Patents by Inventor Sheng-Lung Chou

Sheng-Lung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3DIC structure and methods of forming
    Patent number: 11984431
    Abstract: A structure and a method of forming are provided. The structure includes a first dielectric layer overlying a first substrate. A first connection pad is disposed in a top surface of the first dielectric layer and contacts a first redistribution line. A first dummy pad is disposed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution line. A second dielectric layer overlies a second substrate. A second connection pad and a second dummy pad are disposed in the top surface of the second dielectric layer, the second connection pad bonded to the first connection pad, and the first dummy pad positioned in a manner that is offset from the second dummy pad so that the first dummy pad and the second dummy pad do not contact each other.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou
  • Floss pick
    Patent number: D930247
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: September 7, 2021
    Assignee: CONVII INC.
    Inventor: Sheng-Lung Chou
  • Floss pick
    Patent number: D930248
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: September 7, 2021
    Assignee: CONVII INC.
    Inventor: Sheng-Lung Chou
  • Floss pick
    Patent number: D930249
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: September 7, 2021
    Assignee: CONVII INC.
    Inventor: Sheng-Lung Chou