the rubbing process includes an extra conditioning step for conditioning the rubbing roller, thus shortening the production cycle time and increasing the throughput.

Abstract: A frame attaching process is described. The frame attaching process is adapted for attaching a transparent substrate to an active area of a chip using a frame, wherein the active area of the chip has a functional area. In the frame attaching process, the frame can be formed on the attaching surface of the transparent substrate or on the active area of the chip. Then, the attaching surface of the transparent substrate is attached to the active area of the chip using the frame under a negative pressure. Finally, the frame is solidified. Therefore, in the frame attaching process, the possibility of frame cracking can be reduced and the yield of the frame attaching process can be improved.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

Abstract: The present invention provides a manufacturing method for a microdisplay. After providing a wafer with a plurality of pixel structures on the front side, trenches with a pattern are formed on the backside of the wafer. A transparent plate is disposed above the front side of the wafer and a sealant is applied to join the wafer and the transparent plate. After cutting the wafer and the transparent plate into display cells of suitable sizes, liquid crystal is then introduced in-between the sealant of the display cells.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

Abstract: A frame attaching process is described. The frame attaching process is adapted for attaching a transparent substrate to an active area of a chip using a frame, wherein the active area of the chip has a functional area. In the frame attaching process, the frame can be formed on the attaching surface of the transparent substrate or on the active area of the chip. Then, the attaching surface of the transparent substrate is attached to the active area of the chip using the frame under a negative pressure. Finally, the frame is solidified. Therefore, in the frame attaching process, the possibility of frame cracking can be reduced and the yield of the frame attaching process can be improved.

Abstract: The present invention provides a manufacturing method for a microdisplay. After providing a wafer with a plurality of pixel structures on the front side, trenches with a pattern are formed on the backside of the wafer. A transparent plate is disposed above the front side of the wafer and a sealant is applied to join the wafer and the transparent plate. After cutting the wafer and the transparent plate into display cells of suitable sizes, liquid crystal is then introduced in-between the sealant of the display cells.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a conditioning roller, in addition to the rubbing roller, to rejuvenate the rubbing roller in real time so as to lengthen the roller lifetime in the rubbing process and increase the rubbing rate. By employing the conditioning roller along with the rubbing roller, the rubbing process includes an extra conditioning step for conditioning the rubbing roller, thus shortening the production cycle time and increasing the throughput.

Abstract: The present invention provides a manufacturing method for a microdisplay. After providing a wafer with a plurality of pixel structures on the front side, trenches with a pattern are formed on the backside of the wafer. A transparent plate is disposed above the front side of the wafer and a sealant is applied to join the wafer and the transparent plate. After cutting the wafer and the transparent plate into display cells of suitable sizes, liquid crystal is then introduced in-between the sealant of the display cells.

Abstract: The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a conditioning roller, in addition to the rubbing roller, to rejuvenate the rubbing roller in real time so as to lengthen the roller lifetime in the rubbing process and increase the rubbing rate. By employing the conditioning roller along with the rubbing roller, the rubbing process includes an extra conditioning step for conditioning the rubbing roller, thus shortening the production cycle time and increasing the throughput.

Abstract: The invention describes a method of fabricating the integration of high-voltage devices and low-voltage devices. The ion implantation steps for forming the isolation doping regions and the drafting doping regions in the high-voltage device are used to form simultaneously the anti-punch-through regions in the low-voltage device. The production of the integrated circuit is then finished with other process steps.