Patents by Inventor Shih-Huei Chen

Shih-Huei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144467
    Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
  • Patent number: 11967596
    Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
  • Patent number: 6543915
    Abstract: A recessed down light includes a mounting base frame, a rotary carrier revolvably supported in the mounting base frame, two friction members fastened to the mounting base frame and pressed on the rotary carrier and adapted hold the rotary carrier in position when external force disappeared, a lamp holder holding a halogen lamp and pivoted to the rotary carrier for turning in and out of the rotary carrier by hand, and a track frame fastened to the rotary carrier and adapted to guide circular motion of the lamp holder relative to the rotary carrier within 90°.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: April 8, 2003
    Assignee: Tai-Jan Luminaire Ltd.
    Inventor: Shih-Huei Chen
  • Publication number: 20030053315
    Abstract: A recessed down light includes a mounting base frame, a rotary carrier revolvably supported in the mounting base frame, two friction members fastened to the mounting base frame and pressed on the rotary carrier and adapted hold the rotary carrier in position when external force disappeared, a lamp holder holding a halogen lamp and pivoted to the rotary carrier for turning in and out of the rotary carrier by hand, and a track frame fastened to the rotary carrier and adapted to guide circular motion of the lamp holder relative to the rotary carrier within 90°.
    Type: Application
    Filed: September 19, 2001
    Publication date: March 20, 2003
    Applicant: Tai-Jan Luminaire Ltd.
    Inventor: Shih-Huei Chen
  • Patent number: 4837230
    Abstract: Ceramic composite articles having high flexural and tensile strength are produced by introducing multiple layers of a ceramic matrix material onto a ceramic reinforcement fabric. Crack propagation in the resulting structure is inhibited by applying refractory interface layers intermediate successive ceramic matrix layers. Such ceramic composite articles are particularly useful for high temperature applications requiring a high degree of strength, such as rocket motor insulation and turbine blades, combustion chambers, and after burners for jet motors.
    Type: Grant
    Filed: July 21, 1988
    Date of Patent: June 6, 1989
    Assignee: Kaiser Aerotech
    Inventors: Shih-Huei Chen, H. O. Davis
  • Patent number: 4741873
    Abstract: Rigidized composite preforms are fabricated by first serving individual reinforcement strands with a thread of a thermoplastic material. After shaping the reinforcement strands into a desired geometry, the shaped strands are heated to melt the thermoplastic threads. By then cooling the shaped reinforcement strands, the thermoplastic material solidifies and acts as an adhesive or glue in holding the preform together in a rigid fashion. Such rigid preforms are particularly suitable for handling, storage and transportation to other locations and media prior to densification. Densification may be performed by conventional techniques to produce the final composite article. Pyrolysis of the matrices and subsequent densification of the matrix may be accomplished.
    Type: Grant
    Filed: April 15, 1986
    Date of Patent: May 3, 1988
    Assignee: Kaiser Aerotech, a Division of Sowa & Sons
    Inventors: Mel J. Fischer, Hollis O. Davis, Shih Huei Chen