Patents by Inventor Shigeo Iiyama

Shigeo Iiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5676915
    Abstract: A method for desulfurization of an exhaust gas by a solution containing a Mg-based desulfurizing agent, followed by an oxidation step, a double decomposition step, a separation step of separating a slurry of a mixture of Mg(OH).sub.2 and gypsum dihydrate obtained in the double decomposition step, a step of returning a Mg(OH).sub.2 slurry separated in the separation step to the desulfurization step, a step of treating a gypsum dihydrate slurry in the oxidation step to convert accompanying Mg(OH).sub.2 into MgSO.sub.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: October 14, 1997
    Assignee: Toyo Engineering Corporation
    Inventors: Shigeo Iiyama, Kozo Ohsaki, Kenichi Nakagawa
  • Patent number: 4122143
    Abstract: Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.
    Type: Grant
    Filed: May 24, 1976
    Date of Patent: October 24, 1978
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Yoshitaka Momotari, Junji Hara, Tadashi Kitamura, Shigeo Iiyama