Patents by Inventor Shigeki Ogata

Shigeki Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11589734
    Abstract: An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: February 28, 2023
    Assignee: I-PRO CO., LTD.
    Inventors: Shigeki Ogata, Naomi Shirai
  • Publication number: 20210161369
    Abstract: An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 3, 2021
    Applicant: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
    Inventors: Shigeki OGATA, Naomi SHIRAI
  • Patent number: 10973394
    Abstract: An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: April 13, 2021
    Assignee: PANASONIC l-PRO SENSING SOLUTIONS CO., LTD.
    Inventors: Shigeki Ogata, Naomi Shirai
  • Patent number: 10820789
    Abstract: An endoscope system includes a first light source that emits visible light, a second light source that emits non-visible light, an image sensor that generates a first image including a subject through first photoelectric conversion using the visible light and generates a second image including a subject that emits fluorescence emission light due to excitation by the non-visible light through second photoelectric conversion using the non-visible light, and an output device that alternately switches between and outputs the first image and the second image. The second light source starts light emission by a predetermined time before start of the second photoelectric conversion due to driving of the driving circuit.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: November 3, 2020
    Assignee: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
    Inventors: Shigeki Ogata, Yoshitaka Kitaoka, Naoto Matsuo, Haruhiko Kohno, Kunihiko Hara
  • Publication number: 20200288948
    Abstract: An endoscope includes a scope provided with a hard portion at a distal end of a long flexible portion having flexibility; an image capturing portion housed in the hard portion and having an image sensor; a transmission cable inserted into the scope and conductively connected to the image sensor at a distal end via a substrate, and a voltage conversion device mounted on the substrate and outputting a constant voltage to the image sensor with respect to a input voltage input to the transmission cable.
    Type: Application
    Filed: February 7, 2020
    Publication date: September 17, 2020
    Applicant: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
    Inventors: Shigeki OGATA, Naomi SHIRAI
  • Publication number: 20160317003
    Abstract: An endoscope system includes a first light source that emits visible light, a second light source that emits non-visible light, an image sensor that generates a first image including a subject through first photoelectric conversion using the visible light and generates a second image including a subject that emits fluorescence emission light due to excitation by the non-visible light through second photoelectric conversion using the non-visible light, and an output device that alternately switches between and outputs the first image and the second image. The second light source starts light emission by a predetermined time before start of the second photoelectric conversion due to driving of the driving circuit.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 3, 2016
    Inventors: Shigeki OGATA, Yoshitaka KITAOKA, Naoto MATSUO, Haruhiko KOHNO, Kunihiko HARA
  • Publication number: 20090145651
    Abstract: A multilayer wiring board 1 includes an insulating layer 2, a copper wiring upper layer 3 and a copper wiring lower layer 4 laminated on both surfaces of the insulating layer 2, a through hole 5 pierced through the insulating layer 2 and at least one of the copper wiring layers, and a solder conductor 6 which is filled in the through hole 5 and makes connection and electric continuity between the copper wiring upper layer 3 and the copper wiring lower layer 4, where solder exposed surfaces on which a part of the solder conductor 6 is in contact with the copper wiring upper layer 3 or the copper wiring lower layer 4 and exposed to the outermost surface, and the surfaces of the copper wiring upper layer 3 and the copper wiring lower layer 4 are coated and integrated by plating films 8, and the metal-made plating films 8 are made of a metal having an ionization tendency greater than that of the solder conductor 6.
    Type: Application
    Filed: December 10, 2008
    Publication date: June 11, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Toyokazu YOSHINO, Shinji MORIMOTO, Kouji NAKASHIMA, Shigeki OGATA
  • Patent number: 7543376
    Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: June 9, 2009
    Assignee: Panasonic Corporation
    Inventors: Toyokazu Yoshino, Katsuya Okamoto, Shigeki Ogata, Shinji Morimoto, Kouji Nakashima
  • Patent number: 7488408
    Abstract: The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.
    Type: Grant
    Filed: July 19, 2005
    Date of Patent: February 10, 2009
    Assignee: Panasonic Corporation
    Inventors: Hisahiro Tanaka, Shigeki Ogata
  • Publication number: 20070148829
    Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.
    Type: Application
    Filed: January 12, 2007
    Publication date: June 28, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toyokazu YOSHINO, Katsuya OKAMOTO, Shigeki OGATA, Shinji MORIMOTO, Kouji NAKASHIMA
  • Publication number: 20060272850
    Abstract: An interlayer connection conductor 1 is formed of a substantially spherical interlayer connector that is formed by forced in through holes 108, in a thickness direction, on a flexible printed circuit board having wiring layers 106, 107 on at leas one surface of an insulating layer The interlayer connection conductor includes a small cylindrical piece of metal core 102 formed by cutting a metal fine wire and a solder metal 103 coated around the surface of the metal core.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 7, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shinji MORIMOTO, Toyokazu YOSHINO, Shigeki OGATA, Kouji NAKASHIMA, Katsuya OKAMOTO
  • Publication number: 20060016694
    Abstract: The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.
    Type: Application
    Filed: July 19, 2005
    Publication date: January 26, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hisahiro Tanaka, Shigeki Ogata