Patents by Inventor Shigemasa Saito
Shigemasa Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8371584Abstract: A mark unit includes a holding section that is disposed at the top of a display section so that a light-emitting section is positioned on a side of a display screen of the display section and a weight section is positioned on a side opposite to the display screen to hold the light-emitting section on the side of the display screen that intersects a horizontal plane.Type: GrantFiled: August 12, 2008Date of Patent: February 12, 2013Assignee: Namco Bandai Games Inc.Inventors: Kazuo Utsuki, Takashi Satsukawa, Takehiro Shimizu, Shigemasa Saito, Kanji Nakane
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Publication number: 20090054162Abstract: A mark unit includes a holding section that is disposed at the top of a display section so that a light-emitting section is positioned on a side of a display screen of the display section and a weight section is positioned on a side opposite to the display screen to hold the light-emitting section on the side of the display screen that intersects a horizontal plane.Type: ApplicationFiled: August 12, 2008Publication date: February 26, 2009Applicant: NAMCO BANDAI GAMES INC.Inventors: Kazuo UTSUKI, Takashi SATSUKAWA, Takehiro SHIMIZU, Shigemasa SAITO, Kanji NAKANE
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Publication number: 20080070686Abstract: A gun-type controller includes a main grip and a subgrip respectively provided to the rear portion and the front portion of a barrel. The view point direction of a view point camera CM is input using a main lever provided at a position reached by the thumb when holding the main grip with the right hand, and the moving direction of a player's character PC is input using a sublever provided at a position reached by the thumb when holding the subgrip with the left hand.Type: ApplicationFiled: September 19, 2007Publication date: March 20, 2008Applicant: NAMCO BANDAI GAMES INC.Inventors: Takashi Satsukawa, Takehiro Shimizu, Shigemasa Saito, Masanao Kuroda
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Publication number: 20080064500Abstract: A gun-type controller has an outward appearance imitating an automatic rifle in which a main grip and a subgrip extend from a barrel, and is used in a state in which the player holds the gun-type controller in the forward/backward direction and aims a muzzle at a screen. A view point direction lever for inputting the view point direction of a player's character is provided at a position at which the thumb reaches the view point direction lever when the player holds the main grip with the right hand, and a moving direction lever for inputting the moving direction of the player's character is provided at a position at which the thumb reaches the moving direction lever when the player holds the main grip with the left hand.Type: ApplicationFiled: September 11, 2007Publication date: March 13, 2008Applicant: NAMCO BANDAI GAMES INC.Inventors: Takashi Satsukawa, Takehiro Shimizu, Shigemasa Saito, Masanao Kuroda
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Patent number: 6713163Abstract: A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during soldering. The insulator layers are formed of a glass cloth impregnated with an epoxy resin composition. Metal foil layers, in each of which a circuit is formed, are laminated alternately with the insulator layers. The epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide. Inorganic components are provided in the insulator layers as about 8% to about 18% by mass of P2O5, about 20% to about 28% by mass of Al2O3, about 0.1% to about 0.6% by mass of SiO2, about 0.1% to about 1.0% by mass of Cl, about 15% to about 20% by mass of CaO, about 0.3% to about 0.5% by mass of TiO2, about 0.2% to about 0.4% by mass of Fe2O3, and about 0.1% to about 0.3% by mass of SrO, in converted values as measured by an X-ray fluorescence analysis.Type: GrantFiled: December 31, 2002Date of Patent: March 30, 2004Assignee: Fuji Electric Co., Ltd.Inventor: Shigemasa Saito
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Publication number: 20040018348Abstract: A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during soldering. The insulator layers are formed of a glass cloth impregnated with an epoxy resin composition. Metal foil layers, in each of which a circuit is formed, are laminated alternately with the insulator layers. The epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide. Inorganic components are provided in the insulator layers as about 8% to about 18% by mass of P2O5, about 20% to about 28% by mass of Al2O3, about 0.1% to about 0.6% by mass of SiO2, about 0.1% to about 1.0% by mass of Cl, about 15% to about 20% by mass of CaO, about 0.3% to about 0.5% by mass of TiO2, about 0.2% to about 0.4% by mass of Fe2O3, and about 0.1% to about 0.3% by mass of SrO, in converted values as measured by an X-ray fluorescence analysis.Type: ApplicationFiled: December 31, 2002Publication date: January 29, 2004Applicant: Fuji Electric Co., Ltd.Inventor: Shigemasa Saito
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Patent number: 5869890Abstract: A Ceramic Bonding Copper (CBC) substrate used in semiconductor modules includes a ceramic plate having foil-shaped copper plates bonded to the ceramic plate by the direct copper bonding method. A circuit pattern is formed on one of the copper plates. The ceramic plate is fabricated by sintering at high temperature an alumina powder compact containing zirconia and one or more of the following additives: yttria, calcia, magnesia, and ceria. The flexural strength and the thermal conductivity of the alumnina ceramic plate of the invention are remarkably improved, facilitating a reduction in the thickness of the ceramic plate. The reduction in thickness of the CBC substrate further improves the ability of the semiconductor device to radiate heat and therefore increases the current carrying capability of the semiconductor device.Type: GrantFiled: September 30, 1997Date of Patent: February 9, 1999Assignee: Fuji Electric Co., Ltd.Inventors: Masaharu Nishiura, Akira Morozumi, Tomio Shimizu, Katsumi Yamada, Shigemasa Saito
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Patent number: 5675181Abstract: A ceramic substrate is a high-temperature fired body consisting of alumina as the main component, zirconia, and a ceramics sintering assisting agent. The assisting agent is one of yttria, calcia, magnesia, and ceria, in which yttria is added at 0.1-2 wt %, calcia is added at 0.02-0.5 wt %, magnesia is added at 0.02-0.4 wt %, and ceria is added at 0.02-0.5 wt %.Type: GrantFiled: January 19, 1996Date of Patent: October 7, 1997Assignees: Fuji Electric Co., Ltd., Sumitomo Metal Ceramics Inc.Inventors: Masaharu Nishiura, Shigemasa Saito, Akira Morozumi, Shizuyasu Yosida, Katumi Yamada, Toshio Nozaki, Hiroshi Miyama, Seigo Oiwa, Kazuya Matuura, Kazuhiko Teramura
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Patent number: 5486960Abstract: A disk storage device includes a fixed information storage disk that is free from deformation, has a wide effective data storage area and shows excellent anti-mechanical shock properties. Specifically, a disk hole of the information storage disk is fit to a hub coupled to a rotary shaft of a spindle motor until the disk contacts with a flange face of the hub. The spindle motor and the disk are then sandwiched by a lower electrode which contacts with the bottom surface of the spindle motor and an upper electrode which contacts with the upper surface of the disk. A DC power supply applies positive potential to the hub via the lower electrode and the casing of the spindle motor and negative potential to the disk via the upper electrode. An electrostatic junction portion is formed between the bottom face of the disk and the flange face of the hub, thereby securing the disk tightly to the hub.Type: GrantFiled: September 7, 1994Date of Patent: January 23, 1996Assignee: Fuji Electric Co., Ltd.Inventor: Shigemasa Saito
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Patent number: 5084956Abstract: An oil dashpot and a method of producing the oil dashpot pole piece in an electromagnetic tripping apparatus from steel wire rod, wherein the steel wire rod contains phosphorus and sulfur in quantities less than 0.1 percent by weight and wherein the particle size of ferrite in a metal texture of the steel wire rod is between 7 and 8 micrometers, comprising the steps of aligning a predetermined length of steel wire rod in holding die, to form a pole piece first diameter portion and a second diameter portion.Type: GrantFiled: November 20, 1990Date of Patent: February 4, 1992Assignee: Fuji Electric Co., Ltd.Inventors: Shigemasa Saito, Hisashi Fujitaka
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Patent number: 4523711Abstract: The method of bonding silver-based contact is disclosed. A silver-based contact is brought into contact with a support, at least the surface of which is made of a cupreous material, with a pressure of less than 1 kgf/cm.sup.2 exerted therebetween. The contact and support are heated in a non-oxidizing atmosphere at a temperature of more than 700.degree. C.Type: GrantFiled: September 14, 1981Date of Patent: June 18, 1985Assignee: Fuji Electric Co., Ltd.Inventors: Kazuo Kondo, Seiji Imamura, Shigemasa Saito, Mamoru Akimoto, Mitsuo Sunaga
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Patent number: 4392302Abstract: A contact member for a switching device is formed by soldering a contact tip to a movable contact member. The movable member is formed from an age-hardenable copper alloy that has been subjected in series to solution treatment, half age-hardening, grinding and rust-prevention coating.Type: GrantFiled: December 23, 1980Date of Patent: July 12, 1983Assignee: Fuji Electric Company, Ltd.Inventor: Shigemasa Saito
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Patent number: 4369077Abstract: A method of manufacturing stationary electromagnetic cores utilizes mild steel having a carbon content of up to 0.01% by weight and an impurity content of less than 0.31% by weight. Use of this material lowers the cost of manufacturing electromagnetic cores by shortening the drawing process and obviating the necessity for magnetic annealing.Type: GrantFiled: October 24, 1980Date of Patent: January 18, 1983Assignee: Fuji Electric Company, Ltd.Inventor: Shigemasa Saito