Abstract: A touch module includes a flexible base, a moisture blocking film and a touch structure. The moisture blocking film has a first surface and a second surface opposite to the first surface, and the first surface directly contacts the flexible base. The touch structure is disposed on the second surface of the moisture blocking film and includes a first conductive layer disposed on the second surface, a first insulating layer disposed on the first conductive layer, a second conductive layer disposed on the first insulating layer and a second insulating layer disposed on the second conductive layer. An area of the moisture blocking film is greater than or equal to the sum of the areas of the touch electrode region and the peripheral circuit region of the touch structure. The water vapor transmission rate of the moisture blocking film is less than 5.0*10?4 g/(m2*day).

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A method and apparatus for dispensing a resist solution used in a semiconductor device manufacturing process senses the presence of air bubbles in the solution during delivery through a line feeding a dispensing pump. Air bubbles in the line are sensed by an optical photocoupler that senses changes in the intensity of light refracted through the solution caused by air bubbles entrapped in the solution. The sensor produces an air bubble indicating signal that can be used to activate an alarm or to stop the dispensing process.

Abstract: The present invention discloses a method and apparatus for eliminating air bubbles from a liquid dispensing line by utilizing an air bubble tank positioned and connected in fluid communication between a liquid reservoir and an electric pump for feeding the liquid. The air bubble tank cumulates air bubbles in an upper portion of the tank cavity and allows a liquid flow which is substantially free of air bubbles to be outputted from an outlet positioned adjacent to the bottom of the tank to a process machine, while the air bubbles are exhausted out of the tank on a predetermined frequency.