Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: Disclosed is a method for preparing polyvinyl alcohol fibers which comprises spinning an aqueous solution of polyvinyl alcohol containing boric acid or a borate and from about 0.01-5 weight per cent based on said polyvinyl alcohol of an additive comprising an amino acid, an amine, salicylic acid and derivatives thereof or a derivative of pyridine into an alkaline coagulation bath, and subsequently treating the resultant spun fiber by roller drawing, neutralizing with acid, wet hot drawing, washing with water, drying and dry hot drawing.