Abstract: Provided is an inductor structure and manufacturing method thereof, including forming an inductance coil in a semiconductor packaging carrier plate and disposing a patterned magnetic conductive layer in the inductance coil. Therefore, a patterned build-up wiring method is used to form a magnetic material in the carrier plate, thereby improving electrical characteristics of the inductor.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: Provided is a core structure of an inductor element. The manufacturing method thereof is to embed a magnetic conductor including at least one magnetic conductive layer in a core body and to from a plurality of apertures for passing coils around the magnetic conductor in the core body. Accordingly, the magnetic conductor is designed in the core body by using the integrated circuit carrier board manufacturing process, such that the overall size and thickness of the inductor element can be greatly reduced, thereby facilitating product miniaturization using the inductor element.

Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.

Abstract: An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.

Abstract: A packaging method of heat spreaders includes the following steps. Arrange a plurality of heat spreaders and a plurality of gaskets alternately to a container, wherein at least one of the gaskets is arranged between any immediately-adjacent two of the most adjacent heat spreaders. Remove all of the gaskets from the container at the same time. A packaging box suitable for this packaging method is also provided.

Abstract: An assembly-disassembly tool is adapted for assembling and disassembling a lamp board. The assembly-disassembly tool includes a magnetic conductive member and a sliding module. The magnetic conductive member includes a through hole. When the disassembly tool is positioned on the lamp board, the through hole of the magnetic conductive member is aligned with an iron sheet of the light board. The sliding module including a magnet is slidably disposed above the magnetic conductive member along a direction parallel to a top surface of the magnetic conductive member. When the sliding module is located at a first position relative to the magnetic conductive member, the magnet is staggered with the through hole. When the sliding module slides to a second position relative to the magnetic conductive member, the magnet is aligned with the through hole and is configured to magnetically attract the iron sheet of the lamp board.

Abstract: Provided is a light emitting module, including multiple light emitting units and a multi-layer board. Each light emitting unit includes multiple light emitting elements and side connectors. Each light emitting element includes first and second ends. The light emitting units are disposed on the multi-layer board. The first and second ends of each light emitting element are connected to the side connectors through multiple through holes of the multi-layer board. The first ends of the light emitting elements of first and second light emitting units are electrically connected to each other. The first ends of the light emitting elements of third and fourth light emitting units are electrically connected to each other. The display device using the light emitting module of the disclosure may conduct the adjacent light emitting units to each other through the side connectors, increasing repair possibility and reducing the scrap uncontrolled rate of the display device.

Abstract: A light-emitting module including multiple light-emitting units and a display device are provided. Each of the light-emitting units includes multiple light-emitting elements. Each of the light-emitting elements includes a first end and a second end. The first ends of the light-emitting elements of a first light-emitting unit and a second light-emitting unit among the light-emitting units are electrically interconnected. The first ends of the light-emitting elements of a third light-emitting unit and a fourth light-emitting unit among the light-emitting units are electrically interconnected. The second end of one of the light-emitting elements of the first light-emitting unit and the second end of one of the light-emitting elements of the corresponding third light-emitting unit are electrically interconnected.

Abstract: A packaging method of heat spreaders includes the following steps. Arrange a plurality of heat spreaders and a plurality of gaskets alternately to a container, wherein at least one of the gaskets is arranged between any immediately-adjacent two of the most adjacent heat spreaders. Remove all of the gaskets from the container at the same time. A packaging box suitable for this packaging method is also provided.

Abstract: A display device and a temperature protection method thereof are provided. The display device includes a temperature sensing circuit and a control circuit. The temperature sensing circuit is disposed in a casing of the display device. The temperature sensing circuit changes a resistance value according to a temperature of the display device to generate a voltage value. The control circuit determines whether to perform at least one cooling operation according to the voltage value of the temperature sensing circuit, so as to reduce the temperature of the display device and prevent the temperature of the display device from being too high.

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition comprising (A) a photopolymerizable prepolymer of formula (1); (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent. The low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition has excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.

Abstract: A wireless information transceiver system is provided, which includes at least one wireless signal transmitter device and a wireless signal receiver device. The wireless signal transmitter device includes: a first receiving module, a first control module, a first output module and a power supply module. The wireless signal receiver device includes: a second receiving module, a second control module and a second output module. The wireless signal transceiver can convert the original image signals of a computer device into non-compressed high-definition image signals by the wireless signal transmitter device. Then, the non-compressed high-definition image signals are transmitted to an image display device via the wireless signal receiver device. Besides, the wireless signal transmitter device further implements the power distribution via the power supply module according to the power consumption level and the temperature.

Abstract: A drink cup contains: a body, a cover, and a stirring unit. The body includes a bottom fringe, a peripheral fringe, a chamber, and an opening. The bottom fringe has an orifice defined on a central position thereof and communicating with the chamber. The stirring unit has a seat, a stirrer, and a fixing element, wherein the seat is mounted on the orifice and has a central hole communicating with the chamber. The stirrer has a stem, an outer diameter of which is less than the central hole, and the stirrer also has a blade and a first locking portion on a bottom of the stirrer. The fixing element has an engagement portion and a second locking portion. When the stem of the stirrer inserts through the central hole, the second locking portion of the fixing element is in connection with the first locking element of the stirrer so that the stem of the stirrer rotatably connects with the central hole of the seat.

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.

Abstract: A projection system includes a display device, a wireless presentation gateway, a computer terminal, and a portable device. The display device is used for displaying an image. The wireless presentation gateway is linked to the display device for transmitting image data to the display device. The computer terminal is linked to the wireless presentation gateway for transmitting the image data to the wireless presentation gateway. The portable device is connected to the computer terminal through a communication port for driving the computer terminal, the wireless presentation gateway, and the display device for performing an image display process automatically.

Abstract: A projection system includes a display device, a wireless presentation gateway, a computer terminal, and a portable device. The display device is used for displaying an image. The wireless presentation gateway is linked to the display device for transmitting image data to the display device. The computer terminal is linked to the wireless presentation gateway for transmitting the image data to the wireless presentation gateway. The portable device is connected to the computer terminal through a communication port for driving the computer terminal, the wireless presentation gateway, and the display device for performing an image display process automatically.

Abstract: A display apparatus has a housing, a base, a system board and a display panel. The base is connected to the housing such that the display apparatus is disposed on a flat surface. The system board is disposed in the housing and has a control system for performing an up-down inversing process for an image transmitted from a signal source. The display panel has a timing controller and a pixel array. Specifically, the display panel is put upside down in the housing such that the pixel array is also upside down, and the timing controller is adjacent to the location connecting the base with the housing. The timing controller is coupled to the system board, to perform a left-right mirroring process for the up-down inversed image.