Abstract: Embodiments provide a method for processing a terminal device and a terminal device. A preset instruction is executed by using a covered area of the terminal device. Specifically, a user input is acquired; the covered area of the terminal device is acquired according to the user input; and if the covered area is larger than a preset area, the preset instruction is executed.

Abstract: Taught herein is an aqueous chemical-mechanical polishing slurry, a method for manufacturing the same, and a method for using the same in the preparation of high precision finishing of a sapphire surface. The slurry comprises a chelating agent having 13 chelate rings, a strong propensity for complexation with aluminum ions and for forming a water-soluble chelate product. The removal rate can reach 10-16 ?m/h, and the roughness can be reduced to 0.1 nm. The slurry components and their weight percentages are as follows: silica sol from about 1 wt. % to about 90 wt. %, alkali modifier from about 0.25 wt. % to about 5 wt. %, ether-alcohol activator from 0.5 wt. % to about 10 wt. %, chelating agent from about 1.25 wt. % to about 15 wt. %, and deionized water. Using such a slurry, high precision finishing of a sapphire surface can be achieved under relevant polishing conditions, which can satisfy the finishing requirements for industrial sapphire substrate.

Abstract: A sliding pulley drive mechanism in cutting platform of lawn mower is disclosed. The drive mechanism includes an engine for the fixed to a chassis; a cutting platform connected to, and capable of moving up and down in relation to the chassis; cutting platform drive belts fitted over the output shaft of the engine, an external spline shaft is fixed to the output shaft of the engine, and a belt pulley with an internal spline is mounted on an external spline shaft. Through a spline mechanism, the belt pulley on the engine can slide up or down on the output shaft of the engine as the elevation of the cutting platform is adjusted, so that the cutting platform drive belts are kept in the same plane, and therefore the belt service lifespan is elongated.

Abstract: The present disclosed invention relates to a quick switching mechanism for the side discharge unit and the chopper unit of a lawn mower: a side discharge unit and a chopper unit are mounted at the grass outlet on a cutting platform; wherein, the side discharge unit comprises a grass discharging gear shaft, a grass discharging hood mounted on the grass discharging gear shaft; the grass chopper unit comprises a grass chopping gear shaft, a grass chopping closing plate mounted on the grass chopping gear shaft; the small gear on the grass discharging gear shaft is engaged to the big gear on the grass chopping gear shaft; a guy wire is mounted on the cutting platform, and is connected to a rotary arm mounted on one end of the grass chopping gear shaft. In the invention, the current grass discharging hood is kept, and therefore the safety of grass discharging is not compromised; during the mowing process, when the mower runs into a place (e.g., a kerb, shrub, etc.

Abstract: The present disclosed invention relates to a quick switching mechanism for the side discharge unit and the chopper unit of a lawn mower: a side discharge unit and a chopper unit are mounted at the grass outlet on a cutting platform; wherein, the side discharge unit comprises a grass discharging gear shaft, a grass discharging hood mounted on the grass discharging gear shaft; the grass chopper unit comprises a grass chopping gear shaft, a grass chopping closing plate mounted on the grass chopping gear shaft; the small gear on the grass discharging gear shaft is engaged to the big gear on the grass chopping gear shaft; a guy wire is mounted on the cutting platform, and is connected to a rotary arm mounted on one end of the grass chopping gear shaft. In the invention, the current grass discharging hood is kept, and therefore the safety of grass discharging is not compromised; during the mowing process, when the mower runs into a place (e.g., a kerb, shrub, etc.

Abstract: The present invention relates to a sliding pulley drive mechanism in cutting platform of lawn mower. An engine for the pulley drive mechanism is fixed to a chassis; a cutting platform is connected to the chassis, and can move up and down in relation to the chassis; a bracket is fixed to the cutting platform; cutting platform drive belts are fitted over the output shaft of the engine, an external spline shaft is fixed to the output shaft of the engine, and a belt pulley with an internal spline is mounted on an external spline shaft; the cutting platform drive belt is mounted on the belt pulley with an internal spline; the lower end of the belt pulley with an internal spline is connected with a shock absorbing bushing, a bearing, and a bearing base plate. The bearing base plate is connected to the bracket.

Abstract: Taught is a method of removal surface contaminants, including organic contaminants, metal ions and solid particles, from silicon wafer surface comprising the following steps: (a) submerging the silicon wafer surface in an aqueous cleaning agent solution through which current is passed using a boron-doped diamond film as an electrode; (b) submerging the silicon wafer surface in an aqueous cleaning agent solution; subjecting the silicon wafer to ultrasound waves; and, optionally, heating the solution; (c) submerging the silicon wafer surface in water through which current is passed using a boron-doped diamond film as an electrode; (d) submerging the silicon wafer surface in water with ultrasound and heating; (e) repeating step (d); and (f) spraying the silicon surface with water. The results obtained using the method according to this invention are far superior to those obtained with conventional methods. The technology is simple, convenient to operate, and environmentally friendly.

Abstract: Taught is a method of removal surface contaminants, including organic contaminants, metal ions and solid particles, from silicon wafer surface comprising the following steps: (a) submerging the silicon wafer surface in an aqueous cleaning agent solution through which current is passed using a boron-doped diamond film as an electrode; (b) submerging the silicon wafer surface in an aqueous cleaning agent solution; subjecting the silicon wafer to ultrasound waves; and, optionally, heating the solution; (c) submerging the silicon wafer surface in water through which current is passed using a boron-doped diamond film as an electrode; (d) submerging the silicon wafer surface in water with ultrasound and heating; (e) repeating step (d); and (f) spraying the silicon surface with water. The results obtained using the method according to this invention are far superior to those obtained with conventional methods. The technology is simple, convenient to operate, and environmentally friendly.

Abstract: Taught herein is an aqueous chemical-mechanical polishing slurry, a method for manufacturing the same, and a method for using the same in the preparation of high precision finishing of a sapphire surface. The slurry comprises a chelating agent having 13 chelate rings, a strong propensity for complexation with aluminum ions and for forming a water-soluble chelate product. The removal rate can reach 10-16 ?m/h, and the roughness can be reduced to 0.1 nm. The slurry components and their weight percentages are as follows: silica sol from about 1 wt. % to about 90 wt. %, alkali modifier from about 0.25 wt. % to about 5 wt. %, ether-alcohol activator from 0.5 wt. % to about 10 wt. %, chelating agent from about 1.25 wt. % to about 15 wt. %, and deionized water. Using such a slurry, high precision finishing of a sapphire surface can be achieved under relevant polishing conditions, which can satisfy the finishing requirements for industrial sapphire substrate.