Patents by Inventor Shigeru Matsumura

Shigeru Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153390
    Abstract: A flight management system for a plurality of aerial vehicles includes a management apparatus and an operation terminal. The management apparatus includes processing circuitry to manage operation authorizations to operate the plurality of aerial vehicles. The operation terminal includes an operation interface and processing circuitry. The operation interface is operable by an operator. The processing circuit is connected to the operation interface. Based on an authorization grant request signal obtained based on a flight state of each aerial vehicle of the plurality of aerial vehicles, the processing circuit of the management apparatus transmits an authorization grant command to grant the operation terminal an operation authorization, among the operation authorizations, that is to operate a particular aerial vehicle among the plurality of aerial vehicles.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Shigeru MATSUMURA, Yoshiharu KUBO, Yuki DESSEN, Takuya UMEDA, Shumpei MORI
  • Publication number: 20240082300
    Abstract: Provided is a chimeric target factor receptor capable of activating an antigen-presenting cell such as a dendritic cell in a target-factor-specific manner. The chimeric target factor receptor contains a target factor-binding domain, a transmembrane domain, and an intracellular domain containing a TLR intracellular domain.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 14, 2024
    Applicant: NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
    Inventors: Hideki KASUYA, Yoshinori NAOE, Shigeru MATSUMURA, Ibrahim Ragab Nassr EISSA, Mohamed Abdelmoneim Ahmed ALI MOHAMED
  • Patent number: 11916521
    Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshito Matsumura, Morio Takeuchi, Yukiya Yamaguchi, Shigeru Tsuchida, Hidetaka Takahashi
  • Publication number: 20220273739
    Abstract: Provided are a combination drug for treating a malignant tumor, a pharmaceutical composition for treating a malignant tumor, and a pharmaceutical composition for malignant tumor treatment that have an exceptional antitumor effect. A malignant tumor can be treated by a combination drug containing a first medicine that includes an oncolytic virus belonging to the herpes simplex viruses type 1 as an active ingredient, and a second medicine that includes an interferon gene stimulating factor agonist as an active ingredient.
    Type: Application
    Filed: July 30, 2020
    Publication date: September 1, 2022
    Inventors: Hideki KASUYA, Yoshinori NAOE, Shigeru MATSUMURA, Ibrahim Ragab Nassr EISSA
  • Patent number: 9242637
    Abstract: A vehicle control system includes: a power unit including an electric rotary machine; an electric coolant pump configured to circulate a coolant that cools the electric rotary machine; and a control unit configured to operate the electric coolant pump based on a condition that a temperature of the electric rotary machine is equal to or higher than a predetermined operation threshold temperature, and a condition that an output of the electric rotary machine is equal to or higher than a predetermined operation threshold output.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 26, 2016
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN SEIKI KABUSHIKI KAISHA, AISIN AW CO., LTD.
    Inventors: Tomohiko Miyamoto, Noriyuki Yagi, Shigeru Matsumura, Kenjiro Nagata, Masatoshi Sugimoto
  • Publication number: 20150051768
    Abstract: A vehicle control system includes: a power unit including an electric rotary machine; an electric coolant pump configured to circulate a coolant that cools the electric rotary machine; and a control unit configured to operate the electric coolant pump based on a condition that a temperature of the electric rotary machine is equal to or higher than a predetermined operation threshold temperature, and a condition that an output of the electric rotary machine is equal to or higher than a predetermined operation threshold output.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 19, 2015
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, AISIN AW CO., LTD., AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Tomohiko Miyamoto, Noriyuki Yagi, Shigeru Matsumura, Kenjiro Nagata, Masatoshi Sugimoto
  • Patent number: 8922232
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: December 30, 2014
    Assignees: Advantest Corporation, Shinko Electric Industries Co., Ltd.
    Inventors: Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi
  • Publication number: 20130082727
    Abstract: A wafer tray which holds a semiconductor wafer includes a wafer set plate on which the semiconductor wafer is set, a tray body which supports the wafer set plate to be able to finely move, and a vibration actuator which imparts vibration to the wafer set plate.
    Type: Application
    Filed: August 31, 2010
    Publication date: April 4, 2013
    Applicant: ADVANTEST CORPORATION
    Inventor: Shigeru Matsumura
  • Patent number: 8212579
    Abstract: A fixing apparatus for fixing a probe card to a holder includes a screw fixed to the holder and binding the probe card onto the holder in a vertical direction, a first bearing member intervening between a head of the screw and the probe card and allowing expansion and contraction of the probe card with respect to the screw in a horizontal direction, and a second bearing member intervening between the probe card and the holder and allowing expansion and contraction of the probe card with respect to the holder in the horizontal direction.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: July 3, 2012
    Assignee: Advantest Corporation
    Inventors: Yoshihiro Abe, Shigeru Matsumura
  • Patent number: 8134381
    Abstract: A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: March 13, 2012
    Assignee: Advantest Corporation
    Inventors: Yoshihiro Abe, Takaji Ishikawa, Noriaki Shimasaki, Shigeru Matsumura
  • Publication number: 20120049876
    Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322. [Selected Drawing] FIG.
    Type: Application
    Filed: August 18, 2011
    Publication date: March 1, 2012
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., ADVANTEST CORPORATION
    Inventors: Shigeru MATSUMURA, Kohei KATO, Katsushi SUGAI, Koichi SHIROYAMA, Mitsutoshi HIGASHI, Akinori SHIRAISHI, Hideaki SAKAGUCHI
  • Publication number: 20100127726
    Abstract: A fixing apparatus for fixing a probe card to a holder includes a screw fixed to the holder and binding the probe card onto the holder in a vertical direction, a first bearing member intervening between a head of the screw and the probe card and allowing expansion and contraction of the probe card with respect to the screw in a horizontal direction, and a second bearing member intervening between the probe card and the holder and allowing expansion and contraction of the probe card with respect to the holder in the horizontal direction.
    Type: Application
    Filed: May 22, 2008
    Publication date: May 27, 2010
    Applicant: ADVANTEST CORPORATION
    Inventors: Yoshihiro Abe, Shigeru Matsumura
  • Publication number: 20100102837
    Abstract: A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
    Type: Application
    Filed: March 18, 2008
    Publication date: April 29, 2010
    Applicant: ADVANTEST CORPORATION
    Inventors: Yoshihiro Abe, Takaji Ishikawa, Noriaki Shimasaki, Shigeru Matsumura
  • Patent number: 7690944
    Abstract: A connector assembly, for electrically connecting electrical cables 7 to a test head 4, comprises a plurality of types of cable side connectors 8 respectively attached to one end of the electrical cable 7; and a intermediate connector 6 to which the plurality of types of cable side connectors 8 are connected in a detachable manner, and the intermediate connector 6 having a first engagement part 501 having a shape with which all types of cable side connectors 8 can be engaged and an output terminal 602 able to be engaged with a test head side connector 41 electrically connected to a pin electronics board of the test head 4.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: April 6, 2010
    Assignees: Advantest Corporation, Tyco Electronics Japan G.K.
    Inventors: Shigeru Matsumura, Kazutaka Osawa, Hiroyuki Hama, Yuichiro Izumi, Eiichiro Takemasa
  • Patent number: 7611377
    Abstract: An interface apparatus 5 mounted on a test head 4 comprises: an electrical cable 54 having one end electrically connected to a socket board 66; a device side connector 541 attached to the other end of the electrical cable 54; and a intermediate connector 53 electrically connecting a test head side connector 41 provided on the test head 4 and the device side connector 541 and the intermediate connector 53 having a connector body 531 provided at a bottommost part of the interface apparatus 5; an engagement hole 532 provided at the connector body 531 and having the device side connector 541 detachably connected to it; and an output terminal 537 provided at the connector body 531 and having the test head side connector 41 detachably connected to it.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: November 3, 2009
    Assignee: Advantest Corporation
    Inventors: Shigeru Matsumura, Kazutaka Osawa, Hiroyuki Hama, Yuichiro Izumi
  • Publication number: 20090128172
    Abstract: A calibration board mounted on a socket when calibrating an electronic device test apparatus for testing an IC by bringing ball contacts of the IC into electrical contact with contact terminals of the socket includes calibration terminals for electrically contacting the contact terminals; and a board comprising an insulating member and provided with the calibration terminals, wherein the calibration terminals have spherical members sticking out from the board toward the contact terminals so as to correspond to the shapes of the contact terminals.
    Type: Application
    Filed: August 21, 2006
    Publication date: May 21, 2009
    Applicant: ADVANTEST CORPORATION
    Inventors: Shintaro Takaki, Hiroyuki Hama, Shin Sakiyama, Shigeru Matsumura
  • Patent number: 7484285
    Abstract: A system for mating and demating a plurality of connectors mounted on a socket board with and from a plurality of corresponding connectors mounted on a motherboard includes: an adapter that is arranged above a surface opposite to the socket board surface on which the connectors are arranged and is movable in a direction in which the connectors are mated and demated; pressing means which contacts the surface of the socket board on which the semiconductor components are placed to press the socket board to the motherboard by lowering the adapter; and pulling means each of which engages with an engaging hole formed in the socket board and pulls the socket board in the direction in which the socket board is separated from the motherboard by lifting the adapter.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: February 3, 2009
    Assignee: Advantest Corp.
    Inventors: Masanori Kaneko, Hiroyuki Hama, Takaji Ishikawa, Shigeru Matsumura
  • Patent number: 7474109
    Abstract: A contact terminal for measurement is provided, for transmitting a signal between a desired probe pin among a plurality of probe pins arranged in parallel at a predetermined distance in a predetermined direction on the surface of a probe substrate and an external measurement apparatus. The contact terminal for measurement includes: a signal terminal having an width smaller than the distance between the probe pins provided on both sides of one probe pin in the arrangement direction; two ground terminals to which a ground potential is applied, which are provided on both sides of the signal terminal in the arrangement direction and which have each width larger than that of the signal terminal in the arrangement direction; and a signal line electrically connecting the signal terminal to a signal input terminal of the external measurement apparatus.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: January 6, 2009
    Assignee: Advantest Corporation
    Inventors: Tetsuya Kuitani, Tadao Saito, Shigeru Matsumura, Shin Sakiyama
  • Patent number: 7373186
    Abstract: A folding-type portable information device 120 provided with an image capturing function including a first housing 104 and a second housing 106 rotatably connected via a connecting unit 108, an image capturing unit 110 being provided in the second housing 106 or in the connecting unit 108, and an image display unit 112 for displaying an image captured by the image capturing unit 110 being provided in the first housing 104, wherein an image capturing direction control unit 130, 132, 134, 136, 138, or 140 for varying the image capturing direction of the image capturing unit 110 according to the folding angle between the first housing 104 and the second housing 106 is provided.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: May 13, 2008
    Assignee: Kyocera Corporation
    Inventors: Takaaki Watanabe, Seiji Horii, Shigeru Matsumura
  • Publication number: 20080093556
    Abstract: An infrared gas analyzer includes: a sample cell through which a sample gas containing a measurement component that absorbs an infrared light flows; one or a plurality of light sources that emits the infrared light; and a detector that detects a concentration of the measurement component contained in the sample gas by utilizing a change in the infrared light being absorbed by the measurement component when the sample gas passes through the sample cell.
    Type: Application
    Filed: December 27, 2005
    Publication date: April 24, 2008
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Hideaki Yamagishi, Shigeru Matsumura, Tomoaki Nanko