Patents by Inventor Shigeru SIMAKAWA

Shigeru SIMAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic part mounting heat-dissipating substrate
    Patent number: 10192818
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 29, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Simakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE
    Publication number: 20170294374
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape
    Type: Application
    Filed: November 20, 2015
    Publication date: October 12, 2017
    Applicant: NSK Ltd.
    Inventors: Shigeru SIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI