Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A rod, a cutting tool and a method for manufacturing a cutting tool are disclosed. In an embodiment, the rod may include a cemented carbide member containing WC and Co. The cemented carbide member may be elongated and include a first end portion and a second end portion in a longitudinal direction. The first end portion may have a Co content CoAC smaller than a Co content CoBC of the second end portion. The cemented carbide member may include a first portion on a side of the first end portion and a second portion on a side of the second end portion. The first portion may have a gradient S1 representing a change in a Co content per millimeter. The second portion may have a gradient S2 representing a change in a Co content per millimeter. The gradient S1 may be greater than the gradient S2.

Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

Abstract: A rod, a cutting tool and a method for manufacturing a cutting tool are disclosed. In an embodiment, the rod may include a cemented carbide member containing WC and Co. The cemented carbide member may be elongated and include a first end portion and a second end portion in a longitudinal direction. The first end portion may have a Co content CoAC smaller than a Co content CoBC of the second end portion. The cemented carbide member may include a first portion on a side of the first end portion and a second portion on a side of the second end portion. The first portion may have a gradient S1 representing a change in a Co content per milliliter. The second portion may have a gradient S2 representing a change in a Co content per milliliter. The gradient S1 may be greater than the gradient S2.

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

Abstract: Provided are a drill blank, a method for manufacturing a blank, a drill, and a method for manufacturing a drill which allow a step of brazing to be easy and allow the brazing to be precise. A drill includes a drill blank brazed thereto in an elongated columnar-shape and made of cemented carbide. In the drill blank, both dA and dB are equal to or smaller than 2 mm, dA?dB>dC, a ratio of the length to dA is equal to or larger than 3, and dB/dA=0.96 to 1 and dC/dA=0.9 to 0.995 in a longitudinal direction, where dA indicates the diameter of one end of both ends, dB indicates the diameter of the other end thereof, and dC indicates the minimum diameter of a central portion. Brazing of the drill blank is easy and precision in brazing is enhanced.

Abstract: Provided are a drill blank, a method for manufacturing a blank, a drill, and a method for manufacturing a drill which allow a step of brazing to be easy and allow the brazing to be precise. A drill includes a drill blank brazed thereto in an elongated columnar-shape and made of cemented carbide. In the drill blank, both dA and dB are equal to or smaller than 2 mm, dA?dB>dC, a ratio of the length to dA is equal to or larger than 3, and dB/dA=0.96 to 1 and dC/dA=0.9 to 0.995 in a longitudinal direction, where dA indicates the diameter of one end of both ends, dB indicates the diameter of the other end thereof, and dC indicates the minimum diameter of a central portion. Brazing of the drill blank is easy and precision in brazing is enhanced.

Abstract: A semiconductor device testing system for testing a semiconductor device with a plurality of pins by applying a test signal includes a tester controller, a logical pin number of a logical pin, pin assignment data, a pin assignment convertor, and a test unit. The tester controller outputs generation data used for generating the test signal. The test signal is applied to the logical pin number of of the logical pin according to the generation data. The pin assignment data denoting a relationship between the logical pin number and a physical pin number of a physical pin to which the test signal is applied according to the semiconductor device. The pin assignment convertor converts the logical pin number into the physical pin number based on the pin assignment data. The test unit uses the generation data to prepare the test signal for application to the physical pin designated by the physical pin number.

Abstract: A signal transmission apparatus is provided which increases the transmission rate of data received/transmitted between LSIs of the apparatus which are operated by the same reference clock. An internal clock in a first LSI is output on a clock line from a circuit based on the timing by which data is output on a signal line from the LSI. The output, internal clock is received by a circuit in a second LSI and the data on the signal line is taken in a flip-flop by the received clock. By use of a circuit which takes data therein based on arbitrary timing and from which the data can be taken out based on an arbitrary timing, the phase difference between the received, internal clock and an internal clock in the second LSI is eliminated at the output of the flip-flop.

Abstract: A guide roll particularly suitable for conveying workpieces of high temperature, which: includes a steel core shaft internally provided with a cooling water passage along the axis thereof; a ceramic sleeve covering the circumference of the core shaft and constituted by a plurality of separable annular ceramic segments loosely fitted on and along the length of the core shaft; and fixing members for holding the respective annular ceramic in axially abutted state on the core shaft.

Abstract: A guide roll of the type which is provided with a ceramic sleeve around the circumference of a steel roll shaft with an internal cooling water passage, the guide roll including a cylindrical ceramic sleeve constituted by a multitude of discrete ceramic segments assembled into a number of annular unitary rings fitted around the circumference and along the length of the roll shaft, the individual ceramic segments being mounted in a restricted state at least in radial and circumferential directions of the roll shaft; and end plates securely fixed to the opposite ends of the roll shaft to grippingly hold the respective unit rings in an axially abutted state on the circumference of the roll shaft.

Abstract: According to the invention there are provided a thermoplastic resin for use in a coating resin, and a process for preparing such resin, said thermoplastic resin being a hydrolyzed product of a vinyl chloride copolymer obtained by polymerizing 50 to 80% by weight of a vinyl chloride monomer, 20 to 40% by weight of a vinyl ester monomer and 0 to 15% by weight of a comonomer polymerizable with the vinyl chloride monomer, said vinyl chloride copolymer having an average polymerization degree of 200 to 800 and said hydrolyzed product having an absorption ratio of OH/CH in the infrared absorption spectrum of from 0.5 to 0.9.