Abstract: Provided is a foamed urethane containing a cushion material, the foamed urethane containing a hard segment and a soft segment, in which the foamed urethane is a reaction cured product formed using an isocyanate component of an MDI compound. In a first aspect, a spin-spin relaxation time (T2) of the hard segment in the foamed urethane is from 20 ?sec to 40 ?sec, and a volume abundance ratio of the hard segment is from 5% to 40%. In a second aspect, a foamed urethane includes: a first region in which T2 of the hard segment is from 30 ?sec to 40 ?sec, and a volume abundance ratio of the hard segment is from 10% to 40%, and a second region in which T2 of the hard segment is from 20 ?sec to less than 30 ?sec, and a volume abundance ratio of the hard segment is from 5% to 40% in a H1 solid-state pulse NMR measurement, and which is adjacent to the first region.

Abstract: Provided is a foamed urethane containing a cushion material, the foamed urethane containing a hard segment and a soft segment, in which the foamed urethane is a reaction cured product formed using an isocyanate component of an MDI compound. In a first aspect, a spin-spin relaxation time (T2) of the hard segment in the foamed urethane is from 20 ?sec to 40 ?sec, and a volume abundance ratio of the hard segment is from 5% to 40%. In a second aspect, a foamed urethane includes: a first region in which T2 of the hard segment is from 30 ?sec to 40 ?sec, and a volume abundance ratio of the hard segment is from 10% to 40%, and a second region in which T2 of the hard segment is from 20 ?sec to less than 30 ?sec, and a volume abundance ratio of the hard segment is from 5% to 40% in a H1 solid-state pulse NMR measurement, and which is adjacent to the first region.

Abstract: A base material for a solar cell module includes a base material film including at least one layer and a coating layer including at least one layer and formed on one surface or both surfaces of the base material film. The coating layer is a copolymer layer obtained by curing a liquid coating film consisting of an acrylic-based resin component consisting of metal alkoxide having a first reactive functional group, an acrylic-based monomer having a second reactive functional group that reacts with the first reactive functional group, and an acrylic-based monomer without the second reactive functional group; and an ethylene-based resin component having a carboxyl group binding to the first reactive functional group of metal alkoxide and including an ethylene monomer, a vinyl acetate monomer, and a monomer of carboxylic acid vinyl esters other than vinyl acetate.

Abstract: The solar cell sealant sheet of the present invention includes a coating film of a water-soluble thermosetting resin-dispersed paint obtained by emulsion-polymerizing a monomer mixture containing an ?,?-ethylenically unsaturated monomer having an alkoxysilyl group in a presence of a resin serving as a dispersant, the resin having a quaternized ammonium group that has been obtained by addition of a tertiary amine compound and an organic acid to having an epoxy group, wherein a hardness (B) in terms of a pencil hardness of the coating film after being thermally cured is 4B or higher, and a hardness ratio (B/A) of the hardness (B) after being thermally cured relative to a hardness (A) before being heated is 1.1 or higher. The sealant-integrated substrate of the present invention includes, as a sealant, the coating film of the water-soluble thermosetting resin-dispersed paint that is integrally layered on a surface on a solar cell element side of a substrate of a solar cell module.

Abstract: The solar cell back surface protection sheet of the present invention includes a substrate film composed of at least one layer, and a coating layer composed of at least one layer and formed on one surface or both surfaces of the substrate film, wherein the coating layer is a ternary copolymer layer formed by curing a coating film of a liquid containing a resin component composed of a metal alkoxide having a reactive functional group (Y), an acrylic monomer having a reactive functional group (X) that is reactive with the reactive functional group (Y), and an acrylic monomer having no reactive functional group (X). The manufacturing method of the present invention can provide a solar cell back surface protection sheet that can satisfy a gas barrier property, an anti-weathering property, and flexibility all together.

Abstract: Provided are a gasket that is less likely to deform and installable with excellent workability when it is installed at a portion to be sealed and that can be produced at low cost, a method of producing the gasket, and a gasket installation method. A previously prepared thermoplastic resin film with a predetermined shape is placed in a metal mold composed of a stationary side metal mold and a movable side metal mold. Then, thermoplastic elastomer as an elastic body is insert molded on the film by an injection molding machine to form a gasket. After the molding, the gasket is removed from the metal molds.

Abstract: A resin composition for a foam is composed of a branched rubbery olefin based soft resin (C) obtained by kneading and reacting an organic peroxide crosslinking type olefin based copolymer rubber (A) and an organic peroxide decomposing type crystalline olefin resin (B), in which the organic peroxide crosslinking type olefin based copolymer rubber (A) is present as a continuous phase as well as the organic peroxide decomposing type crystalline olefin resin (B) is present as a discontinuous phase in its microaggregation structure. This resin composition enables to provide foamed articles which can be used for interior parts for automobiles, have high to low foaming magnifications and a recycling property, and are soft and excellent in cushion property, thermal insulating property and in-mold foam molding property.

Abstract: A resin composition for a foam is composed of a branched rubbery olefin based soft resin (C) where its gel fraction (a weight percentage of an insoluble content after extraction with xylene boiled at 138° C. for 3 hours) is less than 5%, and a volume ratio of a component which exhibits a mobility of less than 400 microseconds at a T2 (spin-spin relaxation) time by proton (H+) pulse nuclear magnetic resonance is 55 to 95%, obtained by kneading and reacting to thicken an organic peroxide crosslinking type olefin based copolymer rubber (A) and an organic peroxide decomposing type crystalline olefin resin (B). By the use of this resin composition, it is possible to provide foamed articles which can be used for interior parts for automobiles, have high to low foaming magnifications and a recycling property, and are soft and excellent in cushion property, thermal insulating property and in-mold foam molding property.

Abstract: In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.

Abstract: A surface decorated foam skin of cross-linked rubbery soft olefin resin, comprising rubbery soft olefin resin, characterizing by having (1) an average cell diameter of 50 to 400 &mgr;m, (2) a crystallinity of 5 to 40% (3) a hysteresis loss of 35% or lower, and (4) an embossing percentage of 40% or higher.

Abstract: A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Abstract: A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Abstract: A foamed pad material for low-pressure compression molding which comprises a crosslinked rubbery olefinic soft resin foam and exhibits (a) a hysteresis loss of not greater than 40%, (b) a gel fraction of 20 to 98%, and (c) a density of 0.025 to 0.30 g/cm.sup.3. This foamed pad material is excellent in heat weldability with core forming materials and exhibits excellent heat resistance, strain resistance, moldability and restoring properties at the time of low-pressure compression molding at which compression and drawing are carried out at high temperatures. Moreover, the foamed pad material can allow the molded skin material to have cushioning properties with high flexibility and further to have improved feeling.

Abstract: An epoxy resin molding material for sealing of electronic components comprising(A) an epoxy resin;(B) a phenolic compound;(C) a resin mixture obtained bydispersing, in a form of particulates, in a dispersion medium which is a portion or all of at least one of the epoxy resin and the phenolic compound, a mixture of a vinyl group-containing organopolysiloxane and a .tbd.SiH group-containing organopolysiloxane whose total volatile loss after heating at 105.degree. C. for three hours is not more than 3% by weight, and allowing the vinyl group-containing organopolysiloxane and the .tbd.SiH group-containing organopolysiloxane to react with each other and to cure; and(D) an inorganic filleris excellent in thermal shock resistance, soldering resistance, moisture resistance, thermal stability, moldability and marking properties.