Patents by Inventor Shigehiro Hoshida
Shigehiro Hoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7820740Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7820741Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemicals Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7524394Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.Type: GrantFiled: April 12, 2006Date of Patent: April 28, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7524563Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).Type: GrantFiled: April 12, 2006Date of Patent: April 28, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7459047Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.Type: GrantFiled: August 2, 2005Date of Patent: December 2, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Publication number: 20080241452Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.Type: ApplicationFiled: October 1, 2007Publication date: October 2, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori KONDO, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20080090075Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.Type: ApplicationFiled: October 1, 2007Publication date: April 17, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7348057Abstract: An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing and handling as well as good adhesion, and is suited for use in the manufacture of FPC.Type: GrantFiled: November 9, 2004Date of Patent: March 25, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Publication number: 20070272153Abstract: An apparatus for low-temperature plasma treatment of a continuous length plastic film which can work for surface modifying processing for a film using low-temperature plasma while maintaining the dimensional stability without causing damage to the film. The apparatus for performing surface modifying processing for a film comprises: a first vacuum chamber equipped with an unrolling unit for unrolling a rolled plastic film; a second vacuum chamber in which the unrolled plastic film is subjected to a low-temperature plasma treatment on the surface; and a third vacuum chamber equipped with a winding unit for winding the plasma-treated plastic film into a roll, the vacuum chambers being connected together in series along the running direction of the plastic film under treatment.Type: ApplicationFiled: May 22, 2007Publication date: November 29, 2007Inventors: Shigehiro Hoshida, Shinji Suzuki, Tadashi Amano
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Publication number: 20060264538Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, (E) a curing accelerator, and (F) a nitrogen-containing organophosphate compound represented by a general formula (1) shown below: (wherein, R1 to R4 each represent a hydrogen atom or an alkyl group, and X represents a nitrogen-containing bivalent organic group) Also provided are an adhesive sheet having a layer comprising the above composition, and a protective layer for covering the layer comprising the composition; a coverlay film having an electrically insulating film, and a layer comprising the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer comprising the above composition provided on top of the film, and a copper foil provided on top of the layer comprising the composition.Type: ApplicationFiled: May 22, 2006Publication date: November 23, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Toru NAKANISHI, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20060234044Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).Type: ApplicationFiled: April 12, 2006Publication date: October 19, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20060234045Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).Type: ApplicationFiled: April 12, 2006Publication date: October 19, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20060234043Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.Type: ApplicationFiled: April 12, 2006Publication date: October 19, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20060191632Abstract: A method for preparing a flexible metal foil/polyimide laminate is characterized by laminating a metal foil and a polyimide film, with a heat resistant adhesive interleaved therebetween, on a heating roll press, and heat treating the laminate for removing the residual solvent from the adhesive layer and heat curing the adhesive layer.Type: ApplicationFiled: June 16, 2004Publication date: August 31, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Masahiro Usuki, Michio Aizawa, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20060134443Abstract: A flexible metal foil/polyimide laminate consists of all three layers, a polyimide film, a metal foil, and a polyimide resin layer disposed between the polyimide film and the metal foil.Type: ApplicationFiled: June 16, 2004Publication date: June 22, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Michio Aizawa, Masahiro Usuki, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7060784Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.Type: GrantFiled: June 24, 2004Date of Patent: June 13, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Shigehiro Hoshida, Masahiro Usuki, Michio Aizawa, Tadashi Amano
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Publication number: 20060069200Abstract: Provided is an acrylic adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, and (D) 10 to 100 parts by mass of an inorganic filler, the composition optionally including 0 to 0.5 parts by mass of a curing accelerator per 100 parts by mass of the component (A). Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and storage stability, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.Type: ApplicationFiled: September 28, 2005Publication date: March 30, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Publication number: 20060069201Abstract: Provided is an acrylic flame retardant adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, (D) 0.1 to 5 parts by mass of a curing accelerator, (E) a bromine-based flame retardant, in sufficient quantity to produce a bromine content within the entire composition, excluding the component (F), of 15 to 40% by mass, and (F) 10 to 100 parts by mass of an inorganic filler. Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and flame retardancy, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.Type: ApplicationFiled: September 28, 2005Publication date: March 30, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Publication number: 20060042750Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.Type: ApplicationFiled: August 2, 2005Publication date: March 2, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
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Publication number: 20060003173Abstract: In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.Type: ApplicationFiled: July 1, 2005Publication date: January 5, 2006Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano