Patents by Inventor Shigetoshi Ippoushi
Shigetoshi Ippoushi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8225854Abstract: A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.Type: GrantFiled: January 11, 2006Date of Patent: July 24, 2012Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Akira Yamada, Takeshi Tanaka, Akihiro Murahashi, Kazuyoshi Toya, Hideo Okayama
-
Publication number: 20120024513Abstract: A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility. A fluid flow path is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Further, a fine recess is disposed on a surface of the heatsink that directly comes into contact with the cooling fluid.Type: ApplicationFiled: October 7, 2011Publication date: February 2, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Akira YAMADA, Hirotoshi MAEKAWA, Fumiharu YABUNAKA
-
Patent number: 8061412Abstract: A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility; and a fluid flow path that is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid, a fine recess is disposed.Type: GrantFiled: September 14, 2006Date of Patent: November 22, 2011Assignee: Mitsubishi Electric CorporationInventors: Shigetoshi Ippoushi, Akira Yamada, Hirotoshi Maekawa, Fumiharu Yabunaka
-
Patent number: 7907408Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.Type: GrantFiled: April 12, 2007Date of Patent: March 15, 2011Assignee: Mitsubishi Electric CorporationInventors: Shigetoshi Ippoushi, Tetsuya Takahashi, Kazuyoshi Toya, Fumiharu Yabunaka, Kunihiko Kaga
-
Patent number: 7841387Abstract: A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route.Type: GrantFiled: May 21, 2008Date of Patent: November 30, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
-
Patent number: 7810551Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 20, 2008Date of Patent: October 12, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
-
Publication number: 20100232110Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.Type: ApplicationFiled: April 12, 2007Publication date: September 16, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ippoushi, Tetsuya Takahashi, Kazuyoshi Toya, Fumiharu Yabunaka, Kunihiko Kaga
-
Patent number: 7721793Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 22, 2006Date of Patent: May 25, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
-
Publication number: 20090114372Abstract: A heat sink includes a heat-transfer container incorporating a flow path through which a cooling fluid flows, for cooling a heating element in contact with the heat-transfer container The flow path includes a first cross-sectional portion that becomes narrower as the distance between a given point in the flow path and a side of the heat-transfer container which makes contact with the heating element becomes longer in a direction perpendicular to the direction in which the cooling fluid flows, and a second cross-sectional portion that is approximately constant in the direction perpendicular to the direction in which the cooling fluid flows. The first cross-sectional portion and the second cross-sectional portion alternately continue in the direction in which the cooling fluid flows causing a three-dimensional flow so the heat-transfer properties are enhanced with a simplified structure.Type: ApplicationFiled: September 13, 2005Publication date: May 7, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Seiji Haga, Toru Kimura, Akira Yamada, Hiroshi Yamabuchi, Akihiro Murahashi, Hideo Okayama, Nobuaki Uehara
-
Publication number: 20090080159Abstract: A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.Type: ApplicationFiled: January 11, 2006Publication date: March 26, 2009Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Akira Yamada, Takeshi Tanaka, Akihiro Murahashi, Kazuyoshi Toya, Hideo Okayama
-
Publication number: 20090071631Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 20, 2008Publication date: March 19, 2009Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
-
Publication number: 20080223556Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.Type: ApplicationFiled: May 21, 2008Publication date: September 18, 2008Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
-
Patent number: 7417861Abstract: To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The vehicular power converter includes a power circuit section provided with a switching element; a control circuit section for controlling the switching element; and a housing for accommodating the power circuit section and the control circuit section, wherein a first heat conducting layer intervenes between a base plate having a first heat exchange section for cooling the power circuit section and the power circuit section; a second heat conducting layer intervenes between a cover having a second heat exchange section for cooling the control circuit section and the control circuit section; and the first heat exchange section and the second heat exchange section are disposed on one main surface side and on the other main surface side of an outer circumferential surface part of the housing, respectively.Type: GrantFiled: August 15, 2005Date of Patent: August 26, 2008Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Masao Kikuchi, Isao Sonoda, Yoshihito Asao, Shigetoshi Ippoushi
-
Patent number: 7380584Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.Type: GrantFiled: December 10, 2004Date of Patent: June 3, 2008Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
-
Publication number: 20070089861Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 22, 2006Publication date: April 26, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
-
Patent number: 7201215Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: January 13, 2004Date of Patent: April 10, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
-
Publication number: 20070074854Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 22, 2006Publication date: April 5, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
-
Publication number: 20070062674Abstract: A cooling structure includes a heat dissipation structure 20 having a heat generator 8 and a heatsink 7 that is adhered through an insulating adhesive layer 6 to at least a surface of the heat generator 8 that faces a cooling fluid 9 and made of a metal foil having the flexibility; and a fluid flow path 5 that is disposed outside of the heat dissipation structure 20 so that the cooling fluid 9 flowing inside thereof and the heatsink 7 may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid 9, a fine recess 15 is disposed.Type: ApplicationFiled: September 14, 2006Publication date: March 22, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ippoushi, Akira Yamada, Hirotoshi Maekawa, Fumiharu Yabunaka
-
Publication number: 20060044762Abstract: To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The vehicular power converter includes a power circuit section provided with a switching element; a control circuit section for controlling the switching element; and a housing for accommodating the power circuit section and the control circuit section, wherein a first heat conducting layer intervenes between a base plate having a first heat exchange section for cooling the power circuit section and the power circuit section; a second heat conducting layer intervenes between a cover having a second heat exchange section for cooling the control circuit section and the control circuit section; and the first heat exchange section and the second heat exchange section are disposed on one main surface side and on the other main surface side of an outer circumferential surface part of the housing, respectively.Type: ApplicationFiled: August 15, 2005Publication date: March 2, 2006Inventors: Masao Kikuchi, Isao Sonoda, Yoshihito Asao, Shigetoshi Ippoushi
-
Patent number: 6983790Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.Type: GrantFiled: July 15, 2003Date of Patent: January 10, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Kazushige Nakao, Hiroaki Ishikawa, Toshiyuki Umemoto, Hiroshi Chiba, Mihoko Shimoji