Patents by Inventor Shigeki Ino
Shigeki Ino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7095125Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.Type: GrantFiled: July 14, 2003Date of Patent: August 22, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
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Patent number: 6894091Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.Type: GrantFiled: June 19, 2001Date of Patent: May 17, 2005Assignee: Shin Etsu Chemical Co., Ltd.Inventors: Shoichi Osada, Toshio Shiobara, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino
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Publication number: 20040034161Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.Type: ApplicationFiled: July 14, 2003Publication date: February 19, 2004Applicant: Shin-Etsu Chemical Co. Ltd.Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
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Patent number: 6630745Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.Type: GrantFiled: April 26, 2000Date of Patent: October 7, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
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Patent number: 6500564Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.Type: GrantFiled: August 18, 2000Date of Patent: December 31, 2002Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Kazuhiro Arai, Hidenori Mizushima, Shigeki Ino, Yasuo Kimura, Takayuki Aoki
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Publication number: 20020016398Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.Type: ApplicationFiled: June 19, 2001Publication date: February 7, 2002Inventors: Shoichi Osada, Toshio Shiobara, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino
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Patent number: 6342309Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.Type: GrantFiled: August 18, 2000Date of Patent: January 29, 2002Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Shigeki Ino, Yasuo Kimura, Takayuki Aoki, Kazuhiro Arai, Hidenori Mizushima
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Patent number: 6291556Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.Type: GrantFiled: March 24, 2000Date of Patent: September 18, 2001Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara
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Patent number: 6177489Abstract: A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.Type: GrantFiled: January 6, 1998Date of Patent: January 23, 2001Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Satoshi Okuse, Kazutoshi Tomiyoshi, Toshio Shiobara, Takayuki Aoki, Eiichi Asano, Shigeki Ino
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Patent number: 6027812Abstract: An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.Type: GrantFiled: January 14, 1998Date of Patent: February 22, 2000Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Takayuki Aoki, Shigeki Ino, Eiichi Asano, Satoshi Okuse, Kazutoshi Tomiyoshi
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Patent number: 6001901Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.Type: GrantFiled: December 18, 1997Date of Patent: December 14, 1999Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Eiichi Asano, Shigeki Ino, Kazutoshi Tomiyoshi
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Patent number: 5362887Abstract: Novel fluorine-modified acid anhydrides of formula (1) are useful curing agents typically in epoxy resin compositions for encapsulating semiconductor devices. ##STR1## R.sup.1 is a hydrogen atom, substituted or unsubstituted monovalent hydrocarbon group, hydroxyl group, alkoxy group or alkenyloxy group. Rf is a divalent perfluoroalkylene or perfluoropolyether group of the general formula (2): ##STR2## wherein l is an integer of 0 to 8, k and m are integers of 0 to 15, j and n are 0 or 1, with the proviso that j, k, l, m and n are not equal to 0 at the same time.Type: GrantFiled: March 23, 1994Date of Patent: November 8, 1994Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Koji Futatsumori, Kazuhiro Arai, Hisashi Shimizu, Shigeki Ino
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Patent number: 5336786Abstract: Novel organic silicon compounds are based on a benzene ring having two epoxy radicals and an alkoxysilane radical. They are useful as resin modifiers, adhesive aids for epoxy resins, and silane coupling agents. Inorganic fillers such as silica surface treated with the compounds are useful in encapsulating resin compositions.Type: GrantFiled: December 3, 1993Date of Patent: August 9, 1994Assignee: Shin-Etsu Chemical Company, LimitedInventors: Toshio Shiobara, Koji Futatsumori, Satoshi Okuse, Takayuki Aoki, Miyuki Wakao, Shigeki Ino