Patents by Inventor Shih-Liang TENG

Shih-Liang TENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact server power supply having high power density
    Patent number: 8724337
    Abstract: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: May 13, 2014
    Assignee: Acbel Polytech Inc.
    Inventors: Shih-Liang Teng, Wei-Liang Lin, Po-Cheng Teng, Kuo-Chu Yeh
  • COMPACT SERVER POWER SUPPLY HAVING HIGH POWER DENSITY
    Publication number: 20110310558
    Abstract: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.
    Type: Application
    Filed: April 20, 2011
    Publication date: December 22, 2011
    Applicant: ACBEL POLYTECH INC.
    Inventors: Shih-Liang TENG, Wei-Liang LIN, Po-Cheng TENG, Kuo-Chu YEH