Patents by Inventor Shigeru Kikuchi

Shigeru Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10177069
    Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: January 8, 2019
    Assignee: HITACHI LTD.
    Inventors: Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa, Mutsuhiro Mori, Eiichi Ide, Toshiaki Morita, Akitoyo Konno, Taigo Onodera, Tatsuya Miyake, Akihiro Miyauchi
  • Publication number: 20170236768
    Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.
    Type: Application
    Filed: September 9, 2015
    Publication date: August 17, 2017
    Applicant: HITACHI, LTD.
    Inventors: Takashi NAITO, Motomune KODAMA, Takuya AOYAGI, Shigeru KIKUCHI, Takashi NOGAWA, Mutsuhiro MORI, Eiichi IDE, Toshiaki MORITA, Akitoyo KONNO, Taigo ONODERA, Tatsuya MIYAKE, Akihiko MIYAUCHI
  • Publication number: 20160141126
    Abstract: In an electrical contact in which aggregation phases including Cu are dispersed in a matrix phase including Mo, Cr, and Cu, a maximum grain size of the aggregation phases falls in a range of 4 to 20 ?m and, when the total Cu content in the electrical contact is denoted by Wt, the Cu content in the matrix phase is expressed by C×Wt, where C ranges from 0.54 to 0.81. A process for producing an electrical contact including Mo, Cr, and Cu includes a step of compacting mixed Mo and Cr powders, thus forming a powder-compression compact and a step of making the powder-compression compact infiltrated with molten Cu.
    Type: Application
    Filed: September 5, 2014
    Publication date: May 19, 2016
    Inventors: Shigeru KIKUCHI, Kunihiko TOMIYASU, Kenji TSUCHIYA, Takashi SATO, Ayumu MORITA
  • Publication number: 20140076852
    Abstract: Provided an electrical contact is cheap, excellent workability and lasts the effect of chopping current reduction. An electrical contact comprising a Cu matrix, and compounds Cu and low melting point metal which are dispersed in the Cu matrix, wherein a vapor pressure of the low melting point metal is more than 105 Pa at 1000° C., the compound has stoichiometric ratio which is the value of the low melting metal/Cu is greater than 0.5, and a longitudinal direction of the compound is oriented at an angle of 90°±10° to the contact surfaces. The method of the electrical contact is stretching mixture the Cu matrix with the compounds at 70-85% while heating, using as a contact surfaces of the electrical contact.
    Type: Application
    Filed: August 22, 2013
    Publication date: March 20, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Shigeru KIKUCHI, Ayumu MORITA, Kenji TSUCHIYA, Masato YABU, Akio NAKAZAWA
  • Patent number: 8518508
    Abstract: This invention provides a tube having durability against harsh flexion, shrinkage, torsion, or the like and reduced slip resistance between tubes or upon contact with another member. Such tube is used for a product comprising a site at which a plurality of tubes are fixed at both ends and tied together with each other and/or in contact with another member, and the sites of fixation at the both ends are sites of motion at which reciprocal movement is repeated. Such tube is obtained via extrusion molding of a thermoplastic polyether ester elastomer and has a satin-finished outer surface. The invention also provides a method for preparing such tube.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: August 27, 2013
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aoi Co., Ltd.
    Inventors: Akira Kato, Kinji Hosoya, Teruyuki Hosoya, Shigeru Kikuchi
  • Patent number: 8426754
    Abstract: An electrical contact comprising a contact layer for making a contact with an opposite electrical contact and a high conductive layer in an opposite side of the contact layer, the layers being integrally connected to each other, wherein the contact layer contains Cr, Cu and Te, and the high conductive layer contains copper as a main component, and wherein the high conductive layer is provided with a means for suppressing warp of the contact layer at the time of turning on of the contacts.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: April 23, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Kikuchi, Satoru Kajiwara, Masato Kobayashi, Misuk Yamazaki
  • Patent number: 8294057
    Abstract: An object of the invention is to provide a vacuum switch which can achieve a reduction of an electric loss and an improvement of a heat transmission performance by preventing an air gap portion from being generated between an electrode and a conductor rod and preventing the electrode and the conductor rod from generating any positional displacement. An electrode for a switch in accordance with the invention is provided with the conductor rod, a contact point electrode inserted to the conductor rod, and a coupling plate fixing both the elements to an outer side in a diametrical direction of the conductor rod and the contact point electrode, thereby fixing both the elements.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: October 23, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Miki Yamazaki, Kenji Tsuchiya, Ayumu Morita, Masato Kobayashi, Shuichi Kikukawa, Shigeru Kikuchi
  • Publication number: 20110146827
    Abstract: This invention provides a tube having durability against harsh flexion, shrinkage, torsion, or the like and reduced slip resistance between tubes or upon contact with another member. Such tube is used for a product comprising a site at which a plurality of tubes are fixed at both ends and tied together with each other and/or in contact with another member, and the sites of fixation at the both ends are sites of motion at which reciprocal movement is repeated. Such tube is obtained via extrusion molding of a thermoplastic polyether ester elastomer and has a satin-finished outer surface. The invention also provides a method for preparing such tube.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, AOI CO., LTD.
    Inventors: Akira KATO, Kinji Hosoya, Teruyuki Hosoya, Shigeru Kikuchi
  • Publication number: 20110073567
    Abstract: An object of the invention is to provide a vacuum switch which can achieve a reduction of an electric loss and an improvement of a heat transmission performance by preventing an air gap portion from being generated between an electrode and a conductor rod and preventing the electrode and the conductor rod from generating any positional displacement. An electrode for a switch in accordance with the invention is provided with the conductor rod, a contact point electrode inserted to the conductor rod, and a coupling plate fixing both the elements to an outer side in a diametrical direction of the conductor rod and the contact point electrode, thereby fixing both the elements.
    Type: Application
    Filed: August 16, 2010
    Publication date: March 31, 2011
    Applicant: Hitachi, Ltd.
    Inventors: Miki YAMAZAKI, Kenji Tsuchiya, Ayumu Morita, Masato Kobayashi, Shuichi Kikukawa, Shigeru Kikuchi
  • Publication number: 20100147112
    Abstract: An electrical contact comprising a matrix of an alloy of a high electro-conductive metal and a low melting point metal and particles of a refractory metal dispersed in the matrix. The electrical contact comprises the alloy containing a low melting point metal of at least one of Sn, Te and Be, and the refractory metal is Cr. The alloy comprising the low melting point metal in an amount of 0.5 to 3% by weight and the balance being Cu.
    Type: Application
    Filed: February 19, 2010
    Publication date: June 17, 2010
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba
  • Patent number: 7704449
    Abstract: An electrical contact comprising a matrix of an alloy of a high electro-conductive metal and a low melting point metal and particles of a refractory metal dispersed in the matrix. The electrical contact comprises the alloy containing a low melting point metal of at least one of Sn, Te and Be, and the refractory metal is Cr. The alloy comprising the low melting point metal in an amount of 0.5 to 3% by weight and the balance being Cu.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: April 27, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba
  • Patent number: 7662208
    Abstract: An electrical contact used herein comprises chromium; one of copper and silver; and a carbide, in which the electrical contact comprises a matrix and chromium, the matrix phase mainly comprising one of copper and silver, and the chromium being surrounded by the carbide and dispersed in the matrix. The electrical contact contains 1 to 30 percent by weight of a carbide, with the balance being copper. Another electrical contact contains chromium, copper, and a carbide and has a weight ratio of chromium to the carbide within the range of 1:1.5 to 1:50.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: February 16, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Kikuchi, Ayumu Morita, Masato Kobayashi, Satoru Kajiwara, Noboru Baba
  • Publication number: 20090184274
    Abstract: An electrical contact comprising a contact layer for making a contact with an opposite electrical contact and a high conductive layer in an opposite side of the contact layer, the layers being integrally connected to each other, wherein the contact layer contains Cr, Cu and Te, and the high conductive layer contains copper as a main component, and wherein the high conductive layer is provided with a means for suppressing warp of the contact layer at the time of turning on of the contacts.
    Type: Application
    Filed: January 15, 2009
    Publication date: July 23, 2009
    Inventors: Shigeru Kikuchi, Satoru Kajiwara, Masato Kobayashi, Misuk Yamazaki
  • Publication number: 20080274003
    Abstract: An electrical contact comprising a matrix of an alloy of a high electro-conductive metal and a low melting point metal and particles of a refractory metal dispersed in the matrix. The electrical contact comprises the alloy containing a low melting point metal of at least one of Sn, Te and Be, and the refractory metal is Cr. The alloy comprising the low melting point metal in an amount of 0.5 to 3% by weight and the balance being Cu.
    Type: Application
    Filed: June 25, 2008
    Publication date: November 6, 2008
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba
  • Patent number: 7230304
    Abstract: An electric contact member which is excellent in voltage-proof performance and melt-resistant performance and excellent in mass productivity, and a method of manufacturing thereof, and a vacuum interrupter, a vacuum circuit breaker and a load-break switch for a road side transformer using thereof. The contact member is composed of a base member made of high conductive metal, and a contact layer made of refractory metal and high conductive metal, and the contact layer is formed of a plurality of thermal sprayed layers.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: June 12, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba, Takashi Sato
  • Publication number: 20070007249
    Abstract: An electrical contact used herein comprises chromium; one of copper and silver; and a carbide, in which the electrical contact comprises a matrix and chromium, the matrix phase mainly comprising one of copper and silver, and the chromium being surrounded by the carbide and dispersed in the matrix. The electrical contact contains 1 to 30 percent by weight of a carbide, with the balance being copper. Another electrical contact contains chromium, copper, and a carbide and has a weight ratio of chromium to the carbide within the range of 1:1.5 to 1:50.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 11, 2007
    Inventors: Shigeru Kikuchi, Ayumu Morita, Masato Kobayashi, Satoru Kajiwara, Noboru Baba
  • Publication number: 20060102594
    Abstract: An electrical contact comprising a matrix of an alloy of a high electro-conductive metal and a low melting point metal and particles of a refractory metal dispersed in the matrix. The electrical contact comprises the alloy containing a low melting point metal of at least one of Sn, Te and Be, and the refractory metal is Cr. The alloy comprising the low melting point metal in an amount of 0.5 to 3% by weight and the balance being Cu.
    Type: Application
    Filed: August 19, 2005
    Publication date: May 18, 2006
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba
  • Publication number: 20060081560
    Abstract: An electrode having an electrical contact for a vacuum interrupter, wherein the electrical contact contains silver, copper and tungsten carbide, and wherein an amount of silver is 24 to 67% by weight, an amount of copper is 5 to 20% by weight and the balance being tungsten carbide, a ratio of copper to silver and copper being less than 28%. The disclosure is concerned with a vacuum interrupter, vacuum circuit breaker and other vacuum switches using the electrical contact.
    Type: Application
    Filed: October 19, 2005
    Publication date: April 20, 2006
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba, Takashi Sato
  • Publication number: 20050153534
    Abstract: An electric contact member which is excellent in voltage-proof performance and melt-resistant performance and excellent in mass productivity, and a method of manufacturing thereof, and a vacuum interrupter, a vacuum circuit breaker and a load-break switch for a road side transformer using thereof. The contact member is composed of a base member made of high conductive metal, and a contact layer made of refractory metal and high conductive metal, and the contact layer is formed of a plurality of thermal sprayed layers.
    Type: Application
    Filed: January 3, 2005
    Publication date: July 14, 2005
    Inventors: Shigeru Kikuchi, Masato Kobayashi, Kenji Tsuchiya, Noboru Baba, Takashi Sato
  • Publication number: 20050092714
    Abstract: The present invention relates to an sintered electric contact containing Cr in an amount of 15 to 30% by weight and Cu being balance as main components, 0.05 to 0.5% by weight of Te, 100 to 3000 ppm of O, 7.5 to 900 ppm of Al, and 15 to 750 ppm of Si.
    Type: Application
    Filed: August 20, 2004
    Publication date: May 5, 2005
    Applicant: JAPAN AE POWER SYSTEMS CORPORATION
    Inventors: Shigeru Kikuchi, Noboru baba, Akira Nishijima, Toshimasa Fukai