Abstract: An analysis apparatus or the like capable of supplying content appropriate for a learner is supplied. An analysis apparatus includes: a content provision unit that supplies a learner with content including an examination question; an acquisition unit that acquires emotion data regarding learning of the learner for which an emotion analysis has been performed on face image data of the learner who learns using the content; a reception unit that receives a response of the learner to the examination question; and a content control unit that controls subsequent content based on the acquired emotion data and a result of the response.

Abstract: A switch in a communication network comprises a controller for controlling a communication flow in the communication network. A suspected flow is a communication flow suspected of being related to a DDoS (Distributed Denial of Service) attack. A normal flow is a communication flow other than the suspected flow. The controller is configured to execute provisional handling when receiving a provisional handling instruction indicating identification information of the suspected flow from a network controller. The provisional handling includes processing of setting a priority of the suspected flow to a designated priority, and processing of setting a priority of the normal flow higher than the designated priority.

Abstract: An object is to provide a technique of forming CpG oligonucleotides and hydrophobized polysaccharides into complexes. This object is achieved by a complex comprising a modified CpG oligonucleotide containing a hydrophobic group A having a sterol skeleton, and a modified polysaccharide containing a hydrophobic group B.

Abstract: The present invention enables shortening the time required for resuming communication in a protection method that uses a backup path in an optical communication system that includes a master station device and multiple slave station devices. The slave station devices are connected to a loop path in parallel. The communication paths between the master station device and the slave station devices include a normal path and a backup path. First and second slave station devices are slave station devices that cannot perform communication via the normal path. The magnitude relationship between backup path RTTs is opposite to the magnitude relationship between normal path RTTs. If the second normal path RTT for the second slave station device is longer than the first normal path RTT for the first slave station device, the first backup path RTT is longer than the second backup path RTT, and the second backup path RTT is shorter than the first backup path RTT.

Abstract: A silicon carbide substrate capable of stably forming a device of excellent performance, and a method of manufacturing the same are provided. A silicon carbide substrate is made of a single crystal of silicon carbide, and has a width of not less than 100 mm, a micropipe density of not more than 7 cm?2, a threading screw dislocation density of not more than 1×104 cm?2, a threading edge dislocation density of not more than 1×104 cm?2, a basal plane dislocation density of not more than 1×104 cm?2, a stacking fault density of not more than 0.1 cm?1, a conductive impurity concentration of not less than 1×1018 cm?3, a residual impurity concentration of not more than 1×1016 cm?3, and a secondary phase inclusion density of not more than 1 cm?3.

Abstract: A crystal growth apparatus includes: a chamber including a gas inlet, a gas outlet, a welded portion, and a water-cooling portion configured to water-cool a portion at least including the welded portion; an exhaust pump connected to the gas outlet; a dew point instrument disposed between the gas outlet and the exhaust pump, the dew point instrument being configured to measure a dew point of gas passing through the gas outlet.

Abstract: A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.

Abstract: A device of manufacturing a silicon carbide single crystal includes a crucible, a first resistive heater, a second resistive heater, and a first support portion. The crucible has a top surface, a bottom surface opposite to the top surface, and a tubular side surface located between the top surface and the bottom surface. The first resistive heater is disposed to face the bottom surface. The second resistive heater is provided to surround the side surface. The first support portion supports the crucible such that the bottom surface is separated from the first resistive heater, and the side surface is separated from the second resistive heater. The first support portion is in contact with at least one of the top surface and the side surface.

Abstract: A crystal growth apparatus includes: a chamber including a gas inlet, a gas outlet, a welded portion, and a water-cooling portion configured to water-cool a portion at least including the welded portion; an exhaust pump connected to the gas outlet; a dew point instrument disposed between the gas outlet and the exhaust pump, the dew point instrument being configured to measure a dew point of gas passing through the gas outlet.

Abstract: A method for manufacturing a silicon carbide single crystal includes: packing a silicon carbide source material into a crucible, the silicon carbide source material having a flowability index of not less than 70 and not more than 100; and sublimating the silicon carbide source material by heating the silicon carbide source material.

Abstract: A crystal growth apparatus includes: a chamber including a gas inlet, a gas outlet, a welded portion, and a water-cooling portion configured to water-cool a portion at least including the welded portion; an exhaust pump connected to the gas outlet; a dew point instrument disposed between the gas outlet and the exhaust pump, the dew point instrument being configured to measure a dew point of gas passing through the gas outlet.

Abstract: A silicon carbide substrate whose majority carrier density is 1×1017 cm?3 or greater is such that a standard deviation of minority carrier lifetime as obtained by ?-PCD analysis is 0.7 ns or less in an area other than an area within a distance of 5 mm from an outer perimeter of a main surface.

Abstract: A silicon carbide substrate includes a carbon-surface-side principal surface and a silicon-surface-side principal surface. The silicon carbide substrate has a diameter of 100 mm or greater and a thickness of 300 ?m or greater. An off angle of the carbon-surface-side principal surface and the silicon-surface-side principal surface relative to a {0001} plane is smaller than or equal to 4°. A nitrogen concentration in the carbon-surface-side principal surface is higher than a nitrogen concentration in the silicon-surface-side principal surface, and a difference in Raman peak shift between the carbon-surface-side principal surface and the silicon-surface-side principal surface is smaller than or equal to 0.2 cm?1.

Abstract: A method for manufacturing a silicon carbide single crystal includes: packing a silicon carbide source material into a crucible, the silicon carbide source material having a flowability index of not less than 70 and not more than 100; and sublimating the silicon carbide source material by heating the silicon carbide source material.

Abstract: A method for manufacturing a silicon carbide single crystal includes: packing a silicon carbide source material into a crucible, the silicon carbide source material having a flowability index of not less than 70 and not more than 100; and sublimating the silicon carbide source material by heating the silicon carbide source material.

Abstract: A method for manufacturing a silicon carbide single crystal includes: packing a silicon carbide source material into a crucible, the silicon carbide source material having a flowability index of not less than 70 and not more than 100; and sublimating the silicon carbide source material by heating the silicon carbide source material.

Abstract: A silicon carbide substrate whose majority carrier density is 1×1017 cm?3 or greater is such that a standard deviation of minority carrier lifetime as obtained by ?-PCD analysis is 0.7 ns or less in an area other than an area within a distance of 5 mm from an outer perimeter of a main surface.

Abstract: A silicon carbide substrate includes a carbon-surface-side principal surface and a silicon-surface-side principal surface. The silicon carbide substrate has a diameter of 100 mm or greater and a thickness of 300 ?m or greater. An off angle of the carbon-surface-side principal surface and the silicon-surface-side principal surface relative to a {0001} plane is smaller than or equal to 4°. A nitrogen concentration in the carbon-surface-side principal surface is higher than a nitrogen concentration in the silicon-surface-side principal surface, and a difference in Raman peak shift between the carbon-surface-side principal surface and the silicon-surface-side principal surface is smaller than or equal to 0.2 cm?1.

Abstract: A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.

Abstract: A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.