Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A method for controlling a touch control device includes defining a first area and a second area on a touchpad, detecting whether a touched position on the touchpad that is touched by an operating object falls in the first area or the second area, and calculating the corresponding on-screen coordinates of the operating object with different sets of ratios depending on the touched position.

Abstract: A method for controlling a touch control device includes defining a first area and a second area on a touchpad, detecting whether a touched position on the touchpad that is touched by an operating object falls in the first area or the second area, and calculating the corresponding on-screen coordinates of the operating object with different sets of ratios depending on the touched position.

Abstract: A method for controlling a touch control device includes defining a first area and a second area on a touchpad, detecting whether a touched position on the touchpad that is touched by an operating object falls in the first area or the second area, and calculating the corresponding on-screen coordinates of the operating object with different sets of ratios depending on the touched position.

Abstract: In a speech IC simulation method, a system, a medium and a firmware code generation method, the speech IC simulation method for obtaining a simulation result of a speech IC project includes the steps of establishing and compiling a speech IC project in a wizard interface, setting and displaying a visualized in-circuit emulator (ICE) allocation interactively corresponding to the speech IC project in a visualized allocation interface, and setting and performing the clips and corresponsive system trigger events in a visualized clip editing and event setting interface if a modification of the speech IC project is required. Moreover, the firmware code from compiling the speech IC project may be outputted through an output port such as an USB port or a printer port or recorded in a memory of a circuit emulator.