Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: A memory cell of a nonvolatile semiconductor memory device is formed on a silicon layer formed on a silicon substrate through an ONO film. The memory cell has a source region and a drain region formed in the silicon layer, an ONO film and a gate electrode. The ONO film and the ONO film include nitride films having charge trap parts trapping charges.

Abstract: A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.

Abstract: A semiconductor device is provided which includes a diode formed of a MISFET and having a current-voltage characteristic close to that of an ideal diode. Negatively charged particles (e.g. electrons: 8a) are trapped on the drain region (2) side of a silicon nitride film (4b) sandwiched between films of silicon oxide (4a, 4c). When a bias voltage is applied between the drain and source with the negatively charged particles (8a) thus trapped and in-channel charged particles (9a) induced by them, the MISFET exhibits different threshold values for channel formation depending on whether it is a forward bias or a reverse bias. That is to say, when a reverse bias is applied, the channel forms insufficiently and the source-drain current is less likely to flow, while the channel forms sufficiently and a large source-drain current flows when a forward bias is applied. This offers a current-voltage characteristic close to that of the ideal diode.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: Data indicating whether a short-circuit defect exists in a memory block is programmed a fuse program circuit. In accordance with the fuse program data and a mode instruction signal, the correspondence relationship between a block select signal and a corresponding bit line isolation instruction signal is switched by a circuit that generates the bit line isolation instruction signal in a specific mode. It becomes possible to isolate the memory block in which a leakage current path exists from a corresponding sense amplifier band in a specific operation mode. Current consumption at least at a standby state is reduced.

Abstract: This DDR SDRAM includes a test mode entry signal generation circuit which sets a test mode entry signal at “H” level in accordance with a consecutive input of a first command, a second command, a test mode entry set command, a third command and a test mode register set command synchronously with a rising edge of a clock signal. This enables the DDR SDRAM to enter a test mode without using a high voltage. The DDR SDRAM can, therefore, enter the test mode even if it is incorporated into a registered DIMM.

Abstract: The semiconductor memory device has a formal mode and a test mode as operating modes. The program circuit includes a fuse element in which an address using a spare memory cell instead of a defective memory cell is programmed. The program circuit confirms a disconnection state of a fuse in a condition severer in the test mode than that in the normal mode. An anomaly is notified to outside by a detection circuit in a case where results are different between the test mode and the normal mode. In a case where a fuse is not completely blown, such a fuse can also be detected in the test mode to exclude a defective chip.

Abstract: An output drive circuit is constructed by an output driving MOS transistor driving an output node in accordance with an internal read data, a termination controlling P-channel MOS transistor selectively rendered conductive in accordance with the internal read data when the output driving MOS transistor is non-conductive, and a P-channel MOS transistor rendered conductive to pull up the output node to a power supply voltage level at least when the output drive circuit is inactive. Data transfer is executed in an open drain manner, and the P-channel MOS transistor is utilized as a transistor for termination bus line. Data/signal is transferred fast in an active termination scheme with low current consumption, and an area occupied by the output drive circuit is reduced.

Abstract: Data indicating whether a short-circuit defect exists in a memory block is programmed a fuse program circuit. In accordance with the fuse program data and a mode instruction signal, the correspondence relationship between a block select signal and a corresponding bit line isolation instruction signal is switched by a circuit that generates the bit line isolation instruction signal in a specific mode. It becomes possible to isolate the memory block in which a leakage current path exists from a corresponding sense amplifier band in a specific operation mode. Current consumption at least at a standby state is reduced.

Abstract: A nonvolatile semiconductor memory device includes a silicon substrate, bit lines, word lines, and memory cells. The bit line is positioned above the main surface of the silicon substrate and the word line is provided to intersect the bit line. The memory cell is positioned at a region where the bit line and the word line intersect and has one end electrically connected to the bit line and the other end electrically connected to the word line. The memory cell includes a TMR element and an access diode electrically connected in series. The access diode includes an n-type silicon layer and a p-type silicon layer recrystallized by melting-recrystallization and has a pn junction at the interface between the n-type silicon layer and the p-type silicon layer. As a result, a nonvolatile semiconductor memory device reduced in size and having high performance can be manufactured inexpensively.

Abstract: An interface unit includes a timing control circuit for extracting an effective data window by detecting a point of change in a transferred data, and determining strobe timing for taking in the data in accordance with the extracted effective window; and a strobe clock generating circuit for generating a strobe clock signal for taking in the data under control of the timing control circuit. Regardless of the system structure, accurate data transfer is achieved between any semiconductor devices in the system.

Abstract: A memory cell of a nonvolatile semiconductor memory device is formed on a silicon layer formed on a silicon substrate through an ONO film. The memory cell has a source region and a drain region formed in the silicon layer, an ONO film and a gate electrode. The ONO film and the ONO film include nitride films having charge trap parts trapping charges.

Abstract: This DDR SDRAM includes a test mode entry signal generation circuit which sets a test mode entry signal at “H” level in accordance with a consecutive input of a first command, a second command, a test mode entry set command, a third command and a test mode register set command synchronously with a rising edge of a clock signal. This enables the DDR SDRAM to enter a test mode without using a high voltage. The DDR SDRAM can, therefore, enter the test mode even if it is incorporated into a registered DIMM.

Abstract: An output drive circuit is constructed by an output driving MOS transistor driving an output node in accordance with an internal read data, a termination controlling P-channel MOS transistor selectively rendered conductive in accordance with the internal read data when the output driving MOS transistor is non-conductive, and a P-channel MOS transistor rendered conductive to pull up the output node to a power supply voltage level at least when the output drive circuit is inactive. Data transfer is executed in an open drain manner, and the P-channel MOS transistor is utilized as a transistor for termination bus line. Data/signal is transferred fast in an active termination scheme with low current consumption, and an area occupied by the output drive circuit is reduced.

Abstract: The semiconductor memory device has a formal mode and a test mode as operating modes. The program circuit includes a fuse element in which an address using a spare memory cell instead of a defective memory cell is programmed. The program circuit confirms a disconnection state of a fuse in a condition severer in the test mode than that in the normal mode. An anomaly is notified to outside by a detection circuit in a case where results are different between the test mode and the normal mode. In a case where a fuse is not completely blown, such a fuse can also be detected in the test mode to exclude a defective chip.