Patents by Inventor Shiki Ueki
Shiki Ueki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150370036Abstract: A reflecting mirror for solar radiation collection includes a film mirror and a frame-shaped support member adapted to support a peripheral edge of the film mirror. The film mirror has a film thickness of 0.10 to 0.30 mm, and the support member is in contact with the film mirror and has a curved face which is convexed outward in a horizontal direction with respect to an opening face of the support member, with the curved face having a radius of curvature of not less than 8 mm. The reflecting mirror for solar radiation collection has a good heat resistance, involves less warpage of a film mirror, and predominates in specular reflectivity and light-collecting characteristics.Type: ApplicationFiled: August 13, 2015Publication date: December 24, 2015Applicant: FUJIFILM CorporationInventor: Shiki UEKI
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Publication number: 20150338624Abstract: A reflecting mirror for solar radiation collection includes: a film mirror for solar radiation collection having a polygonal shape and including a resin substrate, a metallic reflective layer and a surface covering layer; and a support member having a frame shape and adapted to support a peripheral edge of the film mirror.Type: ApplicationFiled: August 3, 2015Publication date: November 26, 2015Applicant: FUJIFILM CORPORATIONInventor: Shiki UEKI
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Patent number: 8898895Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.Type: GrantFiled: August 16, 2013Date of Patent: December 2, 2014Assignee: FUJIFILM CorporationInventors: Shiki Ueki, Takeshi Hama, Takeyoshi Kano
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Publication number: 20130326874Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.Type: ApplicationFiled: August 16, 2013Publication date: December 12, 2013Applicant: FUJIFILM CorporationInventors: Shiki UEKI, Takeshi HAMA, Takeyoshi KANO
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Patent number: 8076264Abstract: The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal.Type: GrantFiled: January 11, 2008Date of Patent: December 13, 2011Assignee: FUJIFILM CorporationInventors: Mitsuyuki Tsurumi, Shiki Ueki
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Publication number: 20100273014Abstract: A method for producing a metal-clad substrate, the method including: (a) forming, on a substrate, a resin layer containing a plating catalyst or a precursor thereof, which resin layer satisfies the following requirement 1; and (b) performing plating on the resin layer, Requirement 1: the resin layer contains the plating catalyst or a precursor thereof within a portion extending from a surface to a depth of 25 nm of the resin layer, in an amount in the range of 3×10?20 mol/nm3 to 30×10?20 mol/nm3 in terms of a content of a metal element thereof.Type: ApplicationFiled: December 24, 2008Publication date: October 28, 2010Applicant: FUJIFILM CORPORATIONInventor: Shiki Ueki
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Publication number: 20100190029Abstract: Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.Type: ApplicationFiled: June 9, 2008Publication date: July 29, 2010Applicant: FUJIFILM CORPORATIONInventor: Shiki Ueki
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Publication number: 20100113264Abstract: The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal.Type: ApplicationFiled: January 11, 2008Publication date: May 6, 2010Applicant: FUJIFILM CORPORATIONInventors: Mitsuyuki Tsurumi, Shiki Ueki
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Patent number: 7576036Abstract: A heat-sensitive recording material including at least one heat-sensitive recording layer and a protective layer provided in this order on a support, wherein the protective layer contains a compound represented by the following Formula (1) and/or a compound represented by the following Formula (2), a method for manufacturing the heat-sensitive recording material, and a heat-sensitive recording method using the heat-sensitive recording material provided.Type: GrantFiled: August 2, 2006Date of Patent: August 18, 2009Assignee: FUJIFILM CorporationInventors: Hideo Nagasaki, Hisato Nagase, Toshihide Aoshima, Shiki Ueki
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Publication number: 20070032381Abstract: A heat-sensitive recording material including at least one heat-sensitive recording layer and a protective layer provided in this order on a support, wherein the protective layer contains a compound represented by the following Formula (1) and/or a compound represented by the following Formula (2), a method for manufacturing the heat-sensitive recording material, and a heat-sensitive recording method using the heat-sensitive recording material provided.Type: ApplicationFiled: August 2, 2006Publication date: February 8, 2007Inventors: Hideo Nagasaki, Hisato Nagase, Toshihide Aoshima, Shiki Ueki
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Patent number: 6869908Abstract: The invention provides a thermal recording material, which includes at least one recording layer containing an electron donating dye precursor and an electron accepting compound, and additionally, the recording layer includes a polymerizable compound having an ethylenic unsaturated bond.Type: GrantFiled: December 18, 2002Date of Patent: March 22, 2005Assignee: Fuji Photo Film Co., Ltd.Inventors: Shiki Ueki, Kazumori Minami
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Patent number: 6835692Abstract: The present invention provides a heat-sensitive recording material having a support and a heat-sensitive recording layer, which contains a diazonium salt compound and a coupler compound that reacts with the diazonium salt to develop a color, wherein the recording material contains an oxonol dye.Type: GrantFiled: October 6, 2003Date of Patent: December 28, 2004Assignee: Fuji Photo Film Co., Ltd.Inventors: Kimi Ikeda, Shiki Ueki
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Publication number: 20040121909Abstract: The present invention provides a heat-sensitive recording material having a support and a heat-sensitive recording layer, which contains a diazonium salt compound and a coupler compound that reacts with the diazonium salt to develop a color, wherein the recording material contains an oxonol dye.Type: ApplicationFiled: October 6, 2003Publication date: June 24, 2004Applicant: FUJI PHOTO FILM CO., LTD.Inventors: Kimi Ikeda, Shiki Ueki
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Patent number: 6703344Abstract: The invention provides a thermal recording material comprising a support and at least one thermal recording layer disposed on the support, wherein the layer comprises at least one electron-accepting compound, and microcapsules, which encapsulate an electron-donating dye precurser and are formed using a compound represented by the following general formula (I) and a compound represented by the following general formula Formula (II): wherein each of R1 and R2 represents an alkyl group; n is an integer selected from 0 to 3; and M represents Na, Mg, K or Ca.Type: GrantFiled: June 18, 2002Date of Patent: March 9, 2004Assignee: Fuji Photo Film Co., Ltd.Inventors: Shiki Ueki, Kazumori Minami
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Publication number: 20030186808Abstract: The invention provides a thermal recording material, which includes at least one recording layer containing an electron donating dye precursor and an electron accepting compound, and additionally, the recording layer includes a polymerizable compound having an ethylenic unsaturated bond.Type: ApplicationFiled: December 18, 2002Publication date: October 2, 2003Applicant: FUJI PHOTO FILM CO., LTD.Inventors: Shiki Ueki, Kazumori Minami
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Publication number: 20030013608Abstract: The invention provides a thermal recording material comprising a support and at least one thermal recording layer disposed on the support, wherein the layer comprises at least one electron-accepting compound, and microcapsules, which encapsulate an electron-donating dye precurser and are formed using a compound represented by the following general formula (I) and a compound represented by the following general formula Formula (II): 1Type: ApplicationFiled: June 18, 2002Publication date: January 16, 2003Applicant: FUJI PHOTO FILM CO., LTD.Inventors: Shiki Ueki, Kazumori Minami