Patents by Inventor Sheng Yen
Sheng Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240167185Abstract: A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.Type: ApplicationFiled: January 18, 2023Publication date: May 23, 2024Applicant: Industrial Technology Research InstituteInventors: Chiu-Yen Chiu, Li-Ju Chen, Sheng-Hui Wu, Chia-Chen Fang
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Patent number: 11982866Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: GrantFiled: December 15, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
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Patent number: 11955038Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. The display may have a number of independently controllable viewing zones. Each viewing zone displays a respective two-dimensional image. Each eye of the viewer may receive a different one of the two-dimensional images, resulting in a perceived three-dimensional image. The electronic device may include display pipeline circuitry that generates and processes content to be displayed on the lenticular display. Content generating circuitry may generate content that includes a plurality of two-dimensional images, each two-dimensional image corresponding to a respective viewing zone. Pixel mapping circuitry may be used to map the two-dimensional images to the array of pixels in the lenticular display. The array of pixels may have a diagonal layout. An offset map may be used by the pixel mapping circuitry to account for the diagonal layout.Type: GrantFiled: June 11, 2021Date of Patent: April 9, 2024Assignee: Apple Inc.Inventors: Sheng Zhang, Chaohao Wang, Yi-Pai Huang, Yue Ma, Ping-Yen Chou, Fu-Chung Huang
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Publication number: 20240112628Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. A plurality of lenticular lenses may extend across the length of the display. The lenticular lenses may be configured to enable stereoscopic viewing of the display such that a viewer perceives three-dimensional images. The display may have a number of independently controllable viewing zones. The viewer may be particularly susceptible to artifacts caused by crosstalk at the edge viewing zones within the primary field of view of the display. Certain types of content may also be more vulnerable to crosstalk than other types of content. Therefore, to mitigate crosstalk artifacts, the pixel value for each pixel may be adjusted based on the viewing zone of the respective pixel and content information (such as texture information or brightness information) associated with the respective pixel.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Inventors: Yunhui Hou, Yi-Pai Huang, Fu-Chung Huang, Sheng Zhang, Chaohao Wang, Ping-Yen Chou, Yi Huang, Juan He, Alfred B. Huergo Wagner, Seung Wook Kim
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Patent number: 11942652Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.Type: GrantFiled: April 13, 2022Date of Patent: March 26, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
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Publication number: 20240083828Abstract: The present application relates to a system and a method for producing vinyl chloride. The system comprise a preheat unit, a gas-liquid separating unit, a heat-recovery unit, a heating unit and a thermal pyrolysis unit, and therefore heat energy of the thermal pyrolysis product can be efficiently recovered. Energy cost of the system can be efficiently lowered with the heat-recovery unit and the heating unit, and further prolonging operating cycle of the system.Type: ApplicationFiled: June 28, 2023Publication date: March 14, 2024Inventors: Wen-Hsi HUANG, Sheng-Yen KO, Shih-Hong CHEN, Chun-Yu LIN
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Patent number: 11929273Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.Type: GrantFiled: July 27, 2020Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Tsung-Sheng Kuo, Chih-Hung Huang, Guan-Wei Huang, Ping-Yung Yen, Hsuan Lee, Jiun-Rong Pai
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Patent number: 11927392Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.Type: GrantFiled: March 29, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
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Publication number: 20240047435Abstract: A luminous panel includes a circuit board, a plurality of connecting pads, a chip and two alignment structures. The connecting pads are located on the circuit board. The chip is located on the circuit board and at least partially covers the connecting pads. The two alignment structures are located on the circuit board. The two alignment structures and the connecting pads are at the same level. The two alignment structures are located at two diagonal corners of the chip. At least one part of the two alignment structures protrudes from the outline of the chip.Type: ApplicationFiled: December 27, 2022Publication date: February 8, 2024Inventors: Tzu-Chun LIN, Sheng-Yen CHENG, Jia-Hong WANG, Yueh-Hung CHUNG, Ya-Ling HSU, Chen-Hsien LIAO
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Publication number: 20240017525Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 20 phr to 40 phr of an epoxy resin, 40 phr to 60 phr of a modified benzoxazine resin, 2 phr to 10 phr of a maleimide resin, and 25 phr to 50 phr of fillers. The modified benzoxazine resin contains a DOPO group. Based on a total weight of the modified benzoxazine resin being 100 wt %, an amount of the DOPO group ranges from 10 wt % to 20 wt %.Type: ApplicationFiled: December 25, 2022Publication date: January 18, 2024Inventors: SHENG-YEN WU, KAI-YANG CHEN, MENG-HAN YEH, LI-CHUNG LU
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Patent number: 11876103Abstract: A display panel includes a plurality of sub-pixel structures and a plurality of transfer elements. The sub-pixel structures include a plurality of first sub-pixel structures. A data line of each of the first sub-pixel structures is disposed adjacent to a corresponding transfer element, and a scan line of each of the first sub-pixel structures is electrically connected to the corresponding transfer element. The first sub-pixel structures include a plurality of first-type sub-pixel structures and a plurality of second-type sub-pixel structures. When the display panel displays a grayscale picture, each of the first-type sub-pixel structures has first brightness, each of the second-type sub-pixel structures has second brightness. The first brightness is less than the second brightness. A total number of the first sub-pixel structures of the display panel is A, a number of the first-type sub-pixel structures in the first sub-pixel structures is a, and 50%<(a/A)<100%.Type: GrantFiled: February 24, 2023Date of Patent: January 16, 2024Assignee: AUO CorporationInventors: Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Ya-Ling Hsu, Chen-Hsien Liao
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Patent number: 11876526Abstract: The present invention discloses an analog to digital conversion (ADC) apparatus having quick conversion mechanism. Each of ADC circuits receives a previous higher-bit conversion result to perform prediction to generate a current higher-bit conversion result, performs conversion on an input analog signal according to a sampling clock that has a frequency at least twice of the frequency of the input analog signal based on a successive-approximation mechanism to generate a current lower-bit conversion result, and combines the current higher-bits and current lower-bit conversion results to generate a current conversion result and output a remained signal amount as a residue. A noise-shaping circuit performs calculation based on the residue to generate a noise-shaping reference signal. Each of the ADC circuits combines the current conversion result and the noise-shaping reference signal to generate an output digital signal.Type: GrantFiled: February 14, 2022Date of Patent: January 16, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Shih-Hsiung Huang, Kai-Yue Lin, Wei-Jyun Wang, Sheng-Yen Shih
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Publication number: 20240002653Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.Type: ApplicationFiled: May 8, 2023Publication date: January 4, 2024Inventors: SHENG-YEN WU, SHOU-NENG TO, YA-PING LIU, CHEN-HAO CHANG, PEI-CHUN LAI
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Publication number: 20230420818Abstract: A multi-layered resonator circuit structure and a multi-layered filter circuit structure. The multi-layered resonator circuit structure includes a multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has a top surface, a bottom surface, and a ground layer. The top surface and the bottom surface face away from each other. The ground layer is located between the top surface and the bottom surface. A part of the plurality of resonators is/are disposed on the top surface. Another part of the plurality of resonators is/are disposed on the bottom surface. The plurality of conductive components is located in the multi-layered substrate. The plurality of resonators is electrically connected to the ground layer, respectively, via the plurality of conductive components.Type: ApplicationFiled: March 14, 2023Publication date: December 28, 2023Applicants: UNIMICRON TECHNOLOGY CORP., TUNGHAI UNIVERSITYInventors: Chi-Feng CHEN, Po-Sheng YEN, Ruey-Beei WU, Ra-Min TAIN, Chin-Sheng WANG, Jun-Ho CHEN
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Publication number: 20230422187Abstract: The transmission power at which to drive an antenna of a computing device is adjusted based on a peak transmission gain of the antenna for a current physical configuration mode in which the computing device is operating and on a maximum permitted radiation for the antenna. The antenna is driven at the adjusted transmission power when performing wireless communication using the antenna.Type: ApplicationFiled: June 27, 2022Publication date: December 28, 2023Inventors: Cheng-Fang Lin, Huai-Yung Yen, Ruei-Ting Lin, Ren-Hao Chen, Lo-Chun Tung, Sheng-Yen Chan, Hsiao Chun Su
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Publication number: 20230363107Abstract: A fluid distribution assembly is adapted for at least one heat source and includes at least one housing having a coolant chamber and at least one fluid-driving component in fluid communication with the coolant chamber configured for accommodating the at least one heat source, and the at least one fluid-driving component is configured to pump fluid out of the coolant chamber.Type: ApplicationFiled: September 26, 2022Publication date: November 9, 2023Inventors: Sheng Yen LIN, Cheng Han Chiang
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Patent number: 11810923Abstract: A pixel array substrate includes data lines, first gate lines, pixel structures, first common lines, and conductive line sets. The conductive line sets are arranged in a first direction. Each of the conductive line sets includes first conductive line groups and a second conductive line group sequentially arranged in the first direction. Each of the first conductive line groups includes second gate lines and a second common line. The second conductive line group includes first auxiliary lines and a second common line. An arrangement order of the second gate lines and the second common line of each of the first conductive line groups in the first direction are the same as an arrangement order of the first auxiliary lines and the second common line of the second conductive line group in the first direction, respectively.Type: GrantFiled: February 22, 2023Date of Patent: November 7, 2023Assignee: AUO CorporationInventors: Ping-Wen Chen, Min-Tse Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Yueh-Chi Wu, Shu-Wen Liao, Ti-Kuei Yu, Ya-Ling Hsu, Chen-Hsien Liao
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Publication number: 20230348673Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.Type: ApplicationFiled: October 12, 2022Publication date: November 2, 2023Inventors: Sheng-Yen WU, Po-Hsun LEE, Chun-Ming CHIU, Wen-Pin SU, Jui-Teng HSU, Chen-Yu HUANG, Chun-Han LIN
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Publication number: 20230348708Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.Type: ApplicationFiled: December 6, 2022Publication date: November 2, 2023Inventors: Sheng-Yen WU, Tzu-Fang CHEN, Po-Kai TSENG, Yu-Chieh HSU, Te-Chieh LI, Shao-Wei YU
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Patent number: 11776444Abstract: A pixel array substrate, including scanning line pads, data line pads, scanning lines, data lines, gate transmission lines, pixels, a data line signal chip, and a scanning line signal chip, is provided. The scanning lines extend along a first direction. The data lines and the gate transmission lines extend along a second direction. The data lines are electrically connected to the data line pads. The scanning lines are electrically connected to the scanning line pads through the gate transmission lines. A ratio of a number of rows of pixels arranged in the first direction to a number of rows of pixels arranged in the second direction is X:Y. Each pixel includes m sub-pixels.Type: GrantFiled: November 8, 2021Date of Patent: October 3, 2023Assignee: Au Optronics CorporationInventors: Yang-Chun Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Min-Tse Lee, Kuang-Hsiang Liao, Shiang-Lin Lian, Yan-Kai Wang, Ya-Ling Hsu, Chen-Hsien Liao