Abstract: A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.

Abstract: A device including a first plurality of metal-oxide semiconductor field-effect transistors electrically connected in series. Each of the first plurality of metal-oxide semiconductor field-effect transistors includes a first gate structure, a first drain/source region on one side of the first gate structure, and a second drain/source region on another side of the first gate structure. The first gate structure of each of the first plurality of metal-oxide semiconductor field-effect transistors is configured to receive a bias voltage to bias on the first plurality of metal-oxide semiconductor field-effect transistors and provide a temperature dependent resistance through the first plurality of metal-oxide semiconductor field-effect transistors to measure temperatures.

Abstract: A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to the first load circuit through a first through via structure based on a first voltage received through the first input and a second voltage received from the first load circuit through a second through via structure. The first voltage is a constant reference voltage, and the second voltage is a first signal sensed from the first load circuit.

Abstract: A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.

Abstract: A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.

Abstract: Systems and methods are provided for designing an integrated circuit device. In one example, a method for designing an integrated circuit device may include the operations of: receiving a schematic diagram of the integrated circuit device; generating, by a simulation program, a first transient simulation of the integrated circuit device based on the schematic diagram; determining from the first transient simulation of the integrated circuit device a plurality of maximum voltage change values between conductor networks (nets) within the schematic diagram of the integrated circuit device; storing the plurality of maximum voltage change values for the schematic diagram of the integrated circuit device in a computer readable medium; and utilizing, by a layout program, the stored plurality of maximum voltage change values to generate a layout design for the integrated circuit device according to one or more high voltage design constraints.

Abstract: Some embodiments include apparatus having multiple samplers in a decision feedback equalizer (DFE). The multiple samplers include at least two samplers and are configured to be activated in a first mode of the DFE to receive first input information from a summing circuit. At least one of the samplers is configured to be deactivated in a second mode of the DFE. At least one of the samplers is configured to be activated in the second mode of the DFE to receive second input information from the summing circuit.

Abstract: A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.

Abstract: Some embodiments include apparatus having multiple samplers in a decision feedback equalizer (DFE). The multiple samplers include at least two samplers and are configured to be activated in a first mode of the DFE to receive first input information from a summing circuit. At least one of the samplers is configured to be deactivated in a second mode of the DFE. At least one of the samplers is configured to be activated in the second mode of the DFE to receive second input information from the summing circuit.

Abstract: Some embodiments include apparatus having multiple samplers in a decision feedback equalizer (DFE). The multiple samplers include at least two samplers and are configured to be activated in a first mode of the DFE to receive first input information from a summing circuit. At least one of the samplers is configured to be deactivated in a second mode of the DFE. At least one of the samplers is configured to be activated in the second mode of the DFE to receive second input information from the summing circuit.

Abstract: Embodiments include apparatuses, methods, and systems including a decision feedback equalizer (DFE). The DFE includes a first summer circuit, a second summer circuit, a decision circuit, and a tap-delay line including a number of delay elements. The first summer circuit is to add together an analog signal and a first set of weighted feedback taps {h(j+1), . . . h(m)} of time delayed signals of a detected symbol to generate a first summand. The second summer circuit is to add together a second set of weighted feedback taps {h(k+1), h(n)} of time delayed signals of the detected symbol to generate a second summand. The decision circuit is to receive at least the first summand and the second summand, to generate the detected symbol based on a sum including the first summand and the second summand. Other embodiments may also be described and claimed.

Abstract: A circuit may comprise a first node, a ring oscillator, a regulator, and a Kvcc compensation circuit. The first node may be a supply node to provide a supply voltage for the circuit. The ring oscillator may be formed from inverters. The regulator may use a single transistor between the first node and a second node for powering the oscillator. The K compensation circuit may be used to provide to the oscillator a variable capacitive load that is dependent on the supply at the first supply node, and it may drag oscillator frequency down when the first node supply goes up.

Abstract: Some embodiments include apparatus and methods using a first latch in a decision feedback equalizer (DFE), a second latch in the DFE, and circuitry coupled to the first and second latches. The second latch includes a first input node coupled to an output node of the first latch. The circuitry includes a first input node coupled to the first output node, a second input node coupled to a second output node of the second latch, and an output node to provide information having a first output value based on first values of information at the first and second output nodes and a second output value based on second values of information at the first and second output nodes.

Abstract: Automatic digital sensing and compensation of frequency drift caused by temperature, aging, and/or other effects may be provided by including a compensation capacitor array and a sensing logic. The sensing logic may be configured to detect a drift in a first control signal and to provide the compensation capacitor array with a second control signal. The second control signal is configured to cause an adjustment of capacitance in the compensation capacitor array based on the detected drift in the first control signal.

Abstract: Described is an apparatus for clock synchronization. The apparatus comprises a pair of interconnects; a first die including a first phase interpolator having an output coupled to one of the interconnects; and a second die, wherein the pair of interconnects is to couple the first die to the second die.

Abstract: Some embodiments include apparatus having sampling circuitry, a first circuit path, a second circuit path, and a digitally controlled oscillator (DCO). The sampling circuit samples an input signal and provide data information and phase error information based on the input signal. A first circuit path provides proportional control information based on the data information and phase error information. A second circuit path provides integral control information based on the data information and phase error information. The first circuit path operates at a frequency higher than the second circuit path. The DCO generates a clock signal and controls the timing of the clock signal based on the integral control information and the proportional control information.

Abstract: Some embodiments include apparatus having sampling circuitry, a first circuit path, a second circuit path, and a digitally controlled oscillator (DCO). The sampling circuit samples an input signal and provide data information and phase error information based on the input signal. A first circuit path provides proportional control information based on the data information and phase error information. A second circuit path provides integral control information based on the data information and phase error information. The first circuit path operates at a frequency higher than the second circuit path. The DCO generates a clock signal and controls the timing of the clock signal based on the integral control information and the proportional control information.

Abstract: Described is an apparatus comprising: a first phase frequency detector (PFD) to determine a coarse phase difference between a first clock signal and a second clock signal, the first PFD to generate a first output indicating the coarse phase difference; and a second PFD, coupled to the first PFD, to determine a fine phase difference between the first clock signal and the second clock signal, the second PFD to generate a second output indicating the fine phase difference.

Abstract: Embodiments include apparatuses, methods, and systems for open-loop voltage regulation and drift compensation for a digitally controlled oscillator (DCO). In embodiments, a communication circuit may include a DCO, an open-loop voltage regulator, and a calibration circuit. The open-loop voltage regulator may receive a calibration voltage and may generate a regulated voltage. The regulated voltage may be passed to the DCO. During a calibration mode, the calibration circuit may compare the regulated voltage to a reference voltage and adjust the calibration voltage based on the comparison to provide the regulated voltage with a target value. During a monitoring mode, the calibration circuit may receive a tuning code that is used to tune the DCO and further adjust the calibration voltage based on a value of the tuning code.