Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

Abstract: A method of manufacturing a component built-in module includes a step of preparing a sheet metal; a step of providing a conductive thick-film pad over one main surface of the sheet metal by applying and curing a conductive paste; a step of providing a joining material over the conductive thick-film pad; a step of mounting a chip component onto the conductive thick-film pad with the joining material interposed therebetween; a step of providing a resin layer over the one main surface so as to cover the chip component; and a step of forming a surface electrode by patterning the sheet metal.

Abstract: A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

Abstract: A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

Abstract: To provide a wire rod forming machine for which it is possible to increase the production speed above that of the prior art. In the ring-forming machine 10 of the present configuration, between the respective edges 42 and 51 of the moving die 40 and the fixed punch 50, a prescribed location of the belt-shaped wire rod 90 is sheared and the ring 91 is cut off from the belt-shaped wire rod 90. Then, by pushing the ring 91 that was cut off with the moving die 40, the ring is forcibly removed from the forming tools 31, 32 and 33. Therefore, the speed of removal of the ring 91 can be coupled to the acceleration of the manufacturing speed and increased, allowing the production speed to be improved compared to that of the prior art. In addition, since the ring 91 that is cut off from the belt-shaped wire rod 90, pushed by the moving die 40, moves to the end side of the shaft shaped chute 34 to be collected, transport to the next process becomes easy.

Abstract: To provide a wire rod forming machine for which it is possible to increase the production speed above that of the prior art. In the ring-forming machine 10 of the present configuration, between the respective edges 42 and 51 of the moving die 40 and the fixed punch 50, a prescribed location of the belt-shaped wire rod 90 is sheared and the ring 91 is cut off from the belt-shaped wire rod 90. Then, by pushing the ring 91 that was cut off with the moving die 40, the ring is forcibly removed from the forming tools 31, 32 and 33. Therefore, the speed of removal of the ring 91 can be coupled to the acceleration of the manufacturing speed and increased, allowing the production speed to be improved compared to that of the prior art. In addition, since the ring 91 that is cut off from the belt-shaped wire rod 90, pushed by the moving die 40, moves to the end side of the shaft shaped chute 34 to be collected, transport to the next process becomes easy.

Abstract: A power steering system having an electric motor and including an input shaft fixed to a steering wheel, an output shaft coupled to the motor via a reduction gear, and a torsion bar provided between the input and output shafts, the output shaft being rotatable by the resultant of a manual torque for rotating the wheel and the torque of the motor. The system comprises a sensor for detecting the relative angular displacement between the input shaft and the output shaft, and a microcomputer having stored therein the relationship between the relative angular displacement and the motor current target value for determining the direction of rotation of the motor and a motor current target value from the output of the sensor to produce outputs.