Abstract: In an electronic component, a first terminal electrode is disposed on a first side surface and extends to a second principal surface. A second terminal electrode is disposed on a second side surface and extends to the second principal surface. A third terminal electrode is disposed on a third side surface and extends to the second principal surface. A fourth terminal electrode is disposed on a fourth side surface and extends to the second principal surface. Maximum values of thicknesses of portions located on the second principal surface of the third and fourth terminal electrodes are smaller than maximum values of thicknesses of portions located on the second principal surface of the first and second terminal electrodes.

Abstract: A capacitor includes a capacitor main body with first and second primary surfaces and first through fourth side surfaces, internal electrodes, and first through fourth terminal electrodes, wherein the third terminal electrode includes a first electrode layer provided on the third side surface and a second electrode layer provided on the first electrode layer, the fourth terminal electrode includes a third electrode layer provided on the fourth side surface and a fourth electrode layer provided on the third electrode layer, the first electrode layer includes a conductive material and Si, the second electrode layer includes a conductive material and Si, and a ratio by weight of Si in the first electrode layer is greater than a ratio by weight of Si in the second electrode layer.

Abstract: In a multilayer ceramic electronic component, internal electrodes arranged inside a ceramic body include exposed ends that are connected to end surfaces of the ceramic body. External electrodes, which are arranged on the end surfaces so as to be electrically connected to the internal electrodes, include first conductive portions that are arranged on the end surfaces so as to cover the exposed ends but so as not to wrap around onto the side surfaces, and include second conductive portions that are arranged on the end surfaces so as to cover the first conductive portions and so as to wrap around onto the principal surfaces and the side surfaces. In each external electrode, protruding portions are arranged on the end surface adjacent to the first conductive portion to stabilize the posture of the ceramic body when the second conductive portions are being formed.

Abstract: A capacitor includes a capacitor main body with first and second primary surfaces and first through fourth side surfaces, internal electrodes, and first through fourth terminal electrodes, wherein the third terminal electrode includes a first electrode layer provided on the third side surface and a second electrode layer provided on the first electrode layer, the fourth terminal electrode includes a third electrode layer provided on the fourth side surface and a fourth electrode layer provided on the third electrode layer, the first electrode layer includes a conductive material and Si, the second electrode layer includes a conductive material and Si, and a ratio by weight of Si in the first electrode layer is greater than a ratio by weight of Si in the second electrode layer.

Abstract: In an electronic component, a first terminal electrode is disposed on a first side surface and extends to a second principal surface. A second terminal electrode is disposed on a second side surface and extends to the second principal surface. A third terminal electrode is disposed on a third side surface and extends to the second principal surface. A fourth terminal electrode is disposed on a fourth side surface and extends to the second principal surface. Maximum values of thicknesses of portions located on the second principal surface of the third and fourth terminal electrodes are smaller than maximum values of thicknesses of portions located on the second principal surface of the first and second terminal electrodes.

Abstract: A capacitor includes first and second grounding terminal electrodes each including first and second electrode layers. The first electrode layers are provided on third and fourth side surfaces. The second electrode layers are provided on the first electrode layers. The first and the second electrode layers each include Si and a conductive material. A ratio by weight of Si in the first electrode layer is higher than a ratio by weight of Si in the second electrode layer.

Abstract: Two or more outer-layer dummy conductors are successively arranged at predetermined intervals in the height direction, thereby forming a plurality of outer-layer dummy groups. Given that an interval between the adjacent outer-layer dummy conductors within each of the outer-layer dummy groups is d and an interval between the adjacent outer-layer dummy groups is g, g is greater than d. On that condition, the outer-layer dummy groups can be positioned satisfactorily apart away from each other, while plating deposition points are ensured. As a result, pressing of inner electrodes through the outer-layer dummy conductors can be relieved, whereby the distance between the inner electrodes can be prevented from being locally shortened and a reduction of BDV can be prevented.

Abstract: A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.

Abstract: In a multilayer ceramic electronic component, internal electrodes arranged inside a ceramic body include exposed ends that are connected to end surfaces of the ceramic body. External electrodes, which are arranged on the end surfaces so as to be electrically connected to the internal electrodes, include first conductive portions that are arranged on the end surfaces so as to cover the exposed ends but so as not to wrap around onto the side surfaces, and include second conductive portions that are arranged on the end surfaces so as to cover the first conductive portions and so as to wrap around onto the principal surfaces and the side surfaces. In each external electrode, protruding portions are arranged on the end surface adjacent to the first conductive portion to stabilize the posture of the ceramic body when the second conductive portions are being formed.

Abstract: Two or more outer-layer dummy conductors are successively arranged at predetermined intervals in the height direction, thereby forming a plurality of outer-layer dummy groups. Given that an interval between the adjacent outer-layer dummy conductors within each of the outer-layer dummy groups is d and an interval between the adjacent outer-layer dummy groups is g, g is greater than d. On that condition, the outer-layer dummy groups can be positioned satisfactorily apart away from each other, while plating deposition points are ensured. As a result, pressing of inner electrodes through the outer-layer dummy conductors can be relieved, whereby the distance between the inner electrodes can be prevented from being locally shortened and a reduction of BDV can be prevented.

Abstract: A capacitor includes a capacitor body made of a dielectric, a first internal electrode, a second internal electrode, a first signal terminal, a second signal terminal, and a grounding terminal. The first and second signal terminals are connected to the first internal electrode. The grounding terminal is disposed on the outer surface of the capacitor body so as to be connected to the second internal electrode. The grounding terminal is connected to the ground potential. The grounding terminal includes a plating layer which is disposed on the capacitor body and which is connected to the second internal electrode.

Abstract: A noise filter includes a plurality of LC parallel resonant circuits having a plurality of coils which are connected in series and electrically connected to external electrodes at both ends thereof, and capacitors which are connected in parallel to the coils, respectively, and are disposed inside an insulator while being sequentially connected in tandem to signal wires. Resonance frequencies of the respective LC parallel resonant circuits are preferably different from each other. Further, a shield electrode is disposed between the coils, and the shield electrode also defines a capacitance-forming electrode for preventing magnetic coupling between the two coils.

Abstract: A noise filter includes a plurality of LC parallel resonant circuits having a plurality of coils which are connected in series and electrically connected to external electrodes at both ends thereof, and capacitors which are connected in parallel to the coils, respectively, and are disposed inside an insulator while being sequentially connected in tandem to signal wires. Resonance frequencies of the respective LC parallel resonant circuits are preferably different from each other. Further, a shield electrode is disposed between the coils, and the shield electrode also defines a capacitance-forming electrode for preventing magnetic coupling between the two coils.

Abstract: An electronic chip component includes a component body and a plurality of terminal electrodes disposed on outer surfaces of the component body. At least one of the terminal electrodes includes a cured resin film including dispersed conductive particles, an outer conductive film formed on the cured resin film by electroplating, and additional conductive metallic particles being dispersed on an interface between the cured resin film and the outer conductive film.

Abstract: An electronic chip component includes a component body and a plurality of terminal electrodes disposed on outer surfaces of the component body. At least one of the terminal electrodes includes a cured resin film including dispersed conductive particles, an outer conductive film formed on the cured resin film by electroplating, and additional conductive metallic particles being dispersed on an interface between the cured resin film and the outer conductive film.

Abstract: An LC noise filter includes a capacitor unit having a plurality of capacitor electrode patterns and a plurality of insulating layers that are stacked and integrated, and an inductor unit in which a plurality of coil conductor patterns and a plurality of insulating layers are stacked and integrated. In the LC noise filter, the inductor unit and the capacitor unit are stacked, and a cutoff frequency is adjusted in accordance with the distance in the stacked direction between the coil conductor pattern and the capacitor electrode pattern being next to each other in the stacked direction.

Abstract: A multilayered LC composite component includes a main body having a pair of side surfaces, a pair of end surfaces, and an upper surface and a lower surface. Ground-side terminal electrodes are disposed at the center of the side surfaces and hot-side terminal electrodes are disposed along edges of the side surfaces. Each of the hot-side terminal electrodes includes an end surface extended portion extending to each of the end surfaces. The end-surface extended portion is arranged so that at least the approximate center of each of the end surfaces is exposed.

Abstract: A feedthrough type three-terminal electronic component has a monolithic structure including stacked internal signal electrodes and internal ground electrodes with dielectric layers disposed therebetween Internal dummy electrodes, which essentially do not contribute to electrostatic capacity formation, are disposed in at least one of a region defined by both side portions of internal signal electrodes and an external ground electrode provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion, and a region defined by both side portions of internal ground electrodes and external signal electrodes provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion. Thus, a highly reliable feedthrough type three-terminal electronic component with a uniform sintering state in the monolithic structure, and low resistance, is provided.

Abstract: A multilayered LC composite component includes a main body having a pair of side surfaces, a pair of end surfaces, and an upper surface and a lower surface. Ground-side terminal electrodes are disposed at the center of the side surfaces and hot-side terminal electrodes are disposed along edges of the side surfaces. Each of the hot-side terminal electrodes includes an end surface extended portion extending to each of the end surfaces. The end-surface extended portion is arranged so that at least the approximate center of each of the end surfaces is exposed.

Abstract: A feedthrough type three-terminal electronic component has a monolithic structure including stacked internal signal electrodes and internal ground electrodes with dielectric layers disposed therebetween Internal dummy electrodes, which essentially do not contribute to electrostatic capacity formation, are disposed in at least one of a region defined by both side portions of internal signal electrodes and an external ground electrode provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion, and a region defined by both side portions of internal ground electrodes and external signal electrodes provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion. Thus, a highly reliable feedthrough type three-terminal electronic component with a uniform sintering state in the monolithic structure, and low resistance, is provided.