Patents by Inventor Shimoji Teruaki

Shimoji Teruaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
    Patent number: 8946911
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: February 3, 2015
    Assignee: Samsung Electro-Machanics Co., Ltd.
    Inventors: Jung Youn Pang, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
  • ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    Publication number: 20140087205
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Application
    Filed: December 6, 2012
    Publication date: March 27, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Youn PANG, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
  • CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140069694
    Abstract: A circuit board includes a circuit pattern formed on a substrate, a first solder resist layer formed on the circuit pattern, an electroless plating layer formed on the circuit pattern on which the first solder resist layer is opened, and a second solder resist layer formed on the first solder resist layer, and a method for manufacturing the same. According to certain embodiments, it is possible to cover a portion which has vulnerable plating quality due to solder resist residue or insufficient wetting around an edge of an existing solder resist layer by including an additional solder resist layer on a surface-treated plating layer. Further, it is possible to protect an undercut portion under the solder resist layer by forming the additional solder resist layer.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 13, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Min CHO, Eun Heay Iee, Jung Youn Pang, Shimoji Teruaki, Chi Seong Kim