Abstract: The subject application relates to a filler composition, composite material and composite material layer with thermal barrier properties. The present disclosure relates to a filler composition may include a ceramization filler component at a content of at least about 75 wt. % and not greater than about 95 wt. % for a total weight of the filler composition, a structure promoter component at a content of at least about 0.1 wt. % and not greater than about 7.0 wt. % for a total weight of the filler composition, a flux component at a content of at least about 0.1 wt. % and not greater than about 7.0 wt. % for a total weight of the filler composition, and a flame retardant component at least about 5.0 wt. % and not greater than about 20.0 wt. % for a total weight of the filler composition.

Abstract: The subject application relates to a filler composition, composite material and composite material layer with thermal barrier properties. The present disclosure relates to a filler composition may include a ceramization filler component at a content of at least about 50 wt. % and not greater than about 90 wt. % for a total weight of the filler composition, a reinforcement component at a content of at least about 0.1 wt. % and not greater than about 10.0 wt. % for a total weight of the filler composition, a flux component at a content of at least about 3.0 wt. % and not greater than about 10.0 wt. % for a total weight of the filler composition, and a flame retardant component at least about 5.0 wt. % and not greater than about 20.0 wt. % for a total weight of the filler composition.

Abstract: A curable silicone rubber composition is described for an LED enclosure or packaging. A process for preparing the same and the use thereof are also described. Particularly, the compositions can include at least one tackifier component D, which includes: a) a alkenyl or hydrosilyl group including an isocyanurate compound E, and b) an adhesion-imparting ingredient having at least two functional groups selected from the group consisting of alkenyl, epoxy, alkoxy and hydrosilyl groups, which includes of polysiloxane F and optional coupling agents G.

Abstract: A curable silicone rubber composition is described for an LED enclosure or packaging. A process for preparing the same and the use thereof are also described. Particularly, the compositions can include at least one tackifier component D, which includes: a) a alkenyl or hydrosilyl group including an isocyanurate compound E, and b) an adhesion-imparting ingredient having at least two functional groups selected from the group consisting of alkenyl, epoxy, alkoxy and hydrosilyl groups, which includes of polysiloxane F and optional coupling agents G.