Abstract: A reflector interconnect having a front surface and a back surface is disclosed. The reflector interconnect comprises at least two segments of a reflector valve metal and at least one segment of an oxide of the reflector valve metal, wherein the at least two segments of the reflector valve metal are electrically isolated from each other by the at least one segment of the oxide of the reflector valve metal. The reflector interconnect is configured to support one or more electric components attached on the front surface in direct thermal contact with the reflector interconnect. The reflector interconnect is curved so that electromagnetic radiation radiated by at least one of the one or more electric components is reflected from the front surface and focused to a beam.

Abstract: A reflector interconnect having a front surface and a back surface is disclosed. The reflector interconnect comprises at least two segments of a reflector valve metal and at least one segment of an oxide of the reflector valve metal, wherein the at least two segments of the reflector valve metal are electrically isolated from each other by the at least one segment of the oxide of the reflector valve metal. The reflector interconnect is configured to support one or more electric components attached on the front surface in direct thermal contact with the reflector interconnect. The reflector interconnect is curved so that electromagnetic radiation radiated by at least one of the one or more electric components is reflected from the front surface and focused to a beam.

Abstract: There is provided herein an electrical cross-over comprising: a substrate having an upper surface and a lower surface; an electrically-conductive valve metal area extending from said upper surface to said lower surface; an electrical isolation structure extending from said upper surface to said lower surface and encompassing said electrically conductive area; a first electrically-conductive trace formed on a first electrical isolation area and at least traversing said electrically-conductive crossing area, and at least two second electrically-conductive traces each one of said at least two electrically-conductive traces is at least partially formed on a corresponding second electrical isolation area, wherein said each one of said at least second electrically-conductive traces at least partially extends into said crossing area thereby generating electrical conductivity between said at least two second electrically-conductive traces and said first electrically-conductive trace is electrically isolated from said

Abstract: A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped cavity (or cavities) to house the diode die(s). The reflector cavity walls can optionally be plated with a reflective material and may include a molding material to serve as lens and sealant. Also described is a method for building a substrate with direct metal connection of low thermal path between a die and a bottom surface of the substrate. Another embodiment is for two electrical traces crossing each other without the need for a two layer interconnect structure. The substrate and reflector structures are built of aluminum—aluminum oxide composition applying a technology known in the art as ALOX technology. The resulting substrate and packaging afford the required electrical interconnections and enhanced thermal performance while maintaining excellent mechanical properties.

Abstract: A method of anodizing comprising anodizing at least a portion of a valve metal base to a depth of at least 200 ?m.

Abstract: A method of enhancing thermal management of an electronic device comprising the steps of; forming an ALOX™ interconnect substrate; taking an electronic device; and interconnecting the electronic device to the interconnect substrate to yield a substantial split of thermal and electrical paths in the interconnect substrate.

Abstract: A method of forming an insulator that passes through a metal substrate (302) comprising: anodizing a region (312a, 312b, 314,316a, 316b, 318, 320a, 320b, 322, 324a, 324b) of the substrate to form the insulator; illuminating the region with light (330); and determining if the light passes through the substrate at the region to determine if the insulator passes completely through the substrate.

Abstract: The present invention is for substrates for use in interposes for electronic packaging purposes. One preferred embodiment of the present invention is a substrate for use in a Spring Connector Matrix (SCM) interposer having an array of electrically insulated spring connectors each having a fixed end portion and a floating end portion resiliently flexibly coupled to its associated fixed end portion and capable of being independently displaceable in a plane substantially perpendicular to the SCM interposer's major surfaces. Another preferred embodiment of the present invention is a substrate intended to be folded along one or more predetermined fold lines or forming a 3D interposer. Folding is intended at wings which may be wholly formed of valve metal material or may include one or more electrically insulated valve metal traces electrically connected to one or more interconnect regions intended for ICs either single or double sided mounted thereon.

Abstract: A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is described. The substrate includes an integral reflector(s) for the diode(s) in the form of a shaped cavity (or cavities) to house the diode die(s). The reflector cavity walls can optionally be plated with a reflective material and may include a molding material to serve as lens and sealant. Also described is a method for building a substrate with direct metal connection of low thermal path between a die and a bottom surface of the substrate. Another embodiment is for two electrical traces crossing each other without the need for a two layer interconnect structure. The substrate and reflector structures are built of aluminum-aluminum oxide composition applying a technology known in the art as ALOX technology. The resulting substrate and packaging afford the required electrical interconnections and enhanced thermal performance while maintaining excellent mechanical properties.

Abstract: The present invention is for substrates for use in interposers for electronic packaging purposes. One preferred embodiment of the present invention is a substrate for use in a Spring Connector Matrix (SCM) interposer having an array of electrically insulated spring connectors each having a fixed end portion and a floating end portion resiliently flexibly coupled to its associated fixed end portion and capable of being independently displaceable in a plane substantially perpendicular to the SCM interposer's major surfaces. Another preferred embodiment of the present invention is a substrate intended to be folded along one or more predetermined fold lines for forming a 3D interposer. Folding is intended at wings which may be wholly formed of valve metal material or may include one or more electrically insulated valve metal traces electrically connected to one or more interconnect regions intended for ICs either single or double sided mounted thereon.

Abstract: A device (1,21,28, 36, 37, 86, 103, 121, 128) for electronic packaging, the device including a discrete solid body having a pair of opposing generally parallel major surfaces, the solid body having a body portion of a porous valve metal oxide based material with a pair of exterior surfaces respectively constituting portions of the major surfaces and extending inward from one major surface towards the other major surface, the body portion having one or more electrically insulated valve metal conductive traces of from about 10 &mgr;m to about 400 &mgr;m thickness in a direction from one major surface to the other major surface embedded therein, one or more of said traces having a trace portion divergingly extending inward from an exterior surface constituting a portion of one of said major surfaces.

Abstract: A substrate for electronic packaging, the substrate having a discrete, generally prismatoid, initially electrically conductive valve metal solid body with one or more spaced apart, original valve metal vias each individually electrically islolated by a porous oxidized body portion therearound. A pin jig fixture for mechanically masking a metal surface, the pin jig fixture having an anodization resistant bed of pins each pin having a leading end surface for intimate juxtaposition against a metal surface to mask portions thereof.

Abstract: A method for manufacturing of a composite microelectronic structure with improved planarity of layers thereof.The method comprises masking of selected portion of electrically conductive layers with subsequent selective electrochemical anodic oxidation thereof and removing the mask.A composite structure, in particular MCM-D's manufactured by this method has improved connectivity density and performances.