Patents by Inventor Shin-Chung HSIEH

Shin-Chung HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD MODULE AND METHOD FOR REINFORCING STRUCTURE THEREOF
    Publication number: 20090116201
    Abstract: A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of the circuit board module is also disclosed.
    Type: Application
    Filed: June 17, 2008
    Publication date: May 7, 2009
    Inventor: Shin-Chung HSIEH