Abstract: A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.

Abstract: In a set of memory cells selected by one column select line, a memory cell of at least 1 bit is connected to an internal data line that is different from the internal data line to which another memory cell in the same set is connected. An internal data line pair is connected to a data terminal. Thus, data having different logic levels can be written into adjacent memory cells even in an IO compression test mode.

Abstract: A dummy pattern that is inserted to stabilize the form of a transistor active region is implanted with an impurity of the same conductivity type as a well, and the impurity-doped region of the dummy pattern is supplied with a potential through a metal interconnection. Hence, fluctuation of a well potential due to noise hardly occurs, and a semiconductor device enduring latch up, for example, to a greater extent can be provided.

Abstract: I/O lines in an I/O gate-sense amplifier portion are arranged in the order of IOA, /IOB, IOB, and /IOA. As a result, the potentials of adjacent I/O lines are necessarily different at the time of writing/reading the same data to/from a plurality of memory cells during a multi-bit test. Therefore, a short-circuit fault caused between adjacent I/O lines can be detected at the same time.

Abstract: Disclosed is a semiconductor memory device including a normal memory array and preliminary memory array enabling a mutual data transfer. Word lines in the normal memory array and those in the preliminary memory array are controlled by separate row decoders and separate word drivers. Bit lines and sense amplifiers are provided commonly to the normal memory array and the preliminary memory array. When test data is written in a predetermined pattern into the normal memory array, data corresponding to the predetermined pattern is written in advance for each memory cell in the preliminary memory array. Then, after the row decoder and word driver for the preliminary memory array are enabled so that the word lines in the preliminary memory array are activated, the row decoder and word driver for the normal memory array are enabled so that the word lines in the preliminary memory array are activated.

Abstract: A liquid crystal display apparatus comprising: gate signal lines, source signal lines, thin film transistors, terminals, an insulating film and auxiliary lines provided to surround a circumference of a displaying section, wherein source signal lines are grouped into groups; and an extended length of the source signal line in an area outside of the displaying section and a surrounding length of the auxiliary line in the area outside of the displaying section are so determined that source signal lines in a group have intersecting portions only with a specified auxiliary line.

Abstract: In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.

Abstract: A semiconductor memory device includes a plurality of memory blocks, i main row or column select lines extending over the plurality of memory blocks, and a decoder for selecting one of the main row or column select lines in accordance with an applied address signal. The decoder includes i outputs. Each of the memory blocks includes a plurality of memory cells arranged in rows and columns and at least (i+1) sub row or column select lines each for selecting one row or one column of memory cells. A shift redundancy circuit is provided for each of the memory blocks, for connecting the main row or column select line and the sub row or column select line. The shift redundancy circuit includes a switch circuit for connecting one main row or column select line to one of the plurality of adjacent sub row or column select lines, and a circuit for setting a connection path of the switch circuit.

Abstract: A semiconductor device according to the present invention includes on the main surface of a p substrate a storing circuit region and peripheral circuit regions. An n well surrounds a p well including the storing circuit region and a p well including the peripheral circuit regions. As a result, a capacitance element is formed in the semiconductor substrate. It is possible to miniaturize the semiconductor device, and to improve reliability of connection between elements.

Abstract: A chip is divided into at least four regions of two rows and two columns. In each region, memory array blocks are provided between corresponding first control circuits disposed in the column direction at a constant pitch. A column decoder is disposed adjacent to the first control circuit. Second control circuits are disposed corresponding to the first control circuits. The second control circuits excluding the second control circuit on the column decoder side are formed in the same pattern.

Abstract: A semiconductor memory device includes a memory array. The bit line pairs of the odd number order in the memory array belong to a first group, and the bit line pairs of the even number order belong to a second group. A first amplifier is connected to each bit line pair. Corresponding to the first group, write buses read buses and a read/test circuit are provided. Corresponding to the second group, write buses read buses and a read/test circuit are provided. A column decoder selects a plurality of bit line pairs simultaneously at the time of testing. At the time of testing, each of the read/test circuits compares data read out from the plurality of bit line pairs belonging to the corresponding group with a given expected data for providing the comparison result.

Abstract: A plurality of sub chips are formed on a chip. An input/output buffer region is arranged around the plurality of sub chips. Each sub chip includes a sub chip control circuit region and a plurality of memory cell array blocks. Each memory cell array block includes a memory cell array region, a row decoder and control circuit region, a sense amplifier region and an input/output latch region.

Abstract: Column repairing circuits 7a, 7b for repairing a DRAM in which there are defective memory cells in two columns are disclosed. The connection state of switching elements or circuits 51-5n, 61-6n, 71-7 (n+1), 81-8 (n+1) is determined as illustrated by appropriately disconnecting fuses in fuse links provided respectively in circuits 7a, 7b. Accordingly, column selecting lines Y2a and Y (n+1) b in memory array blocks 891a, 891b are not activated. The two repairing circuits 7a, 7b are provided spaced apart from each other on a semiconductor substrate, so that excessive concentration of fuse elements and switching elements or circuits is prevented.

Abstract: A semiconductor device having amplifying circuits provided near corresponding bonding pads receiving external signals, and positioned between the bonding pads and internal circuits to which such external signals are to be applied. The device includes a control signal generating circuit for the amplifying circuits which is not provided in conventional semiconductor devices. In response to external control signals, the control signal generating circuit generates internal control signals for controlling electric paths between a power supply and ground in the amplifying circuits. During the standby period of the semiconductor device, the paths between the power supply and ground are cut regardless of the potential of the corresponding bonding pads, preventing flow of a through current.

Abstract: The semiconductor circuit device includes a first column decoder for decoding an internal column address and generating a column select signal which selects one column, and a second column decoder for simultaneously selecting a plurality of successively adjacent columns from a memory cell array in accordance with the column select signal. The second column decoder selects the same column in a duplicated way in response to different column select signals. Since the same column is selected in a duplicate way by the different column select signals, it will be possible to simultaneously select a desired combination of a plurality of columns. A combination of a plurality of columns simultaneously selected can be arbitrarily set and a desired combination of columns can be selected with a simplified circuit structure at high speed.

Abstract: A semicondcutor memory device includes an array of a plurality of memory cells arranged in a matrix manner, and a row or column decoder responsive to an external address signal for generating a row or column selecting signal. The memory cell array comprises (n+1) rows or columns. The row or column decoder comprises n output nodes. Transmission gates are provided between the decoder output node and row lines or column selecting lines for connecting each output node and each row line or column selecting line. The transmission gates are formed of a pair of CMOS transmission gates, whereby one output node is connected to two adjacent row lines or column selecting lines. This memory device further includes a circuit defining the connection manner of the transmission gate. This defining circuit turns one pair of CMOS transmission gates ON and OFF complementally.

Abstract: A delay circuit having a complementary insulated gate device comprises an inverter (10) having a series connection of a p type field effect transistor Q3 and an n type field effect transistor Q4 and a transmission gate (20) having a parallel connection of a p type field effect transistor Q1 and an n type field effect transistor Q2 connected to the preceding stage of the inverter (10), and the gates of the transistors Q1 and Q2 are connected together to an output terminal (3). The logical threshold voltage of the inverter (10) is set at a higher value in the range of the input voltage of the inverter (10). There is a peculiar period in which the transistors Q1 and Q2 of the transmission gate (20) transmit only a litle increase of the input voltage to the inverter (10) during the increase of the input voltage. Due to the existence of this peculiar period, this circuit outputs a delayed output signal only when the input voltage increases. In addition, the rise time and fall time of the output signal are short.

Abstract: A potential of a semiconductor substrate is clamped to a ground potential by a V.sub.BB clamping circuit until a first time period has elapsed since turning on of a power supply. Furthermore, the operation of a main circuit is prohibited until a second time period has elapsed which is longer than the first time period, so that a rise in a substrate voltage is suppressed until the driving capability of a V.sub.BB generating circuit is fully achieved.

Abstract: A resistor is connected to an input portion of a CMOS inverter. An input of the CMOS inverter is affected by a time constant of an RC circuit comprising the resistor and gate stray capacitance of the CMOS inverter. In addition, there is provided an n channel MOS transistor having a drain and a source connected to both ends of the resistor, respectively, and a gate connected to an input signal source. Only in the rising portion of an input signal, the n channel MOS transistor is turned on, so that the resistor is bypassed. Thus, a waveform of output of the CMOS inverter is not delayed at the falling portion. Only at the rising portion, the waveform thereof is delayed due to the time constant of the above described RC circuit.

Abstract: A delay circuit having a complementary insulated gate device comprises an inverter (10) having a series connection of a p type field effect transistor Q3 and an n type field effect transistor Q4 and a transmission gate (20) having a parallel connection of a p type field effect transistor Q1 and an n type field effect transistor Q2 connected to the preceding stage of the inverter (10), and the gates of the transistors Q1 and Q2 are connected together to an output terminal (3). The logical threshold voltage of the inverter (10) is set at a higher value in the range of the input voltage of the inverter (10). There is a peculiar period in which the transistors Q1 and Q2 of the transmission gate (20) transmit only a little increase of the input voltage to the inverter (10) during the increase of the input voltage. Due to the existence of this peculiar period, this circuit outputs a delayed output signal only when the input voltage increases. In addition, the rise time and fall time of the output signal are short.