Patents by Inventor Shih-Chun Tsai
Shih-Chun Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240186446Abstract: A semiconductor structure comprises a substrate, an adhesion layer, arranged on the substrate, a first release layer, arranged on the adhesion layer and a first semiconductor device, comprising a semiconductor epitaxial stack, and a conducting layer directly connected to the first release layer, wherein the first semiconductor device is not electrically connected to the substrate by the adhesion layer and the first release layer.Type: ApplicationFiled: February 13, 2024Publication date: June 6, 2024Inventors: Hao-Min KU, You-Hsien CHANG, Shih-I CHEN, Fu-Chun TSAI, Hsin-Chih CHIU
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Patent number: 12002768Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.Type: GrantFiled: August 27, 2021Date of Patent: June 4, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
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Patent number: 11980076Abstract: A tiled display device includes two panels and two cover layers respectively disposed on the two panels. The two cover layers include a contact region. A top portion and a bottom portion of the contact region have a height H. One of the two cover layers has a thickness Tn. One of the two panels has a distance Xn between an upper surface of the one of the two panels and the bottom portion of the contact region. The one of the two panels is corresponding to the one of the two cover layers. The height H, the thickness Tn and the distance Xn satisfy the equation: 0<H/(Xn+Tn)<0.8.Type: GrantFiled: December 24, 2020Date of Patent: May 7, 2024Assignee: InnoLux CorporationInventors: Ping-Hsun Tsai, Shih-Fu Liao, I-An Yao, Yu-Chun Hsu, Yung-Hsun Wu, Sheng-Nan Fan
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Publication number: 20240072816Abstract: A digital-to-analog converter and an operation method thereof are provided. The digital-to-analog converter includes a current source module, a decoder, a change indicator, and a random number generator. The decoder is coupled to the current source module and receives a digital input signal. The change indicator is coupled to the decoder and provides an indication signal to the decoder. The random number generator is coupled to the change indicator and provides a random number signal to the change indicator. The change indicator generates an indication signal according to the random number signal, and the decoder generates a control signal to the current source module according to the digital input signal and the indication signal, so that the current source module generates an analog output signal corresponding to the digital input signal according to the control signal.Type: ApplicationFiled: November 21, 2022Publication date: February 29, 2024Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Hao Wang, Hui-Wen Tsai, Shih-Chun Lo
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Publication number: 20220384254Abstract: A metal interconnect structure includes a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first metal interconnection, and a cap layer between the first metal interconnection and the second metal interconnection. Preferably, a top surface of the first metal interconnection is even with a top surface of the IMD layer and the cap layer is made of conductive material.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
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Patent number: 11450558Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.Type: GrantFiled: August 12, 2020Date of Patent: September 20, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
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Publication number: 20200373198Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
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Patent number: 10784153Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.Type: GrantFiled: September 18, 2018Date of Patent: September 22, 2020Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
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Publication number: 20200058544Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.Type: ApplicationFiled: September 18, 2018Publication date: February 20, 2020Inventors: Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho, Yang-Chou Lin
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Patent number: 9316901Abstract: A method for forming patterns includes the following steps. A first layout including a first target pattern and a first unprintable dummy pattern is provided. A second layout including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlaps the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern cannot be formed in a wafer.Type: GrantFiled: April 23, 2014Date of Patent: April 19, 2016Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang
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Publication number: 20140220482Abstract: A method for forming patterns includes the following steps. A first layout including a first target pattern and a first unprintable dummy pattern is provided. A second layout including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlaps the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern cannot be formed in a wafer.Type: ApplicationFiled: April 23, 2014Publication date: August 7, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang
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Patent number: 8748066Abstract: A method for forming photomasks includes the following steps. A first photomask including a first target pattern and a first unprintable dummy pattern is provided. A second photomask including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlapping the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern can not be printed in a wafer.Type: GrantFiled: October 3, 2012Date of Patent: June 10, 2014Assignee: United Microelectronics Corp.Inventors: Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang
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Patent number: 8735295Abstract: A method for fabricating a dual damascene structure includes the following steps. At first, a dielectric layer, a dielectric mask layer and a metal mask layer are sequentially formed on a substrate. A plurality of trench openings is formed in the metal mask layer, and a part of the metal mask layer is exposed in the bottom of each of the trench openings. Subsequently, a plurality of via openings are formed in the dielectric mask layer, and a part of the dielectric mask layer is exposed in a bottom of each of the via openings. Furthermore, the trench openings and the via openings are transferred to the dielectric layer to form a plurality of dual damascene openings.Type: GrantFiled: June 19, 2012Date of Patent: May 27, 2014Assignee: United Microelectronics Corp.Inventors: Chang-Hsiao Lee, Hsin-Yu Chen, Yu-Tsung Lai, Jiunn-Hsiung Liao, Shih-Chun Tsai
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Publication number: 20140093814Abstract: A method for forming photomasks includes the following steps. A first photomask including a first target pattern and a first unprintable dummy pattern is provided. A second photomask including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlapping the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern can not be printed in a wafer.Type: ApplicationFiled: October 3, 2012Publication date: April 3, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Shih-Chun Tsai, Kai-Lin Chuang
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Publication number: 20130337650Abstract: A method for fabricating a dual damascene structure includes the following steps. At first, a dielectric layer, a dielectric mask layer and a metal mask layer are sequentially formed on a substrate. A plurality of trench openings is formed in the metal mask layer, and a part of the metal mask layer is exposed in the bottom of each of the trench openings. Subsequently, a plurality of via openings are formed in the dielectric mask layer, and a part of the dielectric mask layer is exposed in a bottom of each of the via openings. Furthermore, the trench openings and the via openings are transferred to the dielectric layer to form a plurality of dual damascene openings.Type: ApplicationFiled: June 19, 2012Publication date: December 19, 2013Inventors: Chang-Hsiao Lee, Hsin-Yu Chen, Yu-Tsung Lai, Jiunn-Hsiung Liao, Shih-Chun Tsai