Patents by Inventor Shigekazu Sakai
Shigekazu Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942495Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.Type: GrantFiled: June 21, 2019Date of Patent: March 26, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Daisuke Chino, Hiroyuki Shigeta, Shigekazu Ishii, Koyo Hosokawa, Hirohisa Yasukawa, Mitsuhito Kanatake, Kosuke Hareyama, Yutaka Ootaki, Kiyohisa Sakai, Atsushi Tsukada, Hirotaka Kobayashi, Ninao Sato, Yuki Yamane
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Publication number: 20190275639Abstract: To provide a surface treatment method of removing surface defects of a metallic three-dimensional product manufactured by a three-dimensional modeling method. According to the present invention, there is provided a surface treatment method of removing surface defects of a metallic three-dimensional product W manufactured by a three-dimensional modeling method, the surface treatment method including the steps of preparing the three-dimensional product, and injecting a first injecting material toward a surface of the three-dimensional product to make the first injecting material hit against the surface, wherein the first injecting material is particles having corners, and the level difference between layers of a three-dimensional product surface is removed by the corners.Type: ApplicationFiled: September 4, 2017Publication date: September 12, 2019Applicant: Sintokogio, Ltd.Inventors: Hideyuki KIBAYASHI, Shigekazu SAKAI
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Patent number: 9039131Abstract: A method for producing an inkjet head may include, the inkjet head having: a head substrate having a plurality of piezoelectric elements, a wiring substrate having wiring lines through which electric power is fed to the respective piezoelectric elements through the drive electrodes, the method having: pressure-welding the wiring substrate to the head substrate by heat through resin adhesive sections made of a thermosetting resin so that the drive electrodes are electrically connected to the wiring lines through solder bumps; and joining the head substrate to the wiring substrate, wherein a melting point TB[° C.] of the solder bumps and a cure initiation temperature TR[° C.] of the resin adhesion sections meet a relation (TR[° C.]?TB[° C.]?TR+30[° C.]).Type: GrantFiled: May 25, 2012Date of Patent: May 26, 2015Assignee: KONICA MINOLTA, INC.Inventors: Yasuo Nishi, Shigekazu Sakai, Koujiro Yoshida
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Patent number: 8979246Abstract: The object is to provide an inkjet head unit having: head chips having nozzles arranged on nozzle faces, and capable of discharging ink by respective independent pressure generating module from pressure chambers communicating with the nozzles; and a tabular head unit base on which the head chips are arranged and which is capable of holding the head chips, of abutting faces of the head unit base and the head chip, at least one of the abutting face on the head unit base side and the abutting face on the head chip side is formed in a stepped shape, so that the height of the abutting face of the head chip relative to the surface of the head unit base is partially changed, and the head chip is thereby attached to be inclined relative to the surface of the head unit base.Type: GrantFiled: December 15, 2011Date of Patent: March 17, 2015Assignee: Konica Minolta, Inc.Inventors: Shigekazu Sakai, Yoshifumi Takafuji, Yuichi Machida, Naomi Kubo, Koujiro Yoshida, Yasuo Nishi
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Publication number: 20140092167Abstract: A method for producing an inkjet head may include, the inkjet head having: a head substrate having a plurality of piezoelectric elements, a wiring substrate having wiring lines through which electric power is fed to the respective piezoelectric elements through the drive electrodes, the method having: pressure-welding the wiring substrate to the head substrate by heat through resin adhesive sections made of a thermosetting resin so that the drive electrodes are electrically connected to the wiring lines through solder bumps; and joining the head substrate to the wiring substrate, wherein a melting point TB[° C.] of the solder bumps and a cure initiation temperature TR[° C.] of the resin adhesion sections meet a relation (TR[° C.]?TB[° C.]?TR+30[° C.]).Type: ApplicationFiled: May 25, 2012Publication date: April 3, 2014Applicant: KONICA MINOLTA, INC.Inventors: Yasuo Nishi, Shigekazu Sakai, Koujiro Yoshida
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Publication number: 20130271528Abstract: The object is to provide an inkjet head unit having: head chips having nozzles arranged on nozzle faces, and capable of discharging ink by respective independent pressure generating module from pressure chambers communicating with the nozzles; and a tabular head unit base on which the head chips are arranged and which is capable of holding the head chips, of abutting faces of the head unit base and the head chip, at least one of the abutting face on the head unit base side and the abutting face on the head chip side is formed in a stepped shape, so that the height of the abutting face of the head chip relative to the surface of the head unit base is partially changed, and the head chip is thereby attached to be inclined relative to the surface of the head unit base.Type: ApplicationFiled: December 15, 2011Publication date: October 17, 2013Applicant: KONICA MINOLTA, INC.Inventors: Shigekazu Sakai, Yoshifumi Takafuji, Yuichi Machida, Naomi Kubo, Koujiro Yoshida, Yasuo Nishi
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Publication number: 20030113486Abstract: A photographic film container made of a metallic material comprising: a metallic support; an antirust coating comprising no hexavalent chromium on at least one side of the metallic support; and a paint coating on the antirust coating, wherein when the metallic material is subjected to the bend test of 180 degrees using a mandrel having a diameter of 2 mm in accordance with JIS-K-5600-5-1 and the bent portion of the metallic material is evaluated in accordance with JIS-K-5600-8-1, the flaking grade of the coatings of the metallic material determined by JIS-K-5600-8-5 is within 1 to 4 grade.Type: ApplicationFiled: October 15, 2002Publication date: June 19, 2003Applicant: KONICA CORPORATIONInventors: Shigekazu Sakai, Hideo Ishii
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Publication number: 20020077042Abstract: In a high accuracy blast processing method of the present invention which is a blast processing method for processing a substrate by injecting an injection material from a nozzle by compressed air, injection of the injection material is either intermittent injection for repeating the injection and injection stop at short intervals or a combination of the intermittent injection and continuous injection. By doing so, even if a processing progresses, processing efficiency is not deteriorated and a non-processing target region is not damaged even without using a mask. A high accuracy blast processing apparatus of the present invention consists of a nozzle unit forcedly feeding the injection material to the nozzle by the compressed air and a work table moving the substrate horizontally and vertically. A solenoid valve for injecting and stopping the injection material and a control unit outputting an intermittent operating signal to the solenoid valve are connected to the nozzle unit.Type: ApplicationFiled: October 11, 2001Publication date: June 20, 2002Inventors: Moriyasu Izawa, Noboru Watanabe, Yasuo Hobo, Shigekazu Sakai
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Patent number: 5944186Abstract: In a roll photosensitive material package composed of a roll photosensitive material scroll and a light shielding side member provided to each side of the roll photosensitive material scroll, the light shielding side member has a surplus portion projecting from the outer circumferential surface of the roll photosensitive material scroll, and the surplus portion is bent at the edge of the outer circumferential surface, folded at plural points and superimposed on the outer circumferential surface. The folded superimposed sections 0 of the surplus portion are composed of peak creases and bottom creases, the peak creases are superimposed around the bottom creases and the folded superimposed sections are provided with a substantially equal pitch, and a direction of each bottom crease has an inclination angle .alpha. to the axis of the core, when the peak creases are superimposed around the bottom creases, a direction of each peak crease has an inclination angle .beta.Type: GrantFiled: April 28, 1998Date of Patent: August 31, 1999Assignee: Konica CorporationInventors: Shigekazu Sakai, Manabu Watanabe, Manabu Toyonaga
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Patent number: 5370227Abstract: A film cartridge container which can accommodate two film cartridges with short film tongues projecting straight from the cartridges. The film cartridge container has devices for fixing the film cartridges in the container and for attaching another film cartridge container by lid and bottom so that many containers can be stack for display.Type: GrantFiled: January 21, 1994Date of Patent: December 6, 1994Assignee: Konica CorporationInventors: Osamu Shibazaki, Toshiyuki Ikariya, Shigekazu Sakai
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Patent number: 5070782Abstract: A screen printer comprising a squeegee for applying a printing material to a work face when the squeegee moves on an upper side face of a screen while being kept in contact therewith, a doctor for uniforming a thickness of the printing material left on the upper side face of the screen, and a cleaner including a scraping bucket which moves on the underside face of the screen while being kept in contact therewith so as to scrape the printing material attached to the underside face of the screen upon applying operation of the squeegee. The scraping bucket comprises a bucket body formed into a concave shape with an open top in profile, and a scraping strip formed on an end of one side wall of the bucket body, which is inclined toward an advance direction of the scraping bucket.Type: GrantFiled: June 5, 1990Date of Patent: December 10, 1991Assignees: Tokai Shoji Co., Ltd., Tokai Seiki Co., Ltd.Inventors: Shigekazu Sakai, Masahiko Ishida
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Patent number: 4876957Abstract: An apparatus for applying an emulsion screen film of screen-printing is disclosed, which includes a support frame for vertically supporting a screen-printing plate and for holding a rolled emulsion screen film above the screen-printing plate, a film guiding- and cutting-mechanism for guiding and positioning the unrolled emulsion screen film in contact with a screen surface of the screen-printing plate from its upper portion and for cutting the film at a predetermined length, and a pressing- and applying-mechanism for pressing the emulsion screen film against the screen surface at its lower portion and for supplying an emulsion onto an opposite side of the screen surface relative to the contacted screen side while sliding upwardly in contact with the screen surface.Type: GrantFiled: September 14, 1987Date of Patent: October 31, 1989Assignees: Tokai Shoji Co., Ltd., Tokai Seiki Co., Ltd.Inventor: Shigekazu Sakai