Patents by Inventor Shih-Liang Cheng
Shih-Liang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145691Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.Type: ApplicationFiled: March 14, 2023Publication date: May 2, 2024Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
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Patent number: 11792918Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: GrantFiled: November 21, 2021Date of Patent: October 17, 2023Assignee: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng
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Publication number: 20220240368Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: ApplicationFiled: November 21, 2021Publication date: July 28, 2022Inventors: Pei-Wei WANG, Heng-Ming NIEN, Ching-Sheng CHEN, Yi-Pin LIN, Shih-Liang CHENG
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Patent number: 11289413Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.Type: GrantFiled: January 21, 2020Date of Patent: March 29, 2022Assignee: Unimicron Technology Corp.Inventor: Shih-Liang Cheng
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Publication number: 20210175160Abstract: A wiring board and a method of manufacturing the same are provided. The method includes the following steps. A substrate is provided. The substrate is perforated to form at least one through hole. A first conductive layer is integrally formed on a surface of the substrate and an inner wall of the through hole. An etch stop layer is formed on a portion of the first conductive layer on the surface of the substrate and another portion of the first conductive layer on the inner wall of the through hole. A second conductive layer is integrally formed on the etch stop layer and the first conductive layer on the inner wall of the through hole. A plug-hole column is formed by filling with a plugged-hole material in the through hole. The second conductive layer is removed. The etch stop layer is then removed.Type: ApplicationFiled: January 21, 2020Publication date: June 10, 2021Inventor: Shih-Liang CHENG
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Patent number: 10615054Abstract: A method for manufacturing conductive lines is provided. A first metal layer is formed over a carrier substrate. A second metal layer is formed over the first metal layer. A plurality of first conductive lines is formed on the second metal layer. A protective layer is formed on opposite sidewalls of the first conductive lines. An exposed portion of the second metal layer is removed to expose a portion of the first metal layer. The exposed portion of the first metal layer is removed, and the protective layer is removed.Type: GrantFiled: November 21, 2017Date of Patent: April 7, 2020Assignee: UNIMICRON TECHNOLOGY CORP.Inventor: Shih-Liang Cheng
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Publication number: 20190109017Abstract: A method for manufacturing conductive lines is provided. A first metal layer is formed over a carrier substrate. A second metal layer is formed over the first metal layer. A plurality of first conductive lines is formed on the second metal layer. A protective layer is formed on opposite sidewalls of the first conductive lines. An exposed portion of the second metal layer is removed to expose a portion of the first metal layer. The exposed portion of the first metal layer is removed, and the protective layer is removed.Type: ApplicationFiled: November 21, 2017Publication date: April 11, 2019Inventor: Shih-Liang Cheng
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Patent number: 9578742Abstract: A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Thereafter, at least one first hole is formed in the first dielectric layer to expose a portion of the first circuit layer. Then, a second dielectric layer is formed on the first dielectric layer and the first circuit layer. Thereafter, at least one trench and at least one second hole are formed in the second dielectric layer, in which the trench exposes a portion of the first dielectric layer, and the second hole exposes the portion of the first circuit layer. The second hole is disposed in the first hole. Then, a metal layer is formed to fill the trench and the second hole.Type: GrantFiled: August 10, 2015Date of Patent: February 21, 2017Assignee: UNIMICRON TECHNOLOGY CORP.Inventors: Shih-Liang Cheng, Dyi-Chung Hu, Yu-Hua Chen
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Publication number: 20170048973Abstract: A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Thereafter, at least one first hole is formed in the first dielectric layer to expose a portion of the first circuit layer. Then, a second dielectric layer is formed on the first dielectric layer and the first circuit layer. Thereafter, at least one trench and at least one second hole are formed in the second dielectric layer, in which the trench exposes a portion of the first dielectric layer, and the second hole exposes the portion of the first circuit layer. The second hole is disposed in the first hole. Then, a metal layer is formed to fill the trench and the second hole.Type: ApplicationFiled: August 10, 2015Publication date: February 16, 2017Inventors: Shih-Liang CHENG, Dyi-Chung HU, Yu-Hua CHEN
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Patent number: 7066074Abstract: The piston of a fluid motor divides the cylinder into two variable volumes into which and from which fluid may be selectively introduced and exhausted via ports through the cylinder to relatively move the piston and the cylinder. The piston is modified to define two fixed-volume chambers that respectively communicate with the variable volumes via restrictive orifices. In selected relative piston-cylinder positions, the chambers communicate with the ports to restrict fluid flow into and out of the variable volumes and to decrease the velocity of relative piston-cylinder movement. In other relative piston-cylinder positions, the chambers do not communicate with the ports and fluid enters and leaves the variable volumes directly through the ports to relatively move the piston-cylinder at a higher velocity.Type: GrantFiled: December 11, 2003Date of Patent: June 27, 2006Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kun-Tzu Lin, Shih-Liang Cheng, Cheng-Chiang Chuang, Chung-Yu Tsai
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Publication number: 20050126386Abstract: The piston of a fluid motor divides the cylinder into two variable volumes into which and from which fluid may be selectively introduced and exhausted via ports through the cylinder to relatively move the piston and the cylinder. The piston is modified to define two fixed-volume chambers that respectively communicate with the variable volumes via restrictive orifices. In selected relative piston-cylinder positions, the chambers communicate with the ports to restrict fluid flow into and out of the variable volumes and to decrease the velocity of relative piston-cylinder movement. In other relative piston-cylinder positions, the chambers do not communicate with the ports and fluid enters and leaves the variable volumes directly through the ports to relatively move the piston-cylinder at a higher velocity.Type: ApplicationFiled: December 11, 2003Publication date: June 16, 2005Inventors: Kun-Tzu Lin, Shih-Liang Cheng, Cheng-Chiang Chuang, Chung-Yu Tsai