Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: A device includes a pair of gate spacers on a substrate, and a gate structure on the substrate and between the gate spacers. The gate structure includes an interfacial layer, a metal oxide layer, a nitride-containing layer, a tungsten-containing layer, and a metal compound layer. The interfacial layer is over the substrate. The metal oxide layer is over the interfacial layer. The nitride-containing layer is over the metal oxide layer. The tungsten-containing layer is over the nitride-containing layer. The metal compound layer is over the tungsten-containing layer. The metal compound layer has a different material than a material of the tungsten-containing layer.

Abstract: In an embodiment, a method of forming a structure includes forming a first transistor and a second transistor over a first substrate; forming a front-side interconnect structure over the first transistor and the second transistor; etching at least a backside of the first substrate to expose the first transistor and the second transistor; forming a first backside via electrically connected to the first transistor; forming a second backside via electrically connected to the second transistor; depositing a dielectric layer over the first backside via and the second backside via; forming a first conductive line in the dielectric layer, the first conductive line being a power rail electrically connected to the first transistor through the first backside via; and forming a second conductive line in the dielectric layer, the second conductive line being a signal line electrically connected to the second transistor through the second backside via.

Abstract: A semiconductor device is provided. The semiconductor device comprises a first semiconductor die comprising a first capacitor, and a second semiconductor die in contact with the first semiconductor die and comprises a diode. The first semiconductor die and the second semiconductor die are arranged along a first direction, and a diode is configured to direct electrons accumulated at the first capacitor to a ground.

Abstract: An image capture device capable of uploading clear images via wireless transmission includes a central processing unit, an image capture unit electrically coupled to the central processing unit, an image memory unit, a clear image detection unit electrically coupled to the central processing unit, and a wireless transmission unit electrically coupled to the central processing unit and these units are operated together to upload clear images, particularly to upload clear images to an external storage device via wireless transmission.

Abstract: A dust-cleaning device for a computer and a method using the same that utilizes a computer fan are disclosed. The computer is a laptop computer, a desktop computer, or a server. The method comprises: determining if a temperature of an electronic component is higher than a specific temperature; and if so, then reversing the computer fan for a specific amount of time as indicated by a timer.

Abstract: A dust-cleaning device for a computer and a method using the same that utilizes a computer fan are disclosed. The computer is a laptop computer, a desktop computer, or a server. The method comprises: determining if a temperature of an electronic component is higher than a specific temperature; and if so, then reversing the computer fan for a specific amount of time as indicated by a timer.

Abstract: A method for enabling or disabling a peripheral device, that uses a basic input output system to control a system chip, modifies the status of a register of a peripheral controller in the south bridge chip of a computer. The method enables or disables the peripheral device through the control of a software application that sends a control command to the basic input output system and therefore can achieve its purpose using only the present configuration of circuits on a motherboard.

Abstract: A kind of cylindrical chargeable battery module includes an outer shell, a chain of batteries and a charge device. Wherein, the column-formed outer shell's column diameter is equal to that of a regularized cylinder battery; sides at both ends of the model group are anode and cathode link points; the distance between the link points of anode and cathode is equal to the length of certain number of regularized cylinder batteries in series. The chain of batteries, put inside the outer shell, is composed of several series-wound units of batteries in line, each of which functions the same as a certain regularized cylinder battery, and this chain of batteries can be charged in a same charge device, whose jack for charge is exposed to the annulus of the outer shell.

Abstract: A punching mechanism for punching press with multiple linking rods, wherein an eccentric device drives at least one rocking arm, the rocking arm driving a hinged lever-type swing arm, thereby a linking arm joined to the swinging arm drives an acting arm to lower an upper mold that is connected to the acting arm; the linked movement of the arms produce delay effects to the punching cycle, reducing vibration during punching process and extending time for flexible forming of materials, and reducing material stress.