Patents by Inventor Shigeyuki Yamamura

Shigeyuki Yamamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5023703
    Abstract: A semiconductor device comprising a metal base providing a metal case and a through-passage connecting the inside and outside of said metal case, an electric terminal which provides a bridge selectively deposited on the insulator base allowing formation of conductive layer thereon, said insulator base and said conductive layer and is integrated with said insulator base and is insertingly engaged with the through-passage of said metal base, and a semiconductor element accommodated in said metal case, wherein a pseudo-coaxial line structure is composed of said conductive layer, insulator base, insulator bridge and metal case. Accordingly a device of the present invention is capable of stably operating even at a frequency of 10 GHz or higher.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: June 11, 1991
    Assignee: Fujitsu Limited
    Inventors: Norio Hidaka, Shigeyuki Yamamura, Masumi Fukuta
  • Patent number: 4908694
    Abstract: A semiconductor device including a metal base, a metal case and a through-passage connecting the inside and outside of the metal case, an electric terminal which provides a bridge selectively deposited on an insulator base allowing formation of conductive layer thereon. The insulator base and the conductive layer are integrated with the insulator base and the combination is insertingly engaged with the through-passage of the metal base. A semiconductor element is fixed in the metal case, in which a pseudo-coaxial line structure is formed by the conductive layer, the insulator base, the insulator bridge and the metal case. Accordingly a device of the present invention is capable of stably operating even at a frequency of 10 GHz or higher.
    Type: Grant
    Filed: December 20, 1983
    Date of Patent: March 13, 1990
    Assignee: Fujitsu Limited
    Inventors: Norio Hidaka, Shigeyuki Yamamura, Masumi Fukuta
  • Patent number: 4751562
    Abstract: A field-effect semiconductor device including a through-hole electrode formed so as to penetrate from the top to the bottom of the semiconductor substrate, a dielectric film formed on the semiconductor substrate so as to be opposite to the through-hole electrode, and an electrode, forming a through-hole type of passive element, such as a capacitor, so as to improve the integration degree.
    Type: Grant
    Filed: September 30, 1987
    Date of Patent: June 14, 1988
    Assignee: Fujitsu Limited
    Inventor: Shigeyuki Yamamura
  • Patent number: 4713634
    Abstract: A semiconductor device including a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering the container; and input and output terminals connected to the circuit and penetrating through a side wall of the container at locations opposite to each other. The bottom surface of the container includes space for mounting the radio frequency semiconductor circuit and supplementary space for mounting elements of a supplementary circuit. A cutoff member for increasing the cutoff frequency of the waveguide mode wave propagation between the input and output terminals within the container is provided on a part of the supplementary space, so that the cutoff frequency is higher than the wave frequency used in the radio frequency semiconductor circuit.
    Type: Grant
    Filed: March 5, 1985
    Date of Patent: December 15, 1987
    Assignee: Fujitsu Limited
    Inventor: Shigeyuki Yamamura
  • Patent number: 4672151
    Abstract: A package for a microwave semiconductor device or circuit is provided having an electrical terminal suitable to cascade connection. The package includes a metallic container for the semiconductor device or circuit and a single electrical terminal having a plurality of strip lines formed thereon. The electrical terminal is composed of an insulating material base on which the strip lines are formed in parallel relationship and a plurality of insulating material block members disposed on the insulating material base so as to cover the middle portions of corresponding strip lines. The insulating material base and block members are sintered to form a unified body. The electrical terminal thus obtained is engaged in a through-hole formed in the side wall portion of the metallic container so that the strip lines penetrate perpendicular to the side wall portion, and is then, hermetically sealed to the container.
    Type: Grant
    Filed: September 30, 1985
    Date of Patent: June 9, 1987
    Assignee: Fujitsu Limited
    Inventor: Shigeyuki Yamamura
  • Patent number: 4635196
    Abstract: An electronic cash register, wherein sales data such as sale information and classification information are input before a registration key is operated to cause a registration, includes a plurality of registration keys, a plurality of exemption flags each corresponding to the plurality of registration keys, an exemption flag set circuit for setting and resetting the plurality of exemption flags, an exemption flag detection circuit for detecting whether the set or reset condition of one of the plurality of exemption flags corresponding to one of the plurality of registration keys is actuated after the input of the sale data, and an exemption registration selection circuit responsive to the detection by the exemption flag detection circuit for selectively calculating the total sale price either free from the taxation or with the taxation.
    Type: Grant
    Filed: June 26, 1984
    Date of Patent: January 6, 1987
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yashuhide Nakamura, Shigeyuki Yamamura
  • Patent number: 4427991
    Abstract: A high frequency, hermetically-sealed, semiconductor device with the capability of being cascade-connected with corresponding devices in an advantageous manner. The device consists of a function element which includes at least one semiconductor and other circuit elements necessary for forming a functional amplifier, a DC power circuit for operating the device and high frequency circuits for connecting to corresponding high frequency devices. This device also consists of a metal base substrate, which is used for anchoring the device and mounting other parts of the device thereon, an insulating substrate having a plurality of independent metallized layers used as external contacts and a sealing part for hermetically sealing that part of the insulating substrate which mounts and encloses the function element.
    Type: Grant
    Filed: August 20, 1980
    Date of Patent: January 24, 1984
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Yamamura, Kinjiro Kosemura, Takao Shima, Norio Hidaka