Abstract: An IC card having a simple construction whereby deterioration of the connector and internal circuits of an unused IC card is prevented at the seaside and in such inclement environmental conditions as outdoors in the rain, and penetration of water, dust, and foreign contaminants to the connector is prevented after the IC card is used. The IC card has a female connector with a plurality of pin insertion holes, and a seal that is waterproof, insulative and pierceable by a pin of the male connector, and covers the open front of all pin insertion holes of the female connector.

Abstract: There is provided an IC card and manufacturing method thereof assuring a highly reliable fixed portion in fixing upper and lower panel members to a frame made of resin as well as an advantage in terms of manufacturing cost. In the IC card in which a pair of upper and lower panel members covering card planar portions are respectively fixed to the upper and the lower surfaces of a resin frame which supports a peripheral portion of an electric circuit board and a connector attached to an end portion of the electric circuit board, the panel members have their peripheral edge portions which are provided with a bent portion extending along the peripherial edge portions and are formed by bending the panel material at a specified angle, and a welding use resin layer is formed on the surface of the bent portion and the periphery of the planar portion of the panel member.

Abstract: An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.

Abstract: An IC card that allows fixing the obverse and reverse metal panels to the plastic frame without using adhesion and allows to make conducting electrically between both the metal panels. The IC card 1 includes an electrical circuit board 3 in which electronic components 4 are incorporated, a connector 5 to be connected to an end portion of the electric circuit board, a frame 2 which constitutes an outer frame of the card and a pair of metal panels 6, 7 which cover an obverse and reverse sides of the card.

Abstract: In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

Abstract: There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.

Abstract: Upper and lower exterior members are coupled together without using ultrasonic welding process. Upper and lower metal panels are brought into electrical conduction therebetween with simple construction. In an IC card having an assembly structure wherein an upper exterior member is formed by integrating an upper frame with an upper metal panel, while a lower exterior member is formed by integrating a lower frame with a lower metal panel; and wherein an electric circuit board with specified electronic components incorporated therein and a connector to be connected to the electric circuit board are provided, in which the arrangement of the upper exterior member and the lower exterior member are coupled with each other, by which the IC card is assembled.

Abstract: An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

Abstract: A semiconductor device card receiving a circuit substrate (1) which has electronic component parts (2) assembled therein, comprises a pair of metal sheets (10, 10) forming a front and a back surfaces of the card and a pair of opposed resin-made frames (11, 12) surrounding peripheries of the respective metal sheets to be connected by embedding bent portions 100 of the peripheries of the metal sheets (10, 10) into the resin-made frames (11, 12), and the paired opposed frames are provided at their contact end portions with fusible projections (13) and grooves (14) adapted to engage with the projections (13) and are connected to each other by fusing at least a leading end of the projection (13) within the groove (14).

Abstract: IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

Abstract: An IC card includes a first cover including a first flat panel portion and a first upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion, and a second cover including a second flat panel portion and a second upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion. The first upright wall portion defines a chamber in cooperation with a portion of the first flat panel portion. The first and second covers are mated together with the first and second upright wall portions bonded together in a butt fashion.

Abstract: An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used.

Abstract: An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

Abstract: An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfaces of a flange portion of the connector body opposing a surface with which the connection with an external unit is established, the grooves being adjacent the connector body and extending lengthwise along all of the longer side of the IC memory card for preventing warping.

Abstract: An IC card includes a circuit board for mounting electronic parts, a frame surrounding the circuit board, and panel covering each of the front and back sides of the circuit board and the frame. Spacers serving as supporting members are adhered to the circuit board by soldering. Soldering can be performed by the same process as soldering electronic parts to the circuit board so as to prevent deformation of the panels and application of excessive force to the electronic parts even if an external force is applied to the panels.

Abstract: An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

Abstract: An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

Abstract: An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

Abstract: An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in the main substrate receive electronic components installed on the sub-substrates. Such an arrangement makes it possible to provide four layers of electronic components within an IC card.

Abstract: A connector-supporting element of a main frame of an IC card and a sub-frame receive holding parts of a connector. The connector-supporting element has barriers having a height of at least one-half that of the holding parts for receiving the barriers and a force applied in the direction along bonded surfaces of the connector-supporting element and the sub-frame. Oblique surfaces are respectively provided on each of the barriers and there is a positional deviation in the parts.