Abstract: The present invention provides a object detection device for vehicle capable of performing distance measurement more reliably than in the past and having high compatibility for distance measurement. The present invention provides an object detection device 100 for vehicle including a first detection unit 10, a second detection unit 20, an error quantity calculation unit 30, a correction quantity calculation unit 40, and a distance correction unit 50. The error quantity calculation unit 30 compares the distances D1 and D1? of the same object detected by the first detection unit 10 and the second detection unit 20 to calculate the error quantity ?D. The correction quantity calculation unit 40 calculates the correction quantity CAt based on the error quantity ?D. The distance correction unit 50 corrects the distances D1? and D2? of the object detected by the second detection unit 20 based on the correction quantity CAt.

Abstract: A design support method executed by a computer includes: detecting a layout position of a first terminal in a cell as a first layout position from layout data including a cell of a macro which is arranged at a plurality of orientations, the first terminal being arranged at a first orientation; calculating a second layout position of a first terminal which is arranged at a second orientation which is different from the first orientation based on a variation from the first orientation to the second orientation and the first layout position; associating the second layout position with the first layout position and the layout data; and outputting an association result.

Abstract: The method of designing a semiconductor integrated circuit of the embodiment is characterized in: reading from a memory unit a fundamental property value of a cell constituting a semiconductor integrated circuit in a case in which a variation of a property value is not taken into consideration, and reading from a memory unit variation coefficients of the property value of the cell corresponding to a dimension of a transistor constituting the cell; and performing a static timing analysis on the semiconductor integrated circuit by using the read variation coefficients and fundamental property value.

Abstract: A design support method executed by a computer includes: detecting a layout position of a first terminal in a cell as a first layout position from layout data including a cell of a macro which is arranged at a plurality of orientations, the first terminal being arranged at a first orientation; calculating a second layout position of a first terminal which is arranged at a second orientation which is different from the first orientation based on a variation from the first orientation to the second orientation and the first layout position; associating the second layout position with the first layout position and the layout data; and outputting an association result.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: The method of designing a semiconductor integrated circuit of the embodiment is characterized in: reading from a memory unit a fundamental property value of a cell constituting a semiconductor integrated circuit in a case in which a variation of a property value is not taken into consideration, and reading from a memory unit variation coefficients of the property value of the cell corresponding to a dimension of a transistor constituting the cell; and performing a static timing analysis on the semiconductor integrated circuit by using the read variation coefficients and fundamental property value.

Abstract: A semiconductor integrated circuit, includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: OCV coefficients in a path being an analysis target according to the number of gate stages are calculated in a coefficient arithmetically operating unit by canceling off a variation in delay in each gate in accordance with the number of gate stages in the target path, and timing analysis of the target path is performed in a timing analysis unit by using the OCV coefficient with the number of gate stages being considered, whereby a variation degree in the entire path is reduced in accordance with the number of gate stages in the target path, thus making it possible to carry out accurate timing analysis in consideration of the variation in a chip of a semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: After automatic cell placement, the following steps are performed before performing automatic inter-cell routing. (S22) Estimated wires having Manhattan-length path are connected between same-node terminals of cells, and detected and counted is a crosstalk error that parallel-wire length is more than a predetermined value. (S23) The detected error is resolved by moving cells closely spaced less than a predetermined interval apart and connected to the error-detected estimated wires; the cell movement data is stored in a storage device; and such processes are repeated N times; and the cell placement data is modified on the basis of the cell movement data corresponding to the minimum value of error-count values of all the N times. (S24) If the minimum value is not 0, (S25) a buffer cell is inserted in the error-detected estimated wire.

Abstract: OCV coefficients in a path being an analysis target according to the number of gate stages are calculated in a coefficient arithmetically operating unit by canceling off a variation in delay in each gate in accordance with the number of gate stages in the target path, and timing analysis of the target path is performed in a timing analysis unit by using the OCV coefficient with the number of gate stages being considered, whereby a variation degree in the entire path is reduced in accordance with the number of gate stages in the target path, thus making it possible to carry out accurate timing analysis in consideration of the variation in a chip of a semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.

Abstract: After automatic cell placement, the following steps are performed before performing automatic inter-cell routing. (S22) Estimated wires having Manhattan-length path are connected between same-node terminals of cells, and detected and counted is a crosstalk error that parallel-wire length is more than a predetermined value. (S23) The detected error is resolved by moving cells closely spaced less than a predetermined interval apart and connected to the error-detected estimated wires; the cell movement data is stored in a storage device; and such processes are repeated N times; and the cell placement data is modified on the basis of the cell movement data corresponding to the minimum value of error-count values of all the N times. (S24) If the minimum value is not 0, (S25) a buffer cell is inserted in the error-detected estimated wire.

Abstract: A design support apparatus for semiconductor devices that is used to quickly arrange a non-logic cell for reducing electromagnetic radiation from a semiconductor device at the time of designing it. In this design support apparatus for semiconductor devices, a layout section does a layout for logic cells and wiring patterns to connect the logic cells. An arranged site detecting section detects an arranged site, being a site which contains neither the logic cells nor a prohibited area, after a layout is done by the layout section. A non-logic cell pattern store section stores non-logic cell patterns. A prohibited area containing site detecting section detects a prohibited area containing site, being a site which only contains a prohibited area. A non-logic cell arranging section arranges non-logic cells on the arranged site.

Abstract: A semiconductor integrated circuit includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line.