Abstract: A method of processing a substrate is disclosed which includes depositing a layer in a processing chamber on a field region, a sidewall region, and a fill region of a feature of the substrate, wherein a hardness of a portion of the layer deposited on the sidewall region is lower than a hardness of a portion of the layer deposited on the field region, and lower than a hardness of a portion of the layer deposited on the fill region.

Abstract: The present invention discloses a manual type C-shaped wire clamp operating device, includes an insulating operating rod, wherein an upper end of the insulating operating rod is provided with a threaded rod, and the threaded rod includes an upper thread and a lower thread; a wire clamp clamping device, wherein the wire clamp clamping device includes a first spring, a wire clamp seat and a floating clamping block located above the wire clamp seat, a wire clamp seat threaded hole is formed in the wire clamp seat, the wire clamp seat threaded hole is in fit connection with the lower thread of the threaded rod; a drainage wire pressing device, wherein the drainage wire pressing device includes a guide rod arranged on the wire clamp seat and a drainage wire pressing block sliding along the guide rod, and a pressing block threaded hole is formed in the drainage wire pressing block.