Abstract: A chemical analyzing apparatus accommodates therein a structure for retaining a sample and reagents. A detecting mechanism detects the sample after reaction with a reagent. After or during extraction of a biological substance from the sample in the structure, a temperature of a fluid in a space around the structure is controlled to a value which is suitable for enzyme.

Abstract: Disclosed is a solvent-borne metallic base coating composition which comprises (A) an urea-contained acrylic resin, (B) a urethane-modified polyester resin, (C) a curing agent and (D) a luster pigment, wherein a solid weight ratio of the urea-contained acrylic resin (A)/the urethane-modified polyester resin (B) is within the range of from 60/40 to 95/5. The resin coating composition can form metallic coatings having high color phase difference between looking at high light position and looking at shade position, in particular those having high FF property, excellent appearance (surface texture) and transparency.

Abstract: The present invention provides an aqueous coating composition wherein the resulting coating film has good visual appearance and excellent flip-flop properties, and a method for formation of a multilayer coating film. The aqueous coating composition comprising: an aqueous resin dispersion which is obtained by solution-polymerizing a monomer mixed solution A having an acid value of 30 to 150 and a hydroxyl group value of 10 to 100 in an organic solvent, thereby to synthesize a copolymer solution, converting the copolymer solution into an aqueous solution, removing the organic solvent under reduced pressure to obtain an aqueous solution resin for emulsion polymerization, and then emulsion-polymerizing a monomer mixed solution B having an acid value of 20 as an upper limit and a hydroxyl group value of 100 as an upper limit using the aqueous solution resin for emulsion polymerization as a protective colloid, thereby to synthesize a core resin in the protective colloid; and a glitter material.

Abstract: It is an object of the present invention to provide a method of forming a composite coating film having high flip-flop properties by applying a water-based base coat coating to a substrate, then applying a clear top coat coating thereonto and curing both coatings simultaneously while controlling the interlayer imbibing or inversion of coating films under high humidity conditions. The present invention provides a method of forming a composite coating film by applying a water-based base coat coating to a substrate and then applying a clear top coat coating thereonto, wherein the water-based base coat coating comprises: a polyether polyol having at least 0.02 primary hydroxyl group, on average, per molecule, a number average molecular weight of 300 to 3,000 and a water tolerance of not less than 2.

Abstract: The present invention provides a water-borne base coating composition for automobiles which can give a coating film excellent in luster and in coloration.

Abstract: It is an object of the present invention to provide a method of forming a composite coating film having high flip-flop properties by applying a water-based base coat coating to a substrate, then applying a clear top coat coating thereonto and curing both coatings simultaneously while controlling the interlayer imbibing or inversion of coating films under high humidity conditions.

Abstract: It is an object of the present invention to provide a water-based metallic coating composition capable of providing coatings having a better appearance, superior in luster, even under high humidity conditions, as compared with the prior art water-based coating compositions.

Abstract: There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

Abstract: The present invention provides a curable resin composition having good curability and storage stability, which provides a cured film having excellent weather resistance, acid resistance and mar resistance. The curable resin composition comprises:(a) 20 to 80% by weight of a polycarboxylic acid having an acid value of 25 to 300 mg KOH/g based on solid and a number average molecular weight of 500 to 20000; and(b) 20 to 80% by weight of a polyepoxide having an epoxy equivalent of 100 to 800 and a number average molecular weight of 500 to 20000, prepared by copolymerizing: (1) 10 to 60% by weight of a long-chain epoxy monomer; and (2) 40 to 90% by weight of an ethylenically unsaturated monomer having no epoxy group. The present invention also provides a process for forming a cured film using the resin composition.

Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.

Abstract: The present invention provides a clear liquid coating composition comprising (a) a compound having at least 2 carboxyl groups, (b) a compound having at least 2 epoxy groups, (c) 0.01 to 3.0 parts by weight based on 100 parts by weight of the total resin solid of an onium salt, which is used as a top coating composition for a pre-coated surface.

Abstract: The present invention provides a curable resin composition which provides cured film having not only excellent acid resistance but also good weather resistance, good mar resistance and seal cracking resistance because of its high extensibility. The curable resin composition comprises (a) 20 to 80% by weight of a polymer having carboxyl and carboxylate groups; and (b) 2% to 80% by weight of a polymer having hydroxyl and epoxy groups. The present invention also provides a process for forming a cured film using the resin composition.

Abstract: The present invention provides, a curable resin composition and a process for forming a cured film therefrom wherein the cured film has not only excellent acid resistance but also good weather resistance, good mar resistance and sealer cracking resistance because of its high extensibility, The curable resin composition comprises (a) 20 to 80% by weight of a polymer having carboxyl and carboxylate groups; and (b) 20 to 80% by weight of a polymer having hydroxyl and epoxy groups.

Abstract: An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

Abstract: A method of manufacturing a semiconductor device with a bump-electrode of gold crystal is disclosed. The method includes providing a semiconductor substrate, an insulative layer, an electrode section, passivation layer on the edge portion of the electrode section, a multi-layer film, and a bump electrode of gold crystal. The method further includes heat treatment of the bump electrode to form an anticorrosive layer between the electrode section and the lower layer of the multi-layer film. Removing the unnecessary multi-layer film, the anticorrosive layer is used as a mask for etching to simplify the process of manufacturing the semiconductor device.

Abstract: A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.