Abstract: Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. One type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. Properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: Provided are a use of a thermoplastic polyurethane for forming an impact resistant layer and an impact resistant composite laminate. The thermoplastic polyurethane comprises a structural unit represented by Formula (I): wherein each R independently is an alkylene group having 2 to 8 carbon atoms or CH2CH2OCH2CH2; n is a number from 2 to 13; and the structural unit has a Mn ranging from 700 g/mole to 2500 g/mole. In addition, the impact resistant layer has a thickness of larger than 1.5 mm. The impact resistant composite laminate comprises a base layer and the impact resistant layer disposed on the base layer.

Abstract: The present invention provides a non-invasive flexible blood glucose detecting and sleep monitoring device for monitoring the sleep state and blood glucose state of the detected person. The non-invasive flexible blood glucose detecting and sleep monitoring device includes a detection module including: a substrate; a plurality of optical modules, each being an optical cover plates with a coating layer; retaining walls, being disposed on the substrate, and the retaining walls respectively establishing a first space and a second space with the substrate and the optical modules; a light emitting unit, being disposed in the first space; and the sensing unit, being disposed in the second space. The non-invasive flexible blood glucose detecting and sleep monitoring device further includes a flexible piezoelectric module for being placed on the detected person; and a detecting unit, being connected to the detection module and the flexible piezoelectric module.

Abstract: A lens holder with an air escape hole which cannot be fouled by adhesive includes a holder body and a lens barrel disposed on the holder body. The holder body includes a first surface away from the lens barrel and a second surface opposite to the first surface, the first surface defines a groove. The groove includes a first bottom surface, the first bottom surface defines a recess. The recess includes a second bottom surface, the second bottom surface defines an air escape hole. A cross-sectional size of the air escape hole is less than a cross-sectional size of the recess.

Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: Various embodiments of the teachings herein include an image processing system comprising: a video stream processing device configured to receive a video stream, segment the video stream into multiple frames of pictures arranged in chronological order, and distribute the multiple frames of pictures to edge computing devices in a connected edge computing device group; and a picture collecting device configured to receive pictures from the edge computing device group. The individual edge computing devices in the edge computing device group are each configured to subject the received pictures to target identification, and send the pictures marked with a region in which an identified target is located. The picture collecting device is further configured to restore in chronological order as a video stream the received pictures marked with target identification results.

Abstract: A method for performing audio enhancement with aid of timing control includes: utilizing a UE to determine a first predetermined synchronization delay and notify a first earphone of the first predetermined synchronization delay, wherein a first DSP circuit in the first earphone is arranged to determine a synchronization point according to a first time point of a first event and the first predetermined synchronization delay for the first earphone; utilizing the UE to determine a second predetermined synchronization delay and notify a second earphone of the second predetermined synchronization delay, wherein a second DSP circuit in the second earphone is arranged to determine the synchronization point according to a second time point of a second event and the second predetermined synchronization delay for the second earphone; and utilizing the UE to receive first uplink audio data from the first earphone and receive second uplink audio data from the second earphone.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A method is provided forming an airtight structure of an electroacoustic device which includes a body shell composed of at least two half-shells and at least one airtight structure region. The method includes providing an automatic glue dispensing device for dispensing and pre-curing a photo-curing glue for one of the two half-shells, putting the half-shell into a photo-curing device to convert the photo-curing glue pre-cured completely into an elastomer, and combining the half-shell and the other one to have a pressing wall of the other half-shell to press the elastomer to form the airtight structure of the electroacoustic device, wherein the automatic glue dispensing device includes a glue dispensing head moving on a groove of the airtight region of the half-shell for dispensing the photo-curing glue and a pre-curing head continuously providing a curing light ray for pre-curing the photo-curing glue.

Abstract: A computing device for training a fully-connected neural network (FCNN) comprises at least one storage device; and at least one processing circuit, coupled to the at least one storage device. The at least one storage device stores, and the at least one processing circuit is configured to execute instructions of: computing a block-diagonal approximation of a positive-curvature Hessian (BDA-PCH) matrix of the FCNN; and computing at least one update direction of the BDA-PCH matrix according to an expectation approximation conjugated gradient (EA-CG) method.

Abstract: A touch panel may include a substrate, a touch unit region and a covering layer. The touch unit region includes first electrode and a second electrode isolated from the first electrode. The covering layer covers at least one of the first electrode and the second electrode and has a touch surface. A distance between the touch surface and the first electrode or the second electrode ranges between 0.01 micrometers and 100 micrometers. A mutual capacitance value between the first electrode and the second electrode ranges between 0.1 pF and 10 pF when a touch has not occurred yet.

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.

Abstract: A secondary-side bucking and current-stabilizing flyback power converter adopts a dual-stage isolated circuit architecture and outputs a constant output current to drive a low-power LED module, and its primary stage adopts a flyback circuit architecture with a primary regulated voltage, and its secondary stage adopts of a buck circuit architecture of the current stabilizer, so that after the primary stage converts the constant voltage, the current stabilizer senses the load effect of the output current at the LED module to regulate the output cycle and maintain the total output of the output current constant and reduce the ripple amplitude, so as to achieve a non-strobe output result and improve the illumination effect of the LED module.