Patents by Inventor Shih-Wen Lu
Shih-Wen Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240176093Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: February 5, 2024Publication date: May 30, 2024Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
-
Patent number: 11997783Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.Type: GrantFiled: May 27, 2022Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Po-An Lin, Huei-Shyong Cho, Shih-Wen Lu
-
Publication number: 20240162612Abstract: The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Guan-Wei CHEN, Shih-Wen LU
-
Publication number: 20240154642Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
-
Publication number: 20240145941Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Wen LU
-
Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
-
Patent number: 11920157Abstract: Applications of butylidenephthalide (BP), comprising the use of BP in providing a kit for promoting differentiation of stem cells into brown adipose cells, and the use of BP in preparing a medicament, wherein the medicament is used for inhibiting the accumulation of white adipose cells, promoting the conversion of white adipose cells into brown adipose cells, inhibiting weight gain and/or reducing the content of triglycerides, glucose, and total cholesterol in blood.Type: GrantFiled: September 15, 2022Date of Patent: March 5, 2024Assignee: NATIONAL DONG HWA UNIVERSITYInventors: Tzyy-Wen Chiou, Shinn-Zong Lin, Horng-Jyh Harn, Hong-Lin Su, Shih-Ping Liu, Kang-Yun Lu, Jeanne Hsieh
-
Patent number: 11901270Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.Type: GrantFiled: September 2, 2020Date of Patent: February 13, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Shih-Wen Lu
-
Publication number: 20240038678Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.Type: ApplicationFiled: July 29, 2022Publication date: February 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Yu CHEN, Huei-Shyong CHO, Shih-Wen LU
-
Patent number: 11876551Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.Type: GrantFiled: August 19, 2021Date of Patent: January 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shih-Wen Lu, Chun-Jen Chen, Po-Hsiang Tseng, Hsin-Han Lin, Ming-Lun Yu
-
Patent number: 11870152Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.Type: GrantFiled: August 19, 2021Date of Patent: January 9, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Shih-Wen Lu
-
Publication number: 20230389173Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.Type: ApplicationFiled: May 27, 2022Publication date: November 30, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Huei-Shyong CHO, Shih-Wen LU
-
Publication number: 20230327333Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.Type: ApplicationFiled: June 6, 2023Publication date: October 12, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
-
Patent number: 11670846Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.Type: GrantFiled: May 21, 2021Date of Patent: June 6, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shao-En Hsu, Huei-Shyong Cho, Shih-Wen Lu
-
Publication number: 20230055717Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.Type: ApplicationFiled: August 19, 2021Publication date: February 23, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Wen LU
-
Publication number: 20230057327Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.Type: ApplicationFiled: August 19, 2021Publication date: February 23, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
-
Publication number: 20220068774Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.Type: ApplicationFiled: September 2, 2020Publication date: March 3, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Wen LU
-
Publication number: 20210280968Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.Type: ApplicationFiled: May 21, 2021Publication date: September 9, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
-
Patent number: 11108131Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.Type: GrantFiled: August 12, 2019Date of Patent: August 31, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shao-En Hsu, Huei-Shyong Cho, Shih-Wen Lu
-
Patent number: 11018422Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.Type: GrantFiled: June 21, 2019Date of Patent: May 25, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shao-En Hsu, Huei-Shyong Cho, Shih-Wen Lu