Patents by Inventor Shih-An Lin
Shih-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11996324Abstract: A method of forming a semiconductor device includes: forming a semiconductor feature over a substrate, the semiconductor feature includes a conductive region; forming a dielectric layer over the semiconductor feature; patterning the dielectric layer to form a contact opening exposing a top surface of the conductive region; forming a monolayer over the dielectric layer, the top surface of the conductive region remaining exposed; and depositing a conductive material in the contact opening.Type: GrantFiled: March 5, 2021Date of Patent: May 28, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: U-Ting Chiu, Po-Nan Yeh, Yu-Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh
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Patent number: 11996455Abstract: Methods of forming and processing semiconductor devices are described. Certain embodiments related to electronic devices which comprise a dipole region having an interlayer dielectric, a high-? dielectric material, and a dipole layer. The dipole layer comprises one or more of titanium aluminum nitride (TiAlN), titanium tantalum nitride (TiTaN), titanium oxide (TiO), tantalum oxide (TaO), and titanium aluminum carbide (TiAlC).Type: GrantFiled: April 3, 2023Date of Patent: May 28, 2024Assignee: Applied Materials, Inc.Inventors: Yongjing Lin, Karla M Bernal Ramos, Shih Chung Chen, Yixiong Yang, Lin Dong, Steven C. H. Hung, Srinivas Gandikota
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Patent number: 11997783Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.Type: GrantFiled: May 27, 2022Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Po-An Lin, Huei-Shyong Cho, Shih-Wen Lu
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Patent number: 11988847Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a first movable portion, a second movable portion, a first driving assembly, and a second driving assembly. The first movable portion is movable relative to the fixed portion. The second movable portion is used for holding an optical element having a main axis, and is movable relative to the first movable portion. The first driving assembly is used for driving the first movable portion to move in a first dimension relative to the fixed portion, and the second driving assembly is used for driving the second movable portion to move in a second dimension relative to the fixed portion. The first dimension and the second dimension are different.Type: GrantFiled: July 26, 2021Date of Patent: May 21, 2024Assignee: TDK TAIWAN CORP.Inventors: Yun-Fei Wang, Yu-Huai Liao, Sheng-Zong Chen, Wei-Han Hsia, Kun-Shih Lin
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Publication number: 20240162612Abstract: The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Guan-Wei CHEN, Shih-Wen LU
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Patent number: 11982866Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: GrantFiled: December 15, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
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Publication number: 20240145020Abstract: A circuit for testing a memory is provided. An input end of the memory is coupled to a register, and the circuit for testing the memory transmits data to the memory through the register. The circuit for testing the memory performs the following operations sequentially: writing a first data into a target address of the memory, all bits of the target address being at the same level, and all bits of the first data being at the same level; writing a second data to the target address of the memory, all bits of the second data being at the same level, and the second data being different from the first data; reading from the target address an output data; and determining whether the output data is correct.Type: ApplicationFiled: August 22, 2023Publication date: May 2, 2024Inventors: SHENG-LIN LIN, SHIH-CHIEH LIN
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Publication number: 20240144467Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
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Publication number: 20240136183Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
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Publication number: 20240134147Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.Type: ApplicationFiled: October 19, 2023Publication date: April 25, 2024Inventors: Po-Xiang ZHUANG, Chen-Hung CHAO, Wei-Jhe SHEN, Shou-Jen LIU, Kun-Shih LIN, Yi-Ho CHEN
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Patent number: 11965698Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.Type: GrantFiled: November 8, 2021Date of Patent: April 23, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Shih-Lin Huang, Ting-Yuan Wu
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Patent number: 11968817Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.Type: GrantFiled: February 28, 2022Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
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Patent number: 11967168Abstract: A method and device of fingerprint image generation for saving memory. The method includes generating a first fingerprint image of an original data size according to a plurality of first analog sensing signals which are read from a fingerprint sensor array before an exposure period ends. Then the first fingerprint image represented by a first data size which is equivalent to or smaller than the original data size is stored. a second fingerprint image of the original data size is generated after generating the first fingerprint image of the original data size according to a plurality of second analog sensing signals which are read from the fingerprint sensor array during the exposure period. The second fingerprint image represented by a compressed data size smaller than the original data size is then stored.Type: GrantFiled: December 13, 2021Date of Patent: April 23, 2024Assignee: Novatek Microelectronics Corp.Inventors: Weilun Shih, Wu-Wei Lin
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Publication number: 20240128987Abstract: A decoding method, a memory storage device and a memory control circuit unit are disclosed. The method includes: activating a decoding circuit which supports a plurality of decoding modes each corresponding to a threshold value, wherein a distribution of the threshold value corresponds to error correction abilities of the decoding modes; reading first data from a rewritable non-volatile memory module; performing, by the decoding circuit, a first decoding operation on the first data; obtaining a decoding parameter according to an execution result of the first decoding operation; and performing, by the decoding circuit, a second decoding operation on the first data based on a first decoding mode among the decoding modes according to a relative numerical relationship between the decoding parameter and the threshold value.Type: ApplicationFiled: November 28, 2022Publication date: April 18, 2024Applicant: PHISON ELECTRONICS CORP.Inventors: Shih-Jia Zeng, Yi-Fang Chang, Chun-Wei Tsao, Chen-An Hsu, Wei Lin
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Patent number: 11961796Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.Type: GrantFiled: August 30, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
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Patent number: 11962328Abstract: A decoding method, a memory storage device and a memory control circuit unit are disclosed. The method includes: activating a decoding circuit which supports a plurality of decoding modes each corresponding to a threshold value, wherein a distribution of the threshold value corresponds to error correction abilities of the decoding modes; reading first data from a rewritable non-volatile memory module; performing, by the decoding circuit, a first decoding operation on the first data; obtaining a decoding parameter according to an execution result of the first decoding operation; and performing, by the decoding circuit, a second decoding operation on the first data based on a first decoding mode among the decoding modes according to a relative numerical relationship between the decoding parameter and the threshold value.Type: GrantFiled: November 28, 2022Date of Patent: April 16, 2024Assignee: PHISON ELECTRONICS CORP.Inventors: Shih-Jia Zeng, Yi-Fang Chang, Chun-Wei Tsao, Chen-An Hsu, Wei Lin
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Publication number: 20240118491Abstract: A photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. The light-emitting component at least includes a gain medium layer, a first contact layer and a first optical coupling layer stacked to each other. The photonic integrated circuit includes a second optical coupling layer. The light-emitting component and the photonic integrated circuit are stacked in a stacking direction, the first optical coupling layer has a first taper portion, the second optical coupling layer has a second taper portion, and the first taper portion and the second taper portion overlap in the stacking direction. Accordingly, the light emitted from the gain medium layer may be transmitted to the second taper portion from the first taper portion by optical coupling in a short length of an optical coupling path.Type: ApplicationFiled: January 19, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao YU, Jui Lin CHAO, Hsing-Kuo HSIA, Shih-Peng TAI, Kuo-Chung YEE
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Patent number: 11947153Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.Type: GrantFiled: May 4, 2023Date of Patent: April 2, 2024Assignee: Radiant Opto-Electronics CorporationInventors: Hung-Pin Cheng, Shih-Fan Liu, Chien-Yu Ko, Jui-Lin Chen
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Publication number: 20240104285Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITEDInventors: Yi-Lin CHUANG, Shi-Wen TAN, Song LIU, Shih-Yao LIN, Wen-Yuan FANG
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Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin